Abstract: A method for manufacturing an illuminating device includes steps of: forming an electrical conductive circuit on a metallic substrate, arranging light-emitting elements on the metallic substrate to be electrically connected with the electrical conductive circuit, covering a transparent cap on each of the light-emitting elements, fixing an electrical connector to the metallic substrate to be electrically connected to the electrical conductive circuit, forming a transparent body outside the transparent caps, the metallic substrate and the electrical conductive circuit by means of an over-molding process; forming a lamp cover outside the transparent body, the metallic substrate and the electrical connector by means of an over-molding process. An illuminating device is further provided, thereby prevents the light-emitting elements from suffering damage due to the temperature and pressure of the over-molding process, and increasing the brightness of the light emitted by the light-emitting elements.

Abstract: An assembling structure of an LED lamp module includes an LED lamp base (10) and a heat sink (30). The LED lamp base (10) includes a plastic receptacle (11), an LED light source (12) disposed in the plastic receptacle (11), and a plurality of metal fasteners (20) spaced apart and upright on an outer side surface of the plastic receptacle (11). The heat sink (30) includes has a plurality of openings (42), wherein the LED lamp base (10) is rotatable with respect to the heat sink (30) to make the metal fasteners (20) positioned in the openings (42), respectively and thus, the LED lamp base (10) is combined with the heat sink (30).

Abstract: A method for manufacturing an illuminating device includes steps of: forming an electrical conductive circuit on a metallic substrate, arranging light-emitting elements on the metallic substrate to be electrically connected with the electrical conductive circuit, covering a transparent cap on each of the light-emitting elements, fixing an electrical connector to the metallic substrate to be electrically connected to the electrical conductive circuit, forming a transparent body outside the transparent caps, the metallic substrate and the electrical conductive circuit by means of an over-molding process; forming a lamp cover outside the transparent body, the metallic substrate and the electrical connector by means of an over-molding process. An illuminating device is further provided, thereby prevents the light-emitting elements from suffering damage due to the temperature and pressure of the over-molding process, and increasing the brightness of the light emitted by the light-emitting elements.

Abstract: A method for manufacturing an illuminating device includes steps of: forming an electrical conductive circuit on a metallic substrate, arranging light-emitting elements on the metallic substrate to be electrically connected with the electrical conductive circuit, covering a transparent cap on each of the light-emitting elements, fixing an electrical connector to the metallic substrate to be electrically connected to the electrical conductive circuit, forming a transparent body outside the transparent caps, the metallic substrate and the electrical conductive circuit by means of an over-molding process; forming a lamp cover outside the transparent body, the metallic substrate and the electrical connector by means of an over-molding process. An illuminating device is further provided, thereby prevents the light-emitting elements from suffering damage due to the temperature and pressure of the over-molding process, and increasing the brightness of the light emitted by the light-emitting elements.

Abstract: The present invention provides a mold-making method capable of shortening a procedure of manufacturing a product mold, including steps of: preparing a plastic original mold; processing the original mold to form a preliminary product; assembling the preliminary product and testing the functions of the preliminary product having the original mold; producing a standard mold after testing the functions of the preliminary product; and producing a final mold having a profile and a dimension corresponding to those of the standard mold. By this method, the procedure of developing a mold is shortened, so that the production cost of a mold can be reduced.

Abstract: A method for manufacturing an illuminating device includes steps of: forming an electrical conductive circuit on a metallic substrate, arranging light-emitting elements on the metallic substrate to be electrically connected with the electrical conductive circuit, covering a transparent cap on each of the light-emitting elements, fixing an electrical connector to the metallic substrate to be electrically connected to the electrical conductive circuit, forming a transparent body outside the transparent caps, the metallic substrate and the electrical conductive circuit by means of an over-molding process; forming a lamp cover outside the transparent body, the metallic substrate and the electrical connector by means of an over-molding process. An illuminating device is further provided, thereby prevents the light-emitting elements from suffering damage due to the temperature and pressure of the over-molding process, and increasing the brightness of the light emitted by the light-emitting elements.

Abstract: A light emitting diode package structure includes a substrate (10), LED bare chips (20) and a lens (30). The substrate (10) has an upper surface (11), a lower surface (12) and a side surface (13) between the upper surface (11) and the lower surface (12). The upper surface (11) is provided with a circuit pattern (111). The side surface (13) is provided with a groove (131). The LED bare chips (20) are fixed on the upper surface (11) and electrically connected with the circuit pattern (111). The lens (30) covers the LED bare chips (20), the upper surface (11) and the circuit pattern (111) by an injection molding process so as to be inserted into the groove (131). With this arrangement, the connecting strength between the substrate (10) and the lens (30) can be enhanced, thereby achieving waterproof and anti-electrostatic effects. Further, material cost of the present invention is reduced greatly.

Abstract: A method for manufacturing an illuminating device includes steps of: forming an electrical conductive circuit on a metallic substrate, arranging light-emitting elements on the metallic substrate to be electrically connected with the electrical conductive circuit, covering a transparent cap on each of the light-emitting elements, fixing an electrical connector to the metallic substrate to be electrically connected to the electrical conductive circuit, forming a transparent body outside the transparent caps, the metallic substrate and the electrical conductive circuit by means of an over-molding process; forming a lamp cover outside the transparent body, the metallic substrate and the electrical connector by means of an over-molding process. An illuminating device is further provided, thereby prevents the light-emitting elements from suffering damage due to the temperature and pressure of the over-molding process, and increasing the brightness of the light emitted by the light-emitting elements.

Abstract: A light emitting apparatus including a circuit board (10), at least one light emitting chip (20), an integrated optical cover (30) and a fluorescent layer (40). The light emitting chip (20) is arranged on the circuit board (10). The integrated optical cover (30) has a peripheral wall (31), a top wall (32) and a light guiding post (33). The peripheral wall (31) is arranged around the circuit board (10). The top wall (32) is arranged on the peripheral wall (31). The light guiding post (33) extends from the top wall (32) toward the light emitting chip (20). The light guiding post (33) includes a recess portion (332). The light emitting chip (20) is accommodated in the recess portion (332). The fluorescent layer (40) is arranged between the recess portion (332) and the light emitting chip (20). By using the recess portion (332) and the light emitting chip (20) cooperatively to confine the fluorescent layer (40), the thickness thereof can be controlled to be consistent.

Abstract: The LED package structure of the invention includes a substrate (1), an LED chip (2) mounted on the substrate (1) and a lens (3) covering the LED chip (2). A light penetrable film (4) whose refractive index is between those of the lens (3) and LED chip (2) is formed between the LED chip (2) and lens (3). The light penetrable film (4) is formed on the inner surface of the lens (3) facing the LED chip (2) in advance. The lens (3) is applied with hot pressing while the lens (3) is packaged so as to make the light penetrable film (4) coated on the LED chip (2).

Abstract: A light emitting diode package structure includes a substrate (10), LED bare chips (20) and a lens (30). The substrate (10) has an upper surface (11), a lower surface (12) and a side surface (13) between the upper surface (11) and the lower surface (12). The upper surface (11) is provided with a circuit pattern (111). The side surface (13) is provided with a groove (131). The LED bare chips (20) are fixed on the upper surface (11) and electrically connected with the circuit pattern (111). The lens (30) covers the LED bare chips (20), the upper surface (11) and the circuit pattern (111) by an injection molding process so as to be inserted into the groove (131). With this arrangement, the connecting strength between the substrate (10) and the lens (30) can be enhanced, thereby achieving waterproof and anti-electrostatic effects. Further, material cost of the present invention is reduced greatly.

Abstract: A light emitting apparatus including a circuit board (10), at least one light emitting chip (20), an integrated optical cover (30) and a fluorescent layer (40). The light emitting chip (20) is arranged on the circuit board (10). The integrated optical cover (30) has a peripheral wall (31), a top wall (32) and a light guiding post (33). The peripheral wall (31) is arranged around the circuit board (10). The top wall (32) is arranged on the peripheral wall (31). The light guiding post (33) extends from the top wall (32) toward the light emitting chip (20). The light guiding post (33) includes a recess portion (332). The light emitting chip (20) is accommodated in the recess portion (332). The fluorescent layer (40) is arranged between the recess portion (332) and the light emitting chip (20). By using the recess portion (332) and the light emitting chip (20) cooperatively to confine the fluorescent layer (40), the thickness thereof can be controlled to be consistent.

Abstract: A light emitting diode (LED) packaging method includes the steps of preparing a circuit board (1), a transparent cap (3), and at least one LED material (2), placing the transparent cap (3) on the LED material (2) such that the circuit board (1) is aligned and superimposed, and forming an encapsulation layer (4) having a light pattern on the transparent cap (3) by an in-mold decoration injection molding process. In the in-mold decoration injection molding process, a filling port (511) of a mold (5) is aligned precisely above the LED material (2) to prevent a deviation of the LED material (2) and omit a surface mount technology (SMT) process, so as to integrally form an LED with a light pattern at the same time and achieve good water-resisting and static charge resisting effects.

Abstract: A light emitting diode (LED) packaging method includes the steps of preparing a circuit board (1), a transparent cap (3), and at least one LED material (2), placing the transparent cap (3) on the LED material (2) such that the circuit board (1) is aligned and superimposed, and forming an encapsulation layer (4) having a light pattern on the transparent cap (3) by an in-mold decoration injection molding process. In the in-mold decoration injection molding process, a filling port (511) of a mold (5) is aligned precisely above the LED material (2) to prevent a deviation of the LED material (2) and omit a surface mount technology (SMT) process, so as to integrally form an LED with a light pattern at the same time and achieve good water-resisting and static charge resisting effects.

Abstract: A method for manufacturing an illuminating device includes steps of: forming an electrical conductive circuit on a metallic substrate, arranging light-emitting elements on the metallic substrate to be electrically connected with the electrical conductive circuit, covering a transparent cap on each of the light-emitting elements, fixing an electrical connector to the metallic substrate to be electrically connected to the electrical conductive circuit, forming a transparent body outside the transparent caps, the metallic substrate and the electrical conductive circuit by means of an over-molding process; forming a lamp cover outside the transparent body, the metallic substrate and the electrical connector by means of an over-molding process. An illuminating device is further provided, thereby prevents the light-emitting elements from suffering damage due to the temperature and pressure of the over-molding process, and increasing the brightness of the light emitted by the light-emitting elements.