Abstract: A two-phase microchannel heat sink can be a fluid channel including a bottom wall including a superhydrophilic surface with microstructures and a side wall including a surface that is hydrophobic relative to the superhydrophilic surface of the bottom wall. When heat flux is applied to the fluid channel, a liquid film on the bottom wall is maintained and nucleation of boiling occurs only on the side wall.

Abstract: Some embodiments relate to an electronic package. The electronic package includes a first die and a second die stacked onto the first die. A first encapsulant is positioned between the first die and the second die. The first encapsulant includes a first material that covers a first volume between the first die and the second die. A second encapsulant is positioned between the first die and the second die. The second encapsulant includes a second material that covers a second volume between the first die and the second die. The first material has a higher thermal conductivity than the second material, and the second material more effectively promotes electrical connections between the first die and the second die as compared to the first material.

Abstract: Some embodiments relate to an electronic package. The electronic package includes a first die and a second die stacked onto the first die. A first encapsulant is positioned between the first die and the second die. The first encapsulant includes a first material that covers a first volume between the first die and the second die. A second encapsulant is positioned between the first die and the second die. The second encapsulant includes a second material that covers a second volume between the first die and the second die. The first material has a higher thermal conductivity than the second material, and the second material more effectively promotes electrical connections between the first die and the second die as compared to the first material.

Abstract: A two-phase microchannel heat sink can be a fluid channel including a bottom wall including a superhydrophilic surface with microstructures and a side wall including a surface that is hydrophobic relative to the superhydrophilic surface of the bottom wall. When heat flux is applied to the fluid channel, a liquid film on the bottom wall is maintained and nucleation of boiling occurs only on the side wall.

Abstract: An apparatus for driving a fluid includes a substrate, at least one electrode group and a controlling unit. The substrate has at least one plane. The electrode group is disposed on the substrate and includes a first electrode, a second electrode and a third electrode. A projecting position of the second electrode on the plane is disposed between that of the first electrode and that of the third electrode. The controlling unit electrically connected to electrode group is for driving the first to third electrodes. When the controlling unit drives the first to third electrodes to make the first and third electrodes have opposite polarities and to make the second and third electrodes have the same polarity, an electric field produced by the electrode group enables the fluid on the substrate to flow from the first electrode to the third electrode.