Patents by Inventor Kuang-Huan Hsu
Kuang-Huan Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240136213Abstract: In an embodiment, a system, includes: a first pressurized load port interfaced with a workstation body; a second pressurized load port interfaced with the workstation body; the workstation body maintained at a set pressure level, wherein the workstation body comprises an internal material handling system configured to move a semiconductor workpiece within the workstation body between the first and second pressurized load ports at the set pressure level; a first modular tool interfaced with the first pressurized load port, wherein the first modular tool is configured to process the semiconductor workpiece; and a second modular tool interfaced with the second pressurized load port, wherein the second modular tool is configured to inspect the semiconductor workpiece processed by the first modular tool.Type: ApplicationFiled: January 3, 2024Publication date: April 25, 2024Inventors: Chun-Jung HUANG, Yung-Lin HSU, Kuang Huan HSU, Jeff CHEN, Steven HUANG, Yueh-Lun YANG
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Patent number: 11901206Abstract: In an embodiment, a system, includes: a first pressurized load port interfaced with a workstation body; a second pressurized load port interfaced with the workstation body; the workstation body maintained at a set pressure level, wherein the workstation body comprises an internal material handling system configured to move a semiconductor workpiece within the workstation body between the first and second pressurized load ports at the set pressure level; a first modular tool interfaced with the first pressurized load port, wherein the first modular tool is configured to process the semiconductor workpiece; and a second modular tool interfaced with the second pressurized load port, wherein the second modular tool is configured to inspect the semiconductor workpiece processed by the first modular tool.Type: GrantFiled: February 1, 2023Date of Patent: February 13, 2024Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chun-Jung Huang, Yung-Lin Hsu, Kuang Huan Hsu, Jeff Chen, Steven Huang, Yueh-Lun Yang
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Publication number: 20230411193Abstract: When there is an interruption in power to an area of an integrated circuit manufacturing facility, product may be stranded in a vehicle mounted to an automated material handling system. An automated rescue vehicle can be deployed to retrieve the stranded vehicle so that a payload carried by that vehicle can be recovered and processing can resume. The rescue vehicle can carry a battery payload. The battery payload provides backup power while the rescue operation is performed. With such an automated system, no human intervention is needed to recover product during a power outage. In addition to improving wafer throughput during the power outage, such a rescue operation may prevent quality degradation for time-critical sequences of processing operations.Type: ApplicationFiled: June 17, 2022Publication date: December 21, 2023Inventors: Chun-Jung HUANG, Y.Y. LEE, Kuang Huan HSU, Li-Hsin CHU, Jen-Ti WANG, Chieh HSU
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Publication number: 20230230839Abstract: The present disclosure describes a system and a method for an ion implantation (IMP) process. The system includes an ion implanter configured to scan an ion beam over a target for a range of angles, a tilting mechanism configured to support and tilt the target, an ion-collecting device configured to collect a distribution and a number of ejected ions from the ion beam scan over the target, and a control unit configured to adjust a tilt angle based on a correction angle determined based on the distribution and number of ejected ions.Type: ApplicationFiled: March 27, 2023Publication date: July 20, 2023Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chun-Jung HUANG, Li-Hsin CHU, Po-Feng TSAI, Henry PENG, Kuang Huan HSU, Tsung Wei CHEN, Yung-Lin HSU
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Publication number: 20230178401Abstract: In an embodiment, a system, includes: a first pressurized load port interfaced with a workstation body; a second pressurized load port interfaced with the workstation body; the workstation body maintained at a set pressure level, wherein the workstation body comprises an internal material handling system configured to move a semiconductor workpiece within the workstation body between the first and second pressurized load ports at the set pressure level; a first modular tool interfaced with the first pressurized load port, wherein the first modular tool is configured to process the semiconductor workpiece; and a second modular tool interfaced with the second pressurized load port, wherein the second modular tool is configured to inspect the semiconductor workpiece processed by the first modular tool.Type: ApplicationFiled: February 1, 2023Publication date: June 8, 2023Inventors: Chun-Jung HUANG, Yung-Lin HSU, Kuang Huan HSU, Jeff CHEN, Steven HUANG, Yueh-Lun YANG
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Patent number: 11626315Abstract: A planarization method includes forming a dielectric layer over a polish stop layer. The dielectric layer is polished until reaching the polish stop layer, and the polished dielectric layer has a concave top surface. A compensation layer is formed over the concave top surface. The compensation layer is polished.Type: GrantFiled: February 22, 2017Date of Patent: April 11, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Chun-Jung Huang, Hsu-Shui Liu, Han-Wen Liao, Yu-Yao Huang, Hsiao-Wei Chen, Yung-Lin Hsu, Kuang-Huan Hsu
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Patent number: 11615961Abstract: The present disclosure describes a system and a method for an ion implantation (IMP) process. The system includes an ion implanter configured to scan an ion beam over a target for a range of angles, a tilting mechanism configured to support and tilt the target, an ion-collecting device configured to collect a distribution and a number of ejected ions from the ion beam scan over the target, and a control unit configured to adjust a tilt angle based on a correction angle determined based on the distribution and number of ejected ions.Type: GrantFiled: November 18, 2021Date of Patent: March 28, 2023Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chun-Jung Huang, Li-Hsin Chu, Po-Feng Tsai, Henry Peng, Kuang Huan Hsu, Tsung Wei Chen, Yung-Lin Hsu
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Patent number: 11587811Abstract: In an embodiment, a system, includes: a first pressurized load port interfaced with a workstation body; a second pressurized load port interfaced with the workstation body; the workstation body maintained at a set pressure level, wherein the workstation body comprises an internal material handling system configured to move a semiconductor workpiece within the workstation body between the first and second pressurized load ports at the set pressure level; a first modular tool interfaced with the first pressurized load port, wherein the first modular tool is configured to process the semiconductor workpiece; and a second modular tool interfaced with the second pressurized load port, wherein the second modular tool is configured to inspect the semiconductor workpiece processed by the first modular tool.Type: GrantFiled: May 11, 2021Date of Patent: February 21, 2023Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chun-Jung Huang, Yung-Lin Hsu, Kuang Huan Hsu, Jeff Chen, Steven Huang, Yueh-Lun Yang
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Publication number: 20220155180Abstract: A method for monitoring a transport vehicle is provided. The method includes the operations as follows. A transport vehicle is scanned by a monitor during the transport vehicle is operated on a rail to acquire a vehicle pattern of the transport vehicle. The vehicle pattern of the transport vehicle is analyzed. An abnormal transport vehicle is determined based on the vehicle pattern. The monitor is placed nearby the rail. A method for transport vehicle maintenance is also provided.Type: ApplicationFiled: November 13, 2020Publication date: May 19, 2022Inventors: CHUN-JUNG HUANG, KUANG HUAN HSU, JEN-TI WANG, PO-FENG TSAI, AN-SHENG CHUNG
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Publication number: 20220076958Abstract: The present disclosure describes a system and a method for an ion implantation (IMP) process. The system includes an ion implanter configured to scan an ion beam over a target for a range of angles, a tilting mechanism configured to support and tilt the target, an ion-collecting device configured to collect a distribution and a number of ejected ions from the ion beam scan over the target, and a control unit configured to adjust a tilt angle based on a correction angle determined based on the distribution and number of ejected ions.Type: ApplicationFiled: November 18, 2021Publication date: March 10, 2022Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chun-Jung Huang, Li-Hsin Chu, Po-Feng Tsai, Henry Peng, Kuang Huan Hsu, Tsung Wei Chen, Yung-Lin Hsu
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Patent number: 11195720Abstract: The present disclosure describes a system and a method for a ion implantation (IMP) process. The system includes an ion implanter configured to scan an ion beam over a target for a range of angles, a tilting mechanism configured to support and tilt the target, an ion-collecting device configured to collect a distribution and a number of ejected ions from the ion beam scan over the target, and a control unit configured to adjust a tilt angle based on a correction angle determined based on the distribution and number of ejected ions.Type: GrantFiled: April 11, 2019Date of Patent: December 7, 2021Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chun-Jung Huang, Li-Hsin Chu, Po-Feng Tsai, Henry Peng, Kuang Huan Hsu, Tsung Wei Chen, Yung-Lin Hsu
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Publication number: 20210265187Abstract: In an embodiment, a system, includes: a first pressurized load port interfaced with a workstation body; a second pressurized load port interfaced with the workstation body; the workstation body maintained at a set pressure level, wherein the workstation body comprises an internal material handling system configured to move a semiconductor workpiece within the workstation body between the first and second pressurized load ports at the set pressure level; a first modular tool interfaced with the first pressurized load port, wherein the first modular tool is configured to process the semiconductor workpiece; and a second modular tool interfaced with the second pressurized load port, wherein the second modular tool is configured to inspect the semiconductor workpiece processed by the first modular tool.Type: ApplicationFiled: May 11, 2021Publication date: August 26, 2021Inventors: Chun-Jung HUANG, Yung-Lin HSU, Kuang Huan HSU, Jeff CHEN, Steven HUANG, Yueh-Lun YANG
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Patent number: 11011401Abstract: In an embodiment, a system, includes: a first pressurized load port interfaced with a workstation body; a second pressurized load port interfaced with the workstation body; the workstation body maintained at a set pressure level, wherein the workstation body comprises an internal material handling system configured to move a semiconductor workpiece within the workstation body between the first and second pressurized load ports at the set pressure level; a first modular tool interfaced with the first pressurized load port, wherein the first modular tool is configured to process the semiconductor workpiece; and a second modular tool interfaced with the second pressurized load port, wherein the second modular tool is configured to inspect the semiconductor workpiece processed by the first modular tool.Type: GrantFiled: February 23, 2018Date of Patent: May 18, 2021Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chun-Jung Huang, Yung-Lin Hsu, Kuang Huan Hsu, Jeff Chen, Steven Huang, Yueh-Lun Yang
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Patent number: 10867823Abstract: A fault detection method in a semiconductor fabricating factory is provided. The method includes delivering a test vehicle along a rail to a test region. The method further includes projecting a test signal from a transducer that is positioned on the test vehicle over a check board when the test vehicle is located within the test region. The check board and the test vehicle are arranged along an axis that is parallel to the rail. The method also includes performing an analysis of the test signal projected over the check board. In addition, the method includes issuing a warning alarm when an abnormality is detected based on the analysis result.Type: GrantFiled: May 29, 2018Date of Patent: December 15, 2020Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Chun-Jung Huang, Yung-Lin Hsu, Kuang-Huan Hsu, Wei-Chih Chen, Jen-Ti Wang, Chih-Hung Liu
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Publication number: 20200135470Abstract: The present disclosure describes a system and a method for a ion implantation (IMP) process. The system includes an ion implanter configured to scan an ion beam over a target for a range of angles, a tilting mechanism configured to support and tilt the target, an ion-collecting device configured to collect a distribution and a number of ejected ions from the ion beam scan over the target, and a control unit configured to adjust a tilt angle based on a correction angle determined based on the distribution and number of ejected ions.Type: ApplicationFiled: April 11, 2019Publication date: April 30, 2020Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chun-Jung HUANG, Li-Hsin CHU, Po-Feng TSAI, Henry PENG, Kuang Huan HSU, Tsung Wei CHEN, Yung-Lin HSU
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Publication number: 20190371636Abstract: A fault detection method in a semiconductor fabricating factory is provided. The method includes delivering a test vehicle along a rail to a test region. The method further includes projecting a test signal from a transducer that is positioned on the test vehicle over a check board when the test vehicle is located within the test region. The check board and the test vehicle are arranged along an axis that is parallel to the rail. The method also includes performing an analysis of the test signal projected over the check board. In addition, the method includes issuing a warning alarm when an abnormality is detected based on the analysis result.Type: ApplicationFiled: May 29, 2018Publication date: December 5, 2019Inventors: Chun-Jung HUANG, Yung-Lin HSU, Kuang-Huan HSU, Wei-Chih CHEN, Jen-Ti WANG, Chih-Hung LIU
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Publication number: 20190164794Abstract: In an embodiment, a system, includes: a first pressurized load port interfaced with a workstation body; a second pressurized load port interfaced with the workstation body; the workstation body maintained at a set pressure level, wherein the workstation body comprises an internal material handling system configured to move a semiconductor workpiece within the workstation body between the first and second pressurized load ports at the set pressure level; a first modular tool interfaced with the first pressurized load port, wherein the first modular tool is configured to process the semiconductor workpiece; and a second modular tool interfaced with the second pressurized load port, wherein the second modular tool is configured to inspect the semiconductor workpiece processed by the first modular tool.Type: ApplicationFiled: February 23, 2018Publication date: May 30, 2019Inventors: Chun-Jung Huang, Yung-Lin Hsu, Kuang Huan Hsu, Jeff Chen, Steven Huang, Yueh-Lun Yang
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Patent number: 10255785Abstract: Disclosed is a method and a system for monitoring of environment and security in a fabrication facility. In one embodiment, a method comprising: transporting an automated material handling system (AMHS) vehicle from a first position to a second position; and detecting at least one parameter using at least one sensor located on the AMHS vehicle to determine at least one environmental or security condition between the first and second positions.Type: GrantFiled: December 7, 2017Date of Patent: April 9, 2019Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chun-Jung Huang, Kuang-Huan Hsu, Yung-Lin Hsu
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Publication number: 20180151412Abstract: A planarization method includes forming a dielectric layer over a polish stop layer. The dielectric layer is polished until reaching the polish stop layer, and the polished dielectric layer has a concave top surface. A compensation layer is formed over the concave top surface. The compensation layer is polished.Type: ApplicationFiled: February 22, 2017Publication date: May 31, 2018Inventors: Chun-Jung Huang, Hsu-Shui Liu, Han-Wen Liao, Yu-Yao Huang, Hsiao-Wei Chen, Yung-Lin Hsu, Kuang-Huan Hsu
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Patent number: 9324910Abstract: A device includes: a substrate; and a doped III-V compound layer disposed over the substrate; wherein: the doped III-V compound layer includes an upper boundary; the upper boundary has a micro-roughened texture and a macro-roughened texture where the micro-roughened texture located on; and the upper boundary includes dopant ions that are not present in a remainder of the doped III-V compound layer underneath the upper boundary.Type: GrantFiled: December 3, 2014Date of Patent: April 26, 2016Assignee: Epistar CorporationInventors: Hsin-Hsien Wu, Chyi Shyuan Chern, Chun-Lin Chang, Ching-Wen Hsiao, Kuang-Huan Hsu