Abstract: A hot spot defect detecting method and a hot spot defect detecting system are provided. In the method, hot spots are extracted from a design of a semiconductor product to define a hot spot map comprising hot spot groups, wherein local patterns in a same context of the design yielding a same image content are defined as a same hot spot group. During runtime, defect images obtained by an inspection tool performing hot scans on a wafer manufactured with the design are acquired and the hot spot map is aligned to each defect image to locate the hot spot groups. The hot spot defects in each defect image are detected by dynamically mapping the hot spot groups located in each defect image to a plurality of threshold regions and respectively performing automatic thresholding on pixel values of the hot spots of each hot spot group in the corresponding threshold region.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a substrate and a magnetic element over the substrate. The semiconductor device structure also includes an isolation layer extending exceeding edges the magnetic element. The isolation layer contains a polymer material. The semiconductor device structure further includes a conductive line over the isolation layer and extending exceeding the edges of the magnetic element.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a semiconductor substrate and a magnetic element over the semiconductor substrate. The semiconductor device structure also includes an isolation layer covering the magnetic element and a portion of the semiconductor substrate. The isolation layer contains a polymer material. The semiconductor device structure further includes a conductive line over the isolation layer and extending exceeding edges of the magnetic element.

Abstract: A faceplate optical sub-assembly is provided for accommodating a plurality of optical receptacles mounted in a faceplate of a computing device. The faceplate optical sub-assembly accommodates one or more optical receptacle housings having optically-connected front and rear optical bays. A collar having a single aperture surrounds the one or more optical bays, and a shell structure comprised of a pair of interlocking sub-shells engages on the rear of the collar. A gasket is disposed between the collar and the shell structure. The collar, gasket, and shell structure provide electromagnetic interference (EMI) shielding for optical connections made between optical fibers inserted in the front and rear optical bays, and rigidly engage the plurality of optical receptacle housings. The single aperture of the collar and the multi-part shell structure allows for insertion of a fiber jumper assembly into the rear bays of the faceplate optical sub-assembly prior to insertion into a faceplate of a computing device.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a semiconductor substrate and a magnetic element over the semiconductor substrate. The semiconductor device structure also includes an isolation layer covering the magnetic element and a portion of the semiconductor substrate. The isolation layer contains a polymer material. The semiconductor device structure further includes a conductive line over the isolation layer and extending exceeding edges of the magnetic element.

Abstract: A structure and a formation method of a semiconductor device are provided. The method includes forming a passivation layer over a semiconductor substrate. The method also includes forming a magnetic element over the passivation layer. The method further includes forming an isolation layer over the magnetic element and the passivation layer. The isolation layer includes a polymer material. In addition, the method includes forming a conductive line over the isolation layer, and the conductive line extends across the magnetic element.

Abstract: A structure and a formation method of a semiconductor device are provided. The method includes forming a passivation layer over a semiconductor substrate. The method also includes forming a magnetic element over the passivation layer. The method further includes forming an isolation layer over the magnetic element and the passivation layer. The isolation layer includes a polymer material. In addition, the method includes forming a conductive line over the isolation layer, and the conductive line extends across the magnetic element.

Abstract: In one example in accordance with the present disclosure, a subsystem is provided. The subsystem includes a signal driver/receiver capable of sending and receiving data and signals over a passive cable. The subsystem includes a connection discovery engine to access a low-level enable or disable control of the signal driver/receiver and a low-level loss-of-signal (LOS) control of the signal driver/receiver. The connection discovery engine modulates the enable or disable control to send a local unique ID of the signal driver/receiver over the passive cable. The connection discovery engine monitors timings of transitions on the LOS control to receive, over the passive cable, a remote unique ID of a signal driver/receiver in a second subsystem connected by the passive cable.

Abstract: In one example in accordance with the present disclosure, a system is provided. The system includes a first subsystem and a second subsystem, connectable to each other via a passive cable, and each connected to a high-level management tool. Each subsystem includes a signal driver/receiver capable of sending and receiving data and signals over the passive cable and a connection discovery engine to access low-level power up/down controls of the signal driver/receiver. The connection discovery engine is to, via physical layer communication, send a local unique identifier (ID) of the particular signal driver/receiver over the passive cable. The connection discovery engine is further to, via physical layer communication, receive, over the passive cable, a remote unique ID of the signal driver/receiver in the other connected subsystem. The connection discovery engine is further to send the local unique ID and the remote unique ID to the high-level management tool.

Abstract: Semiconductor devices and methods of forming the same are disclosed. One of the semiconductor device includes an inductor structure, and the inductor structure is on a substrate and includes a first metal layer, a magnetic stack, a polymer layer and a second metal layer. The first metal layer is over the substrate. The magnetic stack is over the first metal layer and has a substantially zigzag shaped sidewall. The polymer layer is over the first metal layer and encapsulates the magnetic stack. The second metal layer is over the polymer layer.

Abstract: Semiconductor devices and methods of forming the same are disclosed. One of the semiconductor device includes an inductor structure, and the inductor structure is on a substrate and includes a first metal layer, a magnetic stack, a polymer layer and a second metal layer. The first metal layer is over the substrate. The magnetic stack is over the first metal layer and has a substantially zigzag shaped sidewall. The polymer layer is over the first metal layer and encapsulates the magnetic stack. The second metal layer is over the polymer layer.

Abstract: In one example in accordance with the present disclosure, a subsystem is provided. The subsystem includes a signal driver/receiver capable of sending and receiving data and signals over a passive cable. The subsystem includes a connection discovery engine to access a low-level enable or disable control of the signal driver/receiver and a low-level loss-of-signal (LOS) control of the signal driver/receiver. The connection discovery engine modulates the enable or disable control to send a local unique ID of the signal driver/receiver over the passive cable. The connection discovery engine monitors timings of transitions on the LOS control to receive, over the passive cable, a remote unique ID of a signal driver/receiver in a second subsystem connected by the passive cable.

Abstract: In one example in accordance with the present disclosure, a system is provided. The system includes a first subsystem and a second subsystem, connectable to each other via a passive cable, and each connected to a high-level management tool. Each subsystem includes a signal driver/receiver capable of sending and receiving data and signals over the passive cable and a connection discovery engine to access low-level power up/down controls of the signal driver/receiver. The connection discovery engine is to, via physical layer communication, send a local unique identifier (ID) of the particular signal driver/receiver over the passive cable. The connection discovery engine is further to, via physical layer communication, receive, over the passive cable, a remote unique ID of the signal driver/receiver in the other connected subsystem. The connection discovery engine is further to send the local unique ID and the remote unique ID to the high-level management tool.

Abstract: In one embodiment, a system includes at least one tone generator, a first transmitter, and a second transmitter. The at least one tone generator is operable to generate a plurality of modulation tones comprising at least a first modulation tone having a first tone frequency and a second modulation tone having a second tone frequency that is different from the first tone frequency. The first transmitter is operable to apply the first modulation tone to a first optical signal such that at least a portion of the first optical signal is divided into one or more sidebands. The second transmitter is operable to apply the second modulation tone to a second optical signal such that at least a portion of the second optical signal is divided into one or more sidebands.

Abstract: An example method includes receiving radio frequency (RF) signals from a cable modem termination system (CMTS) in a small form factor pluggable optical transmitter; converting the RF signals to optical signals in the small form factor pluggable optical transmitter; and transmitting, by the small form factor pluggable optical transmitter, the optical signals on a network. More specific embodiments can include RF signals that are modulated, where a modulation error ratio (MER) of the RF signal varies substantially linearly with Carrier to Composite Noise (CCN), and the converting is implemented by a laser transmitter. Other, more specific, embodiments include routing the RF signals through a pre-distortion RF amplifier RF variable attenuator, and coupling the optical transmitter to a chassis of the CMTS.

Abstract: In one embodiment, a system includes at least one tone generator, a first transmitter, and a second transmitter. The at least one tone generator is operable to generate a plurality of modulation tones comprising at least a first modulation tone having a first tone frequency and a second modulation tone having a second tone frequency that is different from the first tone frequency. The first transmitter is operable to apply the first modulation tone to a first optical signal such that at least a portion of the first optical signal is divided into one or more sidebands. The second transmitter is operable to apply the second modulation tone to a second optical signal such that at least a portion of the second optical signal is divided into one or more sidebands.

Abstract: In one embodiment, a system includes at least one tone generator, a first transmitter, and a second transmitter. The at least one tone generator is operable to generate a plurality of modulation tones comprising at least a first modulation tone having a first tone frequency and a second modulation tone having a second tone frequency that is different from the first tone frequency. The first transmitter is operable to apply the first modulation tone to a first optical signal such that at least a portion of the first optical signal is divided into one or more sidebands. The second transmitter is operable to apply the second modulation tone to a second optical signal such that at least a portion of the second optical signal is divided into one or more sidebands.

Abstract: A multi-wavelength optical transmission system includes a plurality of primary optical transmitters, each being configured to provide directly modulated analog optical signals at non-uniformly spaced apart wavelengths. An optical multiplexer having a plurality of optical input ports receives the analog optical signals from each of the plurality of primary optical transmitters and provides a wavelength division multiplexed signal over an optical fiber coupled at an output thereof. A spare optical transmitter is coupled to an input port of the optical multiplexer and, in response to detecting failure of a failed one of the plurality of primary optical transmitters, is tuned to provide a directly modulated analog optical signal at a spare wavelength that is selected as to be non-uniformly spaced relative to at least some of the non-uniformly spaced apart wavelengths according to tuning data.

Abstract: In one embodiment, a system includes at least one tone generator, a first transmitter, and a second transmitter. The at least one tone generator is operable to generate a plurality of modulation tones comprising at least a first modulation tone having a first tone frequency and a second modulation tone having a second tone frequency that is different from the first tone frequency. The first transmitter is operable to apply the first modulation tone to a first optical signal such that at least a portion of the first optical signal is divided into one or more sidebands. The second transmitter is operable to apply the second modulation tone to a second optical signal such that at least a portion of the second optical signal is divided into one or more sidebands.

Abstract: Provided herein are at least one embodiment of a system and method for reducing or eliminating crosstalk and associated distortion in a wavelength-division multiplexed optical signal transmitted over a fiber optic network by inversion of the RF signals that are inputs to the system.