Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a substrate and a magnetic element over the substrate. The magnetic element has multiple sub-layers, and each sub-layer is wider than another sub-layer above it. The semiconductor device structure also includes an isolation layer extending exceeding edges the magnetic element, and the isolation layer contains a polymer material. The semiconductor device structure further includes a conductive line over the isolation layer and extending exceeding the edges of the magnetic element.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a substrate and a magnetic element over the substrate. The semiconductor device structure also includes an isolation layer extending exceeding edges the magnetic element. The isolation layer contains a polymer material. The semiconductor device structure further includes a conductive line over the isolation layer and extending exceeding the edges of the magnetic element.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a substrate and a magnetic element over the substrate. The semiconductor device structure also includes an isolation layer extending exceeding edges the magnetic element. The isolation layer contains a polymer material. The semiconductor device structure further includes a conductive line over the isolation layer and extending exceeding the edges of the magnetic element.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a semiconductor substrate and a magnetic element over the semiconductor substrate. The semiconductor device structure also includes an isolation layer covering the magnetic element and a portion of the semiconductor substrate. The isolation layer contains a polymer material. The semiconductor device structure further includes a conductive line over the isolation layer and extending exceeding edges of the magnetic element.

Abstract: A faceplate optical sub-assembly is provided for accommodating a plurality of optical receptacles mounted in a faceplate of a computing device. The faceplate optical sub-assembly accommodates one or more optical receptacle housings having optically-connected front and rear optical bays. A collar having a single aperture surrounds the one or more optical bays, and a shell structure comprised of a pair of interlocking sub-shells engages on the rear of the collar. A gasket is disposed between the collar and the shell structure. The collar, gasket, and shell structure provide electromagnetic interference (EMI) shielding for optical connections made between optical fibers inserted in the front and rear optical bays, and rigidly engage the plurality of optical receptacle housings. The single aperture of the collar and the multi-part shell structure allows for insertion of a fiber jumper assembly into the rear bays of the faceplate optical sub-assembly prior to insertion into a faceplate of a computing device.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a semiconductor substrate and a magnetic element over the semiconductor substrate. The semiconductor device structure also includes an isolation layer covering the magnetic element and a portion of the semiconductor substrate. The isolation layer contains a polymer material. The semiconductor device structure further includes a conductive line over the isolation layer and extending exceeding edges of the magnetic element.

Abstract: A structure and a formation method of a semiconductor device are provided. The method includes forming a passivation layer over a semiconductor substrate. The method also includes forming a magnetic element over the passivation layer. The method further includes forming an isolation layer over the magnetic element and the passivation layer. The isolation layer includes a polymer material. In addition, the method includes forming a conductive line over the isolation layer, and the conductive line extends across the magnetic element.

Abstract: The present invention provides an mRNA switch which has improved expression level and sensitivity. An mRNA comprising: (i) a nucleic acid sequence specifically recognized by a miRNA or protein; and (ii) a nucleic acid sequence corresponding to a coding region for a marker protein, wherein a nucleotide contained in the mRNA comprises N1-methyl pseudouridine.

Abstract: A structure and a formation method of a semiconductor device are provided. The method includes forming a passivation layer over a semiconductor substrate. The method also includes forming a magnetic element over the passivation layer. The method further includes forming an isolation layer over the magnetic element and the passivation layer. The isolation layer includes a polymer material. In addition, the method includes forming a conductive line over the isolation layer, and the conductive line extends across the magnetic element.

Abstract: In one example in accordance with the present disclosure, a subsystem is provided. The subsystem includes a signal driver/receiver capable of sending and receiving data and signals over a passive cable. The subsystem includes a connection discovery engine to access a low-level enable or disable control of the signal driver/receiver and a low-level loss-of-signal (LOS) control of the signal driver/receiver. The connection discovery engine modulates the enable or disable control to send a local unique ID of the signal driver/receiver over the passive cable. The connection discovery engine monitors timings of transitions on the LOS control to receive, over the passive cable, a remote unique ID of a signal driver/receiver in a second subsystem connected by the passive cable.

Abstract: A modular meshed radio nodes networking topology for kinematic objects utilizing a cellular or satellite backhaul communication component having a secondary wireless data transmission, an article, and a portable electronic device, the system including a power supply and data communication hub in a first electrical communication with the backhaul. Included is a plurality of independent radio transceivers each with an integral antenna array, plus can include beam forming, machine learning, and cryptographic encryption, each radio is removably engagable to an article, wherein each radio is in a second electrical communication with the power and data hub. Resulting in a primary wireless data transmission to or from the device to at least one of the radios that in turn send or receive data via the second electrical communication to the power and data hub for ultimate data communication via the first electrical communication to or from the backhaul.

Abstract: In one example in accordance with the present disclosure, a system is provided. The system includes a first subsystem and a second subsystem, connectable to each other via a passive cable, and each connected to a high-level management tool. Each subsystem includes a signal driver/receiver capable of sending and receiving data and signals over the passive cable and a connection discovery engine to access low-level power up/down controls of the signal driver/receiver. The connection discovery engine is to, via physical layer communication, send a local unique identifier (ID) of the particular signal driver/receiver over the passive cable. The connection discovery engine is further to, via physical layer communication, receive, over the passive cable, a remote unique ID of the signal driver/receiver in the other connected subsystem. The connection discovery engine is further to send the local unique ID and the remote unique ID to the high-level management tool.

Abstract: An exemplary method for simulating an injection molding process may include first generating a mesh model of a structure, and generating a mesh model of an injection unit molding machine, including at least a screw tip of the injection unit. The method may then include providing the ability to specify a material to be injected into the structure, configuring parameters in different zones of at least the injection unit, combining the mesh models of the structure and the injection unit, and providing the ability to apply at least one of a velocity and a pressure profile of the screw tip. The method may then include running a simulated operation of the combined mesh models of the injection unit and the structure.

Abstract: Semiconductor devices and methods of forming the same are disclosed. One of the semiconductor device includes an inductor structure, and the inductor structure is on a substrate and includes a first metal layer, a magnetic stack, a polymer layer and a second metal layer. The first metal layer is over the substrate. The magnetic stack is over the first metal layer and has a substantially zigzag shaped sidewall. The polymer layer is over the first metal layer and encapsulates the magnetic stack. The second metal layer is over the polymer layer.

Abstract: Semiconductor devices and methods of forming the same are disclosed. One of the semiconductor device includes an inductor structure, and the inductor structure is on a substrate and includes a first metal layer, a magnetic stack, a polymer layer and a second metal layer. The first metal layer is over the substrate. The magnetic stack is over the first metal layer and has a substantially zigzag shaped sidewall. The polymer layer is over the first metal layer and encapsulates the magnetic stack. The second metal layer is over the polymer layer.

Abstract: A data center network system based on software-defined network (SDN) is provided. The data center network system includes a plurality of physical machines, a plurality of Ethernet switches, a plurality of OpenFlow switches connected to each other, and a central control apparatus. Each of the physical machines includes a virtual switch and at least one virtual machine. The virtual switches modify destination media access control (MAC) addresses of packets to MAC addresses of the OpenFlow switches, such that the Ethernet switches forward the packets received from the virtual switches to the corresponding OpenFlow switches according to the MAC addresses of the OpenFlow switches. The OpenFlow switches modify the destination media access control (MAC) addresses of the packets to MAC addresses of virtual machines, such that the Ethernet switches forward the packet received from the OpenFlow switches to the corresponding virtual switches.

Abstract: Disclosed are a power connector module and a power connector thereof, and the power connector includes an insulating body, a conductive structure and a waterproof cushion. The insulating body has a groove and a bottom wall formed inside the groove, and the bottom wall has one or more penetrating holes; the conductive structure includes one or more conductive terminals, and the conductive terminal is plugged and fixed into the penetrating hole and protruded from the bottom wall; and the waterproof cushion has one or more through holes for passing and installing the conductive terminal. If the waterproof cushion is pressed and deformed, the periphery of the conductive terminal will be in a sealed status to achieve the effect of providing a waterproof function to the power connector module and the power connector and improve the safety of use.

Abstract: The present disclosure relates to semiconductor packages and methods of manufacturing the same. In an embodiment, the semiconductor package includes a substrate, a semiconductor element, at least one connecting element, and an encapsulant. The semiconductor element is mounted to the substrate. The connecting element is disposed on the substrate and adjacent to the semiconductor element. The encapsulant covers at least a portion of the semiconductor element and at least a portion of the connecting element and defines at least one first groove surrounding the connecting element.

Abstract: A network controlling method and a network controller are provided. The network controlling method includes the following steps. A hybrid SDN-Ethernet system including a plurality of hosts, a plurality of Ethernet switches and m Software-defined networking switches (SDN switches) is provided. m is larger than or equal to 1. A first path according to at least one default spanning tree in the hybrid SDN-Ethernet system is obtained. m×k optional paths are obtained. Each of the m SDN switches is set as a beginning of each of k of the m×k optional paths. A second path is selected according to the m×k optional paths and the first path of the at least one default spanning tree.

Abstract: In one example in accordance with the present disclosure, a subsystem is provided. The subsystem includes a signal driver/receiver capable of sending and receiving data and signals over a passive cable. The subsystem includes a connection discovery engine to access a low-level enable or disable control of the signal driver/receiver and a low-level loss-of-signal (LOS) control of the signal driver/receiver. The connection discovery engine modulates the enable or disable control to send a local unique ID of the signal driver/receiver over the passive cable. The connection discovery engine monitors timings of transitions on the LOS control to receive, over the passive cable, a remote unique ID of a signal driver/receiver in a second subsystem connected by the passive cable.