Patents by Inventor Kuang Yu Chu
Kuang Yu Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11287192Abstract: Provided is a heat sink having excellent heat dissipation efficiency by having excellent thermal diffusion characteristics in a planar direction of a heat receiving plate. The heat sink has the heat receiving plate that is thermally connected to a heating element, heat pipes that are thermally connected to the heat receiving plate and are formed from a tube body, and heat dissipation fins that are thermally connected to the heat receiving plate, wherein the heat pipes are provided in a plurality of layers in a vertical direction to a surface of the heat receiving plate, and in at least two layers of the plurality of layers, positions of the heat pipes on the surface of the heat receiving plate are not identical to each other.Type: GrantFiled: October 4, 2016Date of Patent: March 29, 2022Assignee: FURUKAWA ELECTRIC CO., LTD.Inventors: Yasuyuki Tochigi, Hung Wei Tseng, Kuang Yu Chu, Masahiro Meguro, Kenya Kawabata
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Patent number: 10809011Abstract: Provided is a heat sink where the formation of a boundary layer on surfaces of heat radiating fins is suppressed so that portions other than on the windward side along the cooling air flow can also exhibit excellent heat radiation property. The heat sink includes: a base plate; a first heat radiating fin thermally connected to the base plate; and a second heat radiating fin disposed adjacently to a side end portion of the first heat radiating fin, and thermally connected to the base plate, wherein a surface of the first heat radiating fin is not parallel to a surface of the second heat radiating fin, and at least one of the second heat radiating fins is disposed at a position lower than at least one of the first heat radiating fins in a vertical direction with respect to a front surface of the base plate.Type: GrantFiled: October 22, 2019Date of Patent: October 20, 2020Assignee: Furukawa Electric Co., Ltd.Inventors: Kuang Yu Chu, Masaaki Yamamoto, Hung Wei Tseng, Masahiro Meguro, Masato Watanabe
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Patent number: 10598441Abstract: A heat sink includes a base plate thermally connectable to a heat generating element and having a flat plate shape, a first heat radiating fin thermally connected to the base plate, and a second heat radiating fin disposed adjacently to a side end portion of the first heat radiating fin and thermally connected to the base plate. A surface of the first heat radiating fin is not parallel to a surface of the second heat radiating fin.Type: GrantFiled: November 14, 2017Date of Patent: March 24, 2020Assignee: Furukawa Electric Co., Ltd.Inventors: Kenya Kawabata, Masahiro Meguro, Kuang Yu Chu, Hung Wei Tseng
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Publication number: 20200049418Abstract: Provided is a heat sink where the formation of a boundary layer on surfaces of heat radiating fins is suppressed so that portions other than on the windward side along the cooling air flow can also exhibit excellent heat radiation property. The heat sink includes: a base plate; a first heat radiating fin thermally connected to the base plate; and a second heat radiating fin disposed adjacently to a side end portion of the first heat radiating fin, and thermally connected to the base plate, wherein a surface of the first heat radiating fin is not parallel to a surface of the second heat radiating fin, and at least one of the second heat radiating fins is disposed at a position lower than at least one of the first heat radiating fins in a vertical direction with respect to a front surface of the base plate.Type: ApplicationFiled: October 22, 2019Publication date: February 13, 2020Applicant: FURUKAWA ELECTRIC CO., LTD.Inventors: Kuang Yu CHU, Masaaki YAMAMOTO, Hung Wei TSENG, Masahiro MEGURO, Masato WATANABE
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Publication number: 20190323779Abstract: A heat sink includes a base plate thermally connectable to a heat generating element and having a flat plate shape, a first heat radiating fin thermally connected to the base plate, and a second heat radiating fin disposed adjacently to a side end portion of the first heat radiating fin and thermally connected to the base plate. A surface of the first heat radiating fin is not parallel to a surface of the second heat radiating fin.Type: ApplicationFiled: July 2, 2019Publication date: October 24, 2019Applicant: Furukawa Automotive Systems Inc.Inventors: Kenya Kawabata, Masahiro Meguro, Kuang Yu Chu, Hung Wei Tseng
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Publication number: 20180283797Abstract: Provided is a heat sink having excellent heat dissipation efficiency by having excellent thermal diffusion characteristics in a planar direction of a heat receiving plate. The heat sink has the heat receiving plate that is thermally connected to a heating element, heat pipes that are thermally connected to the heat receiving plate and are formed from a tube body, and heat dissipation fins that are thermally connected to the heat receiving plate, wherein the heat pipes are provided in a plurality of layers in a vertical direction to a surface of the heat receiving plate, and in at least two layers of the plurality of layers, positions of the heat pipes on the surface of the heat receiving plate are not identical to each other.Type: ApplicationFiled: October 4, 2016Publication date: October 4, 2018Applicant: Furukawa Electric Co., Ltd.Inventors: Yasuyuki Tochigi, Hung Wei Tseng, Kuang Yu Chu, Masahiro Meguro, Kenya Kawabata
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Publication number: 20180080717Abstract: A heat sink includes a base plate thermally connectable to a heat generating element and having a flat plate shape, a first heat radiating fin thermally connected to the base plate, and a second heat radiating fin disposed adjacently to a side end portion of the first heat radiating fin and thermally connected to the base plate. A surface of the first heat radiating fin is not parallel to a surface of the second heat radiating fin.Type: ApplicationFiled: November 14, 2017Publication date: March 22, 2018Inventors: Kenya Kawabata, Masahiro Meguro, Kuang Yu Chu, Hung Wei Tseng