Abstract: A hot spot defect detecting method and a hot spot defect detecting system are provided. In the method, hot spots are extracted from a design of a semiconductor product to define a hot spot map comprising hot spot groups, wherein local patterns in a same context of the design yielding a same image content are defined as a same hot spot group. During runtime, defect images obtained by an inspection tool performing hot scans on a wafer manufactured with the design are acquired and the hot spot map is aligned to each defect image to locate the hot spot groups. The hot spot defects in each defect image are detected by dynamically mapping the hot spot groups located in each defect image to a plurality of threshold regions and respectively performing automatic thresholding on pixel values of the hot spots of each hot spot group in the corresponding threshold region.

Abstract: A camera free of side shadow to effectively eliminate any side shadow appearing against the background of the object in the picture taken by having mounted one or multiple light projection devices arranged on the peripheral of the camera body and scattered around the lens of the camera or forthwith on the peripheral of the lens to create radiation overlapped light projection sources to fully eliminate any possible side shadow developed in the background of the object in the picture taken.