Patents by Inventor Kuang-Chung Sun

Kuang-Chung Sun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8542486
    Abstract: An electronic apparatus with improved heat dissipation comprises a first body with a first shell and a second shell, a second body, a coupling device and a linkage device. The first shell is pivotally connected to the second shell to form an accommodation space. The first shell can pivot relative to the second shell to enlarge the accommodation space and form an opening between the first shell and the second shell. The coupling device couples the second body and the second shell to pivot the second body relative to the second shell to expose or hide the first shell. The linkage device drives the first shell to pivot relative to the second shell. When the second body pivots relative to the second shell toward a first direction, the linkage device drives the first shell to pivot relative to the second shell toward a second direction opposite to the first direction.
    Type: Grant
    Filed: January 28, 2011
    Date of Patent: September 24, 2013
    Assignee: Inventec Corporation
    Inventors: Wei-Yi Lin, Li-Ting Wang, Kuang-Chung Sun, Ting-Chiang Huang, Feng-Ku Wang
  • Publication number: 20120127652
    Abstract: An electronic apparatus with improved heat dissipation comprises a first body with a first shell and a second shell, a second body, a coupling device and a linkage device. The first shell is pivotally connected to the second shell to form an accommodation space. The first shell can pivot relative to the second shell to enlarge the accommodation space and form an opening between the first shell and the second shell. The coupling device couples the second body and the second shell to pivot the second body relative to the second shell to expose or hide the first shell. The linkage device drives the first shell to pivot relative to the second shell. When the second body pivots relative to the second shell toward a first direction, the linkage device drives the first shell to pivot relative to the second shell toward a second direction opposite to the first direction.
    Type: Application
    Filed: January 28, 2011
    Publication date: May 24, 2012
    Applicant: INVENTEC CORPORATION
    Inventors: Wei-Yi LIN, Li-Ting WANG, Kuang-Chung SUN, Ting-Chiang HUANG, Feng-Ku WANG
  • Publication number: 20120127662
    Abstract: An electronic apparatus and a keyboard supporting module thereof are provided. The electronic apparatus includes a heat source, the keyboard supporting module and a push-button key module. The keyboard supporting module includes a keyboard supporting structure and an insulator. The keyboard supporting structure is thermally connected to the heat source. Particularly, the keyboard supporting structure supports the push-button key module with the insulator.
    Type: Application
    Filed: December 30, 2010
    Publication date: May 24, 2012
    Applicant: INVENTEC CORPORATION
    Inventors: Kuang-Chung SUN, Wei-Yi LIN, Li-Ting WANG, Ting-Chiang HUANG, Feng-Ku WANG
  • Publication number: 20110075369
    Abstract: An electronic device including a heat generation element, a heat dissipation plate, and a heat pipe is provided. The heat dissipation plate includes a top surface, a bottom surface, a pair of longitudinal side surfaces, and a pair of lateral side surfaces including a third side surface and a fourth side surface. The longitudinal side surfaces include first and second side surfaces. The lateral side surfaces include third and fourth side surfaces. The first, second, third and fourth side surfaces are connected to both the top surface and the bottom surface. The heat pipe is disposed in contact with the heat dissipation plate, and the heat pipe and the heat generation element are disposed on the bottom surface of the heat dissipation plate. The heat pipe is disposed on the heat dissipation plate and extension of the heat pipe is not beyond the first, second, third and fourth side surfaces.
    Type: Application
    Filed: January 8, 2010
    Publication date: March 31, 2011
    Applicant: INVENTEC CORPORATION
    Inventors: Kuang-Chung Sun, Ting-Chiang Huang, Chiun-Peng Chen, Chih-Kuang Chung, Sheng-Chieh Hsu, Wei-Yi Lin