Patents by Inventor Kuang-Yen Huang

Kuang-Yen Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240093267
    Abstract: A high-throughput automated preprocessing method and a system are applied to a nucleic acid preprocessing apparatus including a control system, a sample transfer area, a nucleic acid extraction area, and a reagent setup area. The control system includes a user interface and guides a user to set up on the user interface. In the sample transfer area, the method includes steps of: a user selecting a sampling tube type, a test protocol and an extraction protocol on the user interface, and the control system performing a sample transfer task. In the nucleic acid extraction area, the method includes steps of: the control system performing a nucleic acid extraction task based on the selected extraction protocol. In the reagent setup area, the method includes steps of: the control system performing a reagent deployment task based on the selected test protocol, and the control system performing a nucleic acid transfer task.
    Type: Application
    Filed: September 19, 2023
    Publication date: March 21, 2024
    Inventors: Wei-Te Hsieh, Chia-Yen Lin, Kuang-An Wang, Keng-Ting Liu, Shu-Hui Huang
  • Publication number: 20240088023
    Abstract: An interconnect structure includes a dielectric layer, a first conductive feature, a hard mask layer, a conductive layer, and a capping layer. The first conductive feature is disposed in the dielectric layer. The hard mask layer is disposed on the first conductive feature. The conductive layer includes a first portion and a second portion, the first portion of the conductive layer is disposed over at least a first portion of the hard mask layer, and the second portion of the conductive layer is disposed over the dielectric layer. The hard mask layer and the conductive layer are formed by different materials. The capping layer is disposed on the dielectric layer and the conductive layer.
    Type: Application
    Filed: November 20, 2023
    Publication date: March 14, 2024
    Inventors: Shao-Kuan LEE, Kuang-Wei YANG, Cherng-Shiaw TSAI, Cheng-Chin LEE, Ting-Ya LO, Chi-Lin TENG, Hsin-Yen HUANG, Hsiao-Kang CHANG, Shau-Lin SHUE
  • Patent number: 5967684
    Abstract: A pen with push button is a pen which has a button on its barrel to control the exposure or closure of its pen point. When the button is pressed down by a finger, a thimble will retract to expose the pen point; when it is released, the thimble will close the pen point. The pen has an extending and retracting mechanism composed of a thimble, a button, and a spring.
    Type: Grant
    Filed: August 21, 1998
    Date of Patent: October 19, 1999
    Inventors: Kuang-Yen Huang, Tsung-Yi Yang