Abstract: Buffing of a footwear component allows for an alteration of the component surface to achieve an intended surface for aesthetics and/or manufacturing purposes. The buffing is performed in a system having a vision module, a sidewall buffing module, an up surface buffing module, and a down surface buffing module. Each of the buffing modules are adapted for the unique shape and sizes of a footwear component to effectively and automatically buff the footwear component.

Abstract: Buffing of a footwear component allows for an alteration of the component surface to achieve an intended surface for aesthetics and/or manufacturing purposes. The buffing is performed in a system having a vision module, a sidewall buffing module, an up surface buffing module, and a down surface buffing module. Each of the buffing modules are adapted for the unique shape and sizes of a footwear component to effectively and automatically buff the footwear component.

Abstract: Apparatus and methods for handling semiconductor part carriers are disclosed. In one example, an apparatus for handling semiconductor part carriers is disclosed. The apparatus includes a mechanical arm and an imaging system coupled to the mechanical arm. The mechanical arm is configured for holding a semiconductor part carrier. The imaging system is configured for automatically locating a goal position on a surface onto which the semiconductor part carrier is to be placed.

Abstract: An analysis apparatus for ADHD is suitable for receiving a plurality of sensing data from a subject. The analysis apparatus comprises a plurality of first stage processing units, a combinator, and a second stage processing unit. Each of the first stage processing units performs a first DNN processing for the sensing data respectively, such that a plurality of first learning results are generated. The first learning results are combined by the combinator into a combination data. The second stage processing unit performs a second DNN processing for the combination data to generate an analysis result.

Abstract: An apparatus for handling semiconductor part carriers includes: a mechanical arm and an imaging system coupled to the mechanical arm, wherein the mechanical arm is configured for holding a semiconductor part carrier, and the imaging system is configured for automatically locating a goal position on a surface onto which the semiconductor part carrier is to be placed.

Abstract: Buffing of a footwear component allows for an alteration of the component surface to achieve an intended surface for aesthetics and/or manufacturing purposes. The buffing is performed in a system having a vision module, a sidewall buffing module, an up surface buffing module, and a down surface buffing module. Each of the buffing modules are adapted for the unique shape and sizes of a footwear component to effectively and automatically buff the footwear component.

Abstract: In an embodiment a system includes: an automated vehicle configured to traverse a first predetermined path; and a sensor system located on the automated vehicle, the sensor system configured to detect a vertical obstacle along the first predetermined path along one or two floorboards ahead of the automated vehicle, wherein the automated vehicle is configured to traverse a second predetermined path in response to detecting the vertical obstacle.

Abstract: In an embodiment a system includes: an automated vehicle configured to traverse a first predetermined path; and a sensor system located on the automated vehicle, the sensor system configured to detect a vertical obstacle along the first predetermined path along one or two floorboards ahead of the automated vehicle, wherein the automated vehicle is configured to traverse a second predetermined path in response to detecting the vertical obstacle.

Abstract: A micro-electromechanical system (MEMS) probe module structure is provided, including: a ceramic carrier and a plurality of probes fixed on the ceramic carrier; the ceramic carrier has a top surface, a side surface, and a bottom surface, and a window in the center; the ceramic carrier is provided with a plurality of lead wires, each lead wires are distributed on the top surface, the side surface and the bottom surface and connected together; the bottom surface is provided with a plurality of bonding areas, and each lead wire is connected to a corresponding bonding area; each of the probes includes a needle tip and the needle arm, the needle tup is arranged at one end of the needle arm, and the needle arm is welded to the bonding area, so that the needle arm extends below the window like a cantilever and the needle tip faces downward.

Abstract: A fabrication system for fabricating IC is provided. A processing tool includes a RF sensor. The RF sensor wirelessly detects intensity of a RF signal. A computation device extracts statistical characteristics with a sampling rate. When the detected intensity of the RF signal exceeds a threshold value or a threshold range, a fault detection and classification (FDC) system notifies the processing tool to adjust the RF signal or stop tool to check parts damage.

Abstract: A robot gripper for moving wafer carriers and packing materials and a method of operating the same are provided. The gripper mechanism has two clamp assemblies, each with a support pin at the bottom. The clamps are configured to move towards or away from each other, and the support pins are configured to move relative to the clamp assemblies. The first clamp assembly has a main clamp and a secondary clamp with a protrusion, while the second clamp assembly has a similar configuration.

Abstract: A fabrication system for fabricating IC is provided. A processing tool includes at least one electrode and a RF sensor. The electrode is configured to receive a radio frequency (RF) signal from an RF signal generator during first and second semiconductor manufacturing processes. The RF sensor wirelessly detects intensity of the RF signal. A computation device extracts statistical characteristics with a sampling rate based on the detected intensity of the RF signal. A fault detection and classification (FDC) system includes a processor. The processor is configured to determine whether or not the detected intensity of the RF signal exceeds a threshold value or a threshold range according to the extracted statistical characteristics. When the detected intensity of the RF signal exceeds the threshold value or the threshold range, the processor notifies the processing tool to adjust the RF signal or stop tool to check parts damage.

Abstract: An analysis apparatus for ADHD is suitable for receiving a plurality of sensing data from a subject. The analysis apparatus comprises a plurality of first stage processing units, a combinator, and a second stage processing unit. Each of the first stage processing units performs a first DNN processing for the sensing data respectively, such that a plurality of first learning results are generated. The first learning results are combined by the combinator into a combination data. The second stage processing unit performs a second DNN processing for the combination data to generate an analysis result.

Abstract: Buffing of a footwear component allows for an alteration of the component surface to achieve an intended surface for aesthetics and/or manufacturing purposes. The buffing is performed in a system having a vision module, a sidewall buffing module, an up surface buffing module, and a down surface buffing module. Each of the buffing modules are adapted for the unique shape and sizes of a footwear component to effectively and automatically buff the footwear component.

Abstract: A robot gripper for moving wafer carriers and packing materials and a method of operating the same are provided. The gripper mechanism has two clamp assemblies, each with a support pin at the bottom. The clamps are configured to move towards or away from each other, and the support pins are configured to move relative to the clamp assemblies. The first clamp assembly has a main clamp and a secondary clamp with a protrusion, while the second clamp assembly has a similar configuration.

Abstract: A MEMS probe and manufacturing method thereof are provided. The method is mainly to form connected first-level, second-level, and third-level pin grooves on both sides of the silicon substrate through an etching process, followed by two electroplating processes to deposit nickel-cobalt-phosphorus alloy in the first-level pin groove to form the tip of the microprobe, and to deposit nickel-cobalt alloy in the second-level pin groove and the third-level pin to form the pin head and pin arm, thereby forming a three-level microprobe. A circuit substrate made of ceramic material is disposed with at least one window, the surface of the circuit substrate adjacent to the window is provided with a plurality of circuit pads, and the circuit substrate is abutted to the pin arm of the microprobe. The silicon substrate is then removed, to form a plurality of cantilever microprobes made of nickel-cobalt-phosphorus alloy and nickel-cobalt alloy on the circuit substrate.

Abstract: Buffing of a footwear component allows for an alteration of the component surface to achieve an intended surface for aesthetics and/or manufacturing purposes. The buffing is performed in a system having a vision module, a sidewall buffing module, an up surface buffing module, and a down surface buffing module. Each of the buffing modules are adapted for the unique shape and sizes of a footwear component to effectively and automatically buff the footwear component.

Abstract: Buffing of a footwear component allows for an alteration of the component surface to achieve an intended surface for aesthetics and/or manufacturing purposes. The buffing is performed in a system having a vision module, a sidewall buffing module, an up surface buffing module, and a down surface buffing module. Each of the buffing modules are adapted for the unique shape and sizes of a footwear component to effectively and automatically buff the footwear component.

Abstract: Buffing of a footwear component allows for an alteration of the component surface to achieve an intended surface for aesthetics and/or manufacturing purposes. The buffing is performed in a system having a vision module, a sidewall buffing module, an up surface buffing module, and a down surface buffing module. Each of the buffing modules are adapted for the unique shape and sizes of a footwear component to effectively and automatically buff the footwear component.

Abstract: Buffing of a footwear component allows for an alteration of the component surface to achieve an intended surface for aesthetics and/or manufacturing purposes. The buffing is performed in a system having a vision module, a sidewall buffing module, an up surface buffing module, and a down surface buffing module. Each of the buffing modules are adapted for the unique shape and sizes of a footwear component to effectively and automatically buff the footwear component.