Patents by Inventor Kuang-Hsuan Chiu

Kuang-Hsuan Chiu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240086611
    Abstract: Systems, methods and devices are provided, which can include an engineering change order (ECO) base. A base layout cell includes metal layer regions, conductive gate patterns arranged above metal layer regions; oxide definition (OD) patterns, metal-zero layer over oxide-definition (metal-zero) patterns, at least one cut metal layer (CMD) pattern; and at least one via region. The base layout cell can be implemented in at least two non-identical functional cells. A first functional cell of the at least two non-identical functional cells includes first interconnection conductive patterns arranged connecting metal-zero structures corresponding to at least two metal-zero patterns in a first layout, and a second functional cell of the at least two non-identical functional cells includes second interconnection conductive patterns arranged connecting metal-zero structures corresponding to at least two metal-zero patterns in a second layout.
    Type: Application
    Filed: November 20, 2023
    Publication date: March 14, 2024
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Shang-Hsuan Chiu, Chih-Liang Chen, Hui-Zhong Zhuang, Chi-Yu Lu, Kuang-Ching Chang
  • Publication number: 20090066349
    Abstract: A probe system including a body, a testing apparatus, a probe card, and a strengthening mechanism is provided. The testing apparatus is disposed above the body. The probe card is disposed between the testing apparatus and the body. The strengthening mechanism is disposed between the probe card and the testing apparatus to have the probe card leaned against it. The strengthening mechanism has at least one elastic element.
    Type: Application
    Filed: January 30, 2008
    Publication date: March 12, 2009
    Applicant: POWERCHIP SEMICONDUCTOR CORP.
    Inventors: Fan-Hsien Hsu, Kuang-Hsuan Chiu, Li-Tien Yang, Yu-Hsin Liu