Patents by Inventor Kuang-chun Chou
Kuang-chun Chou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 7812431Abstract: A leadframe includes a die pad and a plurality of leads corresponding to the die pad. The die pad for supporting a die is formed with a plurality of sides, each of the sides having at least one recess portion and at least one protrusion portion. The leads are substantially coplanar to the die pad. The leads include a plurality of first leads and a plurality of second leads. The first leads extend into the recess portions respectively, and the second leads are aligned with the protrusion portions. The length of the first leads is greater than that of the second leads. The length of wires electrically connecting the die to the leads or the die pad can be adjusted by the sides of the leadframe with the recess portion and the protrusion portion having a dimension corresponding to the leads, so as to save the manufacture cost of the leadframe.Type: GrantFiled: June 5, 2008Date of Patent: October 12, 2010Assignee: Advanced Semiconductor Engineering, Inc.Inventors: Su-Tai Yang, Kuang-Chun Chou, Wen-Chi Cheng
-
Publication number: 20080303128Abstract: A leadframe includes a die pad and a plurality of leads corresponding to the die pad. The die pad for supporting a die is formed with a plurality of sides, each of the sides having at least one recess portion and at least one protrusion portion. The leads are substantially coplanar to the die pad. The leads include a plurality of first leads and a plurality of second leads. The first leads extend into the recess portions respectively, and the second leads are aligned with the protrusion portions. The length of the first leads is greater than that of the second leads. The length of wires electrically connecting the die to the leads or the die pad can be adjusted by the sides of the leadframe with the recess portion and the protrusion portion having a dimension corresponding to the leads, so as to save the manufacture cost of the leadframe.Type: ApplicationFiled: June 5, 2008Publication date: December 11, 2008Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Su-Tai Yang, Kuang-Chun Chou, Wen-Chi Cheng
-
Publication number: 20080263852Abstract: A method for forming a slot on a substrate is disclosed, and provides a two-step process used to firstly form two circular holes on two ends of a predetermined cut area and then form a rectangular hole between the two circular holes by punching. Thus, the friction generated between a punching machine and the substrate during punching can be lowered, so as to prevent glass fiber layers of the substrate from being peeled off, avoid the glass fiber layers from forming burrs, and prevent a metal trace layer of the substrate from being peeled off. Meanwhile, because a portion of the substrate having the metal trace layer is not processed by a milling process, it can prevent the metal trace layer from forming metal burrs.Type: ApplicationFiled: April 23, 2008Publication date: October 30, 2008Inventors: Shih-ching Chang, Kuang-chun Chou, Wu-chang Wang
-
Patent number: 7429342Abstract: A cleaning substrate for cleaning and regenerating a mold is disclosed. The mold is contaminated after repeatedly packaging the semiconductor device by making use of thermosetting resin. At least a protrusion of the substrate can substantially match with and be contained within the edges of the mold cavity of the mold when the cleaning substrate is placed in the mold.Type: GrantFiled: September 15, 2004Date of Patent: September 30, 2008Assignee: Advanced Semiconductor Engineering, Inc.Inventor: Kuang Chun Chou
-
Patent number: 6828002Abstract: The present invention relates to a substrate strip with sides having flanges and recesses. The substrate strip is obtained by cutting a panel where a plurality of substrate strips can be arrayed. The substrate strip comprises a first side and a second side. The first side comprises a plurality of first flanges and a plurality of first recesses defined between the first flanges. The second side comprises a plurality of second flanges and a plurality of second recesses defined between the second flanges. The complementary shapes of the first side and the second side are suitable for arraying the two substrate strips most closely, and the most substrate strips can be cut from the panel. Accordingly, waste of the panel can be avoided. The cost of the panel is enormously slashed and the total cost of manufacture is reduced thereby.Type: GrantFiled: October 10, 2002Date of Patent: December 7, 2004Assignee: Advanced Semiconductor Engineering, Inc.Inventors: Kuang-Chun Chou, Win-Chi Cheng
-
Patent number: 6803089Abstract: A cleaning substrate for cleaning and regenerating a mold is disclosed. The mold is contaminated after repeatedly packaging the semiconductor device by making use of thermosetting resin. At least a protrusion of the substrate can substantially match with and be contained within the edges of the mold cavity of the mold when the cleaning substrate is placed in the mold.Type: GrantFiled: August 15, 2001Date of Patent: October 12, 2004Assignee: Advanced Semiconductor Engineering Inc.Inventor: Kuang Chun Chou
-
Patent number: 6722412Abstract: A die bonder includes a conveyor, a pre-heater, at least one carrier, a paste-dispensing mechanism, a die taking/placing mechanism, and a heater. The conveyor continuously operates in a ring-shaped manner. The carrier is carried on the conveyor to position the substrate. The pre-heater heats the substrate to eliminate the moisture in the substrate. The paste-dispensing mechanism dispenses an adhesive agent onto the substrate. Then, the die taking/placing mechanism places a die onto the substrate at a position where the adhesive agent is dispensed. Finally, the heater is used to cure the adhesive agent so as to bond the die to the substrate.Type: GrantFiled: October 9, 2002Date of Patent: April 20, 2004Assignee: Advanced Semiconductor Engineering, Inc.Inventors: Yao-ting Huang, Kuang-chun Chou
-
Publication number: 20030094241Abstract: A die bonder includes a conveyor, a pre-heater, at least one carrier, a paste-dispensing mechanism, a die taking/placing mechanism, and a heater. The conveyor continuously operates in a ring-shaped manner. The carrier is carried on the conveyor to position the substrate. The pre-heater heats the substrate to eliminate the moisture in the substrate. The paste-dispensing mechanism dispenses an adhesive agent onto the substrate. Then, the die taking/placing mechanism places a die onto the substrate at a position where the adhesive agent is dispensed. Finally, the heater is used to cure the adhesive agent so as to bond the die to the substrate.Type: ApplicationFiled: October 9, 2002Publication date: May 22, 2003Inventors: Yao-Ting Huang, Kuang-Chun Chou
-
Publication number: 20030072913Abstract: The present invention relates to a substrate strip with sides having flanges and recesses. The substrate strip is obtained by cutting a panel where a plurality of substrate strips can be arrayed. The substrate strip comprises a first side and a second side. The first side comprises a plurality of first flanges and a plurality of first recesses defined between the first flanges. The second side comprises a plurality of second flanges and a plurality of second recesses defined between the second flanges. The complementary shapes of the first side and the second side are suitable for arraying the two substrate strips most closely, and the most substrate strips can be cut from the panel. Accordingly, waste of the panel can be avoided. The cost of the panel is enormously slashed and the total cost of manufacture is reduced thereby.Type: ApplicationFiled: October 10, 2002Publication date: April 17, 2003Inventors: Kuang-Chun Chou, Win-Chi Cheng
-
Publication number: 20030034049Abstract: A cleaning substrate for cleaning and regenerating a mold is disclosed. The mold is contaminated after repeatedly packaging the semiconductor device by making use of thermosetting resin. At least a protrusion of the substrate can substantially match with and be contained within the edges of the mold cavity of the mold when the cleaning substrate is placed in the mold.Type: ApplicationFiled: August 15, 2001Publication date: February 20, 2003Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventor: Kuang Chun Chou
-
Patent number: 6118176Abstract: A stacked chip assembly generally includes a first chip, a second chip and a lead frame. The lower surface of the first chip is pasted onto the lower surface of the second chip by an adhesive film so as to form a stacked chip body. The stacked chip body is disposed on the lead frame. Bonding pads of the upper surface of the first chip are interconnected to the upper surface of the inner leads of the lead frame by bonding wires. Bonding pads of the upper surface of the second chip are interconnected to the lower surface of the inner leads of the lead frame by bonding wires. Therefore, the first chip and the second chip are simultaneously interconnected to an external circuit devices through the lead frame.Type: GrantFiled: April 26, 1999Date of Patent: September 12, 2000Assignee: Advanced Semiconductor Engineering, Inc.Inventors: Su Tao, Kuang-Lin Lo, Kuang-Chun Chou, Shih-Chih Chen