Abstract: A method of forming a semiconductor structure includes the following operations. A semiconductor epitaxial layer is formed on a first semiconductor substrate. A first side of the semiconductor epitaxial layer is adhered to a transfer substrate by an adhesive layer covering the first side of the semiconductor epitaxial layer. The semiconductor epitaxial layer and the first semiconductor substrate are turned over by the transfer substrate. The first semiconductor substrate is removed to expose a second side of the semiconductor epitaxial layer opposite to the first side. A first semiconductor doped region is formed on the second side of the semiconductor epitaxial layer. After the first semiconductor doped region is formed, the adhesive layer and the transfer substrate are removed.

Abstract: A method of handover is provided. It includes: performing a mobile base station tracking area update procedure; performing a mobile device tracking area update procedure; transmitting a mobile base station identity of the mobile base station to a mobile device mobility management entity corresponding to the mobile device by a fixed base station; transmitting a request for setting the mobile base station ID to the mobile device by the MD mobility management entity; writing the mobile device ID into a mobile network ID list of the mobile device by the mobile device; when the mobile device receives from the fixed base station a handover message indicating the mobile device to hand over to the mobile base station and the mobile device determines the mobile network ID list includes the mobile base station ID of the mobile base station, then, the mobile device hands over to the mobile base station.