Patents by Inventor Kuang-Hsing Liu

Kuang-Hsing Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20050133165
    Abstract: A chemical vapor deposition apparatus for titanium-nitride application that is useful for preventing contaminants caused by arching between a substantially planar substrate and a substrate supporting apparatus during the deposition cycle. The apparatus includes a chemical vapor deposition chamber having a substrate-supporting heater. An annular housing supported by the heater, and a conductive strap that connectively secures the substrate-supporting heater to the annular housing by using holes instead of conventional slots. The conductive strap is designed as a flexure to flex with process temperature changes to improve electrical connectivity at its terminal connection and to prevent degradation. The annular housing has a top and a bottom surface and a cylindrical wall extending peripherally below the surfaces. The cylindrical wall encircles an isolator ring.
    Type: Application
    Filed: December 23, 2003
    Publication date: June 23, 2005
    Inventors: Kuang-Hsing Liu, Peter Chi, Yo-Cheng Hsueh, Jason Wu, Jiang-He Xie, Jake Chang, Wen-Hsing Liang, Hung-Cheng Chen, Kuo-Wen Chen, Feng-Shih Chiu
  • Patent number: 6660125
    Abstract: A new method is provided for the removal of metal residue or nodules from surfaces that are target surfaces during the process of metal sputtering. A polishing bit is applied in a rotating manner to a surface on which nodules have been formed, this application removes the nodules from the target surface and prepares the surface for further processing steps.
    Type: Grant
    Filed: December 31, 2001
    Date of Patent: December 9, 2003
    Assignee: Taiwan Semiconductor Manufacturing Company
    Inventors: Ming-Tsong Wang, Chung-En Kao, Kuang-Hsing Liu, Ta-Bin Chen
  • Publication number: 20020127861
    Abstract: A new method is provided for the removal of metal residue or nodules from surfaces that are target surfaces during the process of metal sputtering. A polishing bit is applied in a rotating manner to a surface on which nodules have been formed, this application removes the nodules from the target surface and prepares the surface for further processing steps.
    Type: Application
    Filed: December 31, 2001
    Publication date: September 12, 2002
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
    Inventors: Ming-Tsong Wang, Chung-En Kao, Kuang-Hsing Liu, Ta-Bin Chen
  • Patent number: 6358851
    Abstract: A new method is provided for the removal of metal residue or nodules from surfaces that are target surfaces during the process of metal sputtering. A polishing bit is applied in a rotating manner to a surface on which nodules have been formed, this application removes the nodules from the target surface and prepares the surface for further processing steps.
    Type: Grant
    Filed: April 4, 2000
    Date of Patent: March 19, 2002
    Assignee: Taiwan Semiconductor Manufacturing Company
    Inventors: Ming-Tsong Wang, Chung-En Kao, Kuang-Hsing Liu, Ta-Bin Chen
  • Patent number: 5783248
    Abstract: A process is provided for producing a bioceramic composite in which an alumina based ceramic substrate is coated with an intermediate calcium pyrophosphate layer to cement a porous calcium phosphate material to the alumina based ceramic substrate. In one aspect of the invention, the porous calcium phosphate material is a porous lattice made from natural bone. A bioceramic composite which includes an alumina-based ceramic substrate, an intermediate calcium pyrophosphate layer and a porous natural bone material bonded to the intermediate calcium pyrophosphate layer is also disclosed.
    Type: Grant
    Filed: August 28, 1995
    Date of Patent: July 21, 1998
    Assignee: National Science Council of R.O.C.
    Inventors: Ruey-Mo Lin, Nan-Chung Wu, Kuang-Hsing Liu