Abstract: A backlight module includes a back plate, a plurality of lamps, a lamp fixing base, and a diffusion plate. The back plate has a cavity. The lamps are disposed on or above the back plate. The lamp fixing base is disposed on the back plate for fixing the lamps. The lamp fixing base has a supporting portion extending along a direction away from the back plate. An orthogonal projection of the supporting portion on the back plate is within a boundary of the cavity. The diffusion plate is disposed above or over the back plate, and the supporting portion is suitable for supporting the diffusion plate.

Abstract: A backlight module includes a back plate, a plurality of lamps, a lamp fixing base, and a diffusion plate. The back plate has a cavity. The lamps are disposed on or above the back plate. The lamp fixing base is disposed on the back plate for fixing the lamps. The lamp fixing base has a supporting portion extending along a direction away from the back plate. An orthogonal projection of the supporting portion on the back plate is within a boundary of the cavity. The diffusion plate is disposed above or over the back plate, and the supporting portion is suitable for supporting the diffusion plate.

Abstract: A lamp positioning structure is disclosed. The lamp positioning structure is assembled on a display device and includes a fastening element mounted on a side plate of a rear plate. The lamp is curve-line-shaped and is mounted over the rear plate. Moreover, the lamp includes at least a curved section. Also, a display panel having a display area is assembled over the rear plate to cover the lamp. The curved section of the lamp is arranged in the display area without damaging the brightness uniformity nearby. In addition, two elastic arms are disposed on both lateral sides of the fastening element to abut against the curved section. Through the arrangement of the positioning structure, the breakage and the displacement of the lamp can be reduced or even prevented. The brightness of the curved section corresponding to the fastening element becomes more uniform and without definite dark spots.

Abstract: A lamp positioning structure is disclosed. The lamp positioning structure is assembled on a display device and includes a fastening element mounted on a side plate of a rear plate. The lamp is curve-line-shaped and is mounted over the rear plate. Moreover, the lamp includes at least a curved section. Also, a display panel having a display area is assembled over the rear plate to cover the lamp. The curved section of the lamp is arranged in the display area without damaging the brightness uniformity nearby. In addition, two elastic arms are disposed on both lateral sides of the fastening element to abut against the curved section. Through the arrangement of the positioning structure, the breakage and the displacement of the lamp can be reduced or even prevented. The brightness of the curved section corresponding to the fastening element becomes more uniform and without definite dark spots.

Abstract: A memory module structure of the invention is used for being assembled on a locking device. The memory module includes a substrate and a plurality of memories. The substrate has certain long sides and short sides. Notches are formed on the short sides for being secured by the locking device. Each of the plurality of memories has a suitable length and width. Some memories of the plurality of memories are transversely mounted on the substrate with respect to the substrate. The other memories of the plurality of memories are longitudinally mounted on the substrate with respect to the substrate. According to this structure, it is possible to suitably arrange a plurality of memories on the substrate so as to increase the memory capacity of the memory module.

Abstract: The image sensor structure of the invention is used for electrically connecting to a printed circuit board. The image sensor structure includes a substrate, a projecting layer, an image sensing chip, a plurality of wires, and a transparent layer. The substrate has a first surface and a second surface. The first surface is formed with signal output terminals for electrically connecting to the printed circuit board. The projecting layer has an upper surface and a lower surface. The lower surface is adhered to the second surface of the substrate to form a cavity with the substrate. The upper surface is formed with signal input terminals. The image sensing chip is placed within the cavity formed by the substrate and the projecting layer, and is adhered onto the second surface of the substrate. The plurality of wires each has a first terminal and a second terminal. The first terminals are electrically connected to the image sensing chip.

Abstract: A memory module structure of the invention is used for being assembled on a locking device. The memory module includes a substrate and a plurality of memories. The substrate has certain long sides and short sides. Notches are formed on the short sides for being secured by the locking device. Each of the plurality of memories has a suitable length and width. Some memories of the plurality of memories are transversely mounted on the substrate with respect to the substrate. The other memories of the plurality of memories are longitudinally mounted on the substrate with respect to the substrate. According to this structure, it is possible to suitably arrange a plurality of memories on the substrate so as to increase the memory capacity of the memory module.

Abstract: A package structure of an integrated circuit is used for electrically connecting to a printed circuit board includes a substrate, an integrated circuit, a plurality of wires, two molded resins. The substrate has a lower surface formed with signal input terminals and signal output terminals, which are to be connected to the signal input terminals. The signal output terminals are electrically connected to the printed circuit board. The integrated circuit has a lower surface for mounting the integrated circuit to the upper surface of the substrate. The two sides on the lower surface of the integrated circuit formed with a plurality of bonding pads. While the integrated circuit mounted to the substrate, the bonding pads are exposed to the outside. The plurality of wires are electrically connected the bonding pads to the substrate. Thus, the signals from the integrated circuit can be transmitted to the substrate.

Abstract: A stackable integrated circuit for electrically connecting to a circuit board and for a second integrated circuit body to be stacked on. The stackable integrated circuit includes an integrated circuit body, a plurality of first contacts, a projecting layer, and a plurality of second contacts. The integrated circuit body has a first surface and a second surface opposite to the first surface. The first contacts are formed on the first surface of the integrated circuit body for electrically connecting the integrated circuit body to the circuit board. The projecting layer is arranged on the second surface of the integrated circuit body. The second contacts are formed on the projecting layer for electrically connecting the integrated circuit body to a second integrated circuit body.