Patents by Inventor Kuang-Han Chang

Kuang-Han Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11921101
    Abstract: Disclosed are calibration techniques that can be implemented by a device that conducts biological tests. In certain embodiments, the device for testing a biological specimen includes a receiving mechanism to receive a carrier, a camera module arranged to capture imagery of the carrier, and a processor. Some examples of the processor can detect a calibration mode trigger. In calibration mode, the processor can divide the captured imagery into segments and selectively perform one or more calibration procedures for each segment. Then, the processor records a calibration result for each segment.
    Type: Grant
    Filed: January 25, 2022
    Date of Patent: March 5, 2024
    Assignee: Bonraybio Co., Ltd.
    Inventors: Cheng-Teng Hsu, Chih-Pin Chang, Kuang-Li Huang, Yu-Chiao Chi, Chia-Wei Chang, Chiung-Han Wang
  • Patent number: 11694972
    Abstract: A semiconductor package includes a substrate, a semiconductor die mounted on the substrate, and a heatsink over the semiconductor die. The heatsink includes a roof portion and at least one connecting portion extending between the roof portion and the substrate. The at least one connecting portion includes a connection lead mounted on a connection pad of the substrate. The connection pad includes a first portion and a second portion spaced apart from each other, which are configured to electrically couple to different voltage signals, respectively, for detecting heatsink floating.
    Type: Grant
    Filed: June 2, 2021
    Date of Patent: July 4, 2023
    Assignee: MEDIATEK INC.
    Inventors: Kuang-Han Chang, Yu-Liang Hsiao, Chih-An Yang
  • Publication number: 20210384142
    Abstract: A semiconductor package includes a substrate, a semiconductor die mounted on the substrate, and a heatsink over the semiconductor die. The heatsink includes a roof portion and at least one connecting portion extending between the roof portion and the substrate. The at least one connecting portion includes a connection lead mounted on a connection pad of the substrate. The connection pad includes a first portion and a second portion spaced apart from each other, which are configured to electrically couple to different voltage signals, respectively, for detecting heatsink floating.
    Type: Application
    Filed: June 2, 2021
    Publication date: December 9, 2021
    Inventors: Kuang-Han Chang, Yu-Liang Hsiao, Chih-An Yang