Abstract: A method for fabricating an organic light emitting diode. The method forms an anode, an organic emitting layer and a cathode sequentially on a substrate. When the interface between the anode and the organic emitting layer is forming, the depositional rate of the anode on the substrate is decreasing and the deposition rate of the organic emitting layer on the substrate is increasing. When the interface between the organic emitting layer and the cathode is forming, the deposition rate of the organic emitting layer on the substrate is decreasing, and the deposition rate of the cathode on the substrate is increasing. This method can form a hazy heterojunction between the anode, the organic emitting layer and the cathode, thus forming an organic light emitting diode with a hazy heterojunction.

Abstract: A plasma etching device using radio frequency electromagnetic energy to produce the plasma comprises a plasma reaction cavity and a rotary access device; the plasma reaction cavity has a substrate reaction disc and a radio frequency parallel electrode board therein; the substrate reaction disc is circular in shape; the rotary access device is adjacent to the plasma reaction cavity for placing a substrate that requires processing into the plasma reaction connect chamber; the substrate is placed into or removed from the narrow and small sealed connect chamber in the plasma reaction cavity by the rotary access device.

Abstract: A method for fabricating an organic light emitting diode. The method uses a mask to create an anode position by etching on a substrate and forming a plural groove in the substrate. Next, the anode is formed on the bottom of the groove. A dot-matrix type mask is used to form the organic emitting layer over the anode and under a predetermined cathode position. A hole injection layer, hole transport layer and an electron transport layer are formed inside the groove. More particularly, the total thickness of the anode, the organic emitting layer, the hole injection layer, the hole transport layer and the electron transport layer is equal to the depth of the groove to provide a smooth surface of the substrate. Finally, another mask is utilized on the substrate to form a strip shaped cathode, thus completing the fabrication of the organic light emitting diode.

Abstract: A movable evaporation device, arranged in an evaporation system. The evaporation system has an evaporation chamber and a vacuum system. The vacuum system is connected to the evaporation chamber externally. The evaporation chamber has a rotatable wafer table to fix and rotate a wafer during thin film deposition. The movable evaporation device has several movable evaporation boats to carry evaporation source. Each of the evaporation boat further includes an evaporation boat and a movable arm. The moving arm is connected to a bottom of the evaporation chamber. The moving arms can rotate from 0° to 360°, and the length of the moving arms are determined by the amount and position of the evaporation boats in the evaporation chamber.

Abstract: A method for fabricating an organic light emitting diode. The method uses a mask to create an anode position by etching on a substrate and forming a plural groove in the substrate. Next, the anode is formed on the bottom of the groove. A dot-matrix type mask is used to form the organic emitting layer over the anode and under a predetermined cathode position. A hole injection layer, hole transport layer and an electron transport layer are formed inside the groove. More particularly, the total thickness of the anode, the organic emitting layer, the hole injection layer, the hole transport layer and the electron transport layer is equal to the depth of the groove to provide a smooth surface of the substrate. Finally, another mask is utilized on the substrate to form a strip shaped cathode, thus completing the fabrication of the organic light emitting diode.

Abstract: An apparatus for automatically cleaning a mask applied to a mask cleaning step after an evaporation process. An RF plasma is used to clean the mask. By isolating the RF plasma generator, the wafer table and the mask table from the grounded reaction chamber, the RF voltage is supplied to the wafer table and the mask table. The bias generated by the RF voltage during evaporation process can thus be reduced to enhance the efficiency of evaporation. After removing the wafer being performed with the evaporation process, the RF plasma can be used to clean the mask. The mask can thus be fixed on the mask table without being removed or renewing the mask table.

Abstract: A method for fabricating an organic light emitting diode. The method uses a mask to create an anode position by etching on a substrate and forming a plural groove in the substrate. Next, the anode is formed on the bottom of the groove. A dot-matrix type mask is used to form the organic emitting layer over the anode and under a predetermined cathode position. A hole injection layer, hole transport layer and an electron transport layer are formed inside the groove. More particularly, the total thickness of the anode, the organic emitting layer, the hole injection layer, the hole transport layer and the electron transport layer is equal to the depth of the groove to provide a smooth surface of the substrate. Finally, another mask is utilized on the substrate to form a strip shaped cathode, thus completing the fabrication of the organic light emitting diode.

Abstract: A method for fabricating an organic light emitting diode. The method forms an anode, an organic emitting layer and a cathode sequentially on a substrate. When the interface between the anode and the organic emitting layer is forming, the depositional rate of the anode on the substrate is decreasing and the deposition rate of the organic emitting layer on the substrate is increasing. When the interface between the organic emitting layer and the cathode is forming, the deposition rate of the organic emitting layer on the substrate is decreasing, and the deposition rate of the cathode on the substrate is increasing. This method can form a hazy heterojunction between the anode, the organic emitting layer and the cathode, thus forming an organic light emitting diode with a hazy heterojunction.

Abstract: A method for fabricating an organic light emitting diode. The method forms an anode, an organic emitting layer and a cathode sequentially on a substrate. When the interface between the anode and the organic emitting layer is forming, the depositional rate of the anode on the substrate is decreasing and the deposition rate of the organic emitting layer on the substrate is increasing. When the interface between the organic emitting layer and the cathode is forming, the deposition rate of the organic emitting layer on the substrate is decreasing, and the deposition rate of the cathode on the substrate is increasing. This method can form a hazy heterojunction between the anode, the organic emitting layer and the cathode, thus forming an organic light emitting diode with a hazy heterojunction.

Abstract: A supplier of evaporation source material. The evaporation system that uses the source material supplier includes an evaporation chamber and a vacuum extraction system. The vacuum extraction system is connected to the evaporation chamber. The source material supplier, a movable evaporation boat and a wafer holder are housed inside the evaporation chamber. The source material supplier is on one of the sidewalls inside the evaporation chamber. The wafer holder is in the upper portion of the evaporation chamber. The wafer holder is responsible for holding a wafer requiring thin film deposition. The movable evaporation boat is in the lower portion of the evaporation chamber for holding evaporation source material. The source material supplier includes a revolving cassette wheel and a crucible under the cassette wheel. The revolving cassette wheel is partition by separating plates and an outer casing into a plurality of capsules with each capsule capable of holding a fixed amount of evaporation source material.

Abstract: An apparatus for automatically cleaning a mask applied to a mask cleaning step after an evaporation process. An RF plasma is used to clean the mask. By isolating the RF plasma generator, the wafer table and the mask table from the grounded reaction chamber, the RF voltage is supplied to the wafer table and the mask table. The bias generated by the RF voltage during evaporation process can thus be reduced to enhance the efficiency of evaporation. After removing the wafer being performed with the evaporation process, the RF plasma can be used to clean the mask. The mask can thus be fixed on the mask table without being removed or renewing the mask table.

Abstract: A movable evaporation device, arranged in an evaporation system. The evaporation system has an evaporation chamber and a vacuum system. The vacuum system is connected to the evaporation chamber externally. The evaporation chamber has a rotatable wafer table to fix and rotate a wafer during thin film deposition. The movable evaporation device has several movable evaporation boats to carry evaporation source. Each of the evaporation boat further includes an evaporation boat and a movable arm. The moving arm is connected to a bottom of the evaporation chamber. The moving arms can rotate from 0° to 360°, and the length of the moving arms are determined by the amount and position of the evaporation boats in the evaporation chamber.

Abstract: A method for fabricating an organic light emitting diode. The method forms an anode, an organic emitting layer and a cathode sequentially on a substrate. When the interface between the anode and the organic emitting layer is forming, the depositional rate of the anode on the substrate is decreasing and the deposition rate of the organic emitting layer on the substrate is increasing. When the interface between the organic emitting layer and the cathode is forming, the deposition rate of the organic emitting layer on the substrate is decreasing, and the deposition rate of the cathode on the substrate is increasing. This method can form a hazy heterojunction between the anode, the organic emitting layer and the cathode, thus forming an organic light emitting diode with a hazy heterojunction.

Abstract: A method for fabricating an organic light emitting diode. The method uses a mask to create an anode position by etching on a substrate and forming a plural groove in the substrate. Next, the anode is formed on the bottom of the groove. A dot-matrix type mask is used to form the organic emitting layer over the anode and under a predetermined cathode position. A hole injection layer, hole transport layer and an electron transport layer are formed inside the groove. More particularly, the total thickness of the anode, the organic emitting layer, the hole injection layer, the hole transport layer and the electron transport layer is equal to the depth of the groove to provide a smooth surface of the substrate. Finally, another mask is utilized on the substrate to form a strip shaped cathode, thus completing the fabrication of the organic light emitting diode.