Abstract: An image-recognition method is provided. The method includes the following steps: receiving structured data, wherein the structured data includes training-set data and testing-set data, and the structured data includes a plurality of groups, and each group includes one or more types, and each type includes a plurality of check-point images; training an artificial-intelligence (AI) model using the training-set data; inputting the testing-set data into the AI model to obtain a model evaluation of the AI model; and determining one or more first types with a lower overall recognition rate or a lower confidence level in the structured data, and deletes or corrects the check-point images in the one or more first types to update the structured data.

Abstract: An image-recognition method is provided. The method includes the following steps: receiving a plurality of check-point images, and classifying the check-point images into a plurality of groups; classifying the check-point images in each group into a plurality of types to generate first structured data; balancing a number of the check-point images in each type of each group in the first structured data to generate second structured data, wherein the second structured data includes training-set data and testing-set data; training an artificial-intelligence (AI) model using the training-set data; and inputting the testing-set data into the AI model to obtain a model evaluation of the AI model.

Abstract: An image-recognition method is provided. The method includes the following steps: receiving a plurality of check-point images, and classifying the check-point images into a plurality of groups; classifying the check-point images in each group into a plurality of types to generate first structured data, wherein the first structured data includes a first layer and a second layer, and the first layer indicates the groups in different statuses, the second layer is located with directories of the first layer, and the types in each group of the second layer indicate different components in a status corresponding to each group; and balancing a number of the check-point images in each type of each group in the first structured data to generate second structured data, wherein the second structured data is used to train an AI model for image recognition.

Abstract: Training a link between a physical layer transceiver and a link partner includes encoding, at the physical layer transceiver, a first number of training bits into a second number of encoded training bits, expanding at the physical layer transceiver the second number of encoded training bits into a third number of expanded training bits, and interpolating at the physical layer transceiver, in a first mode, between the third number of expanded training bits and a fourth number of interpolated training bits. The fourth number is more than twice the third number, and may be four times the third number. Such training may further include interpolating at the physical layer transceiver, in a second mode, between the third number of expanded training bits and the fourth number of interpolated training bits, fourth number being twice the third number. The second mode may be used when the first mode is not supported.

Abstract: An image-recognition method is provided. The method includes the following steps: receiving a plurality of check-point images, and classifying the check-point images into a plurality of groups; classifying the check-point images in each group into a plurality of types to generate first structured data; balancing a number of the check-point images in each type of each group in the first structured data to generate second structured data, wherein the second structured data includes training-set data and testing-set data; training an artificial-intelligence (AI) model using the training-set data; and inputting the testing-set data into the AI model to obtain a model evaluation of the AI model.

Abstract: An image-recognition method is provided. The method includes the following steps: receiving a plurality of check-point images, and classifying the check-point images into a plurality of groups; classifying the check-point images in each group into a plurality of types to generate first structured data, wherein the first structured data includes a first layer and a second layer, and the first layer indicates the groups in different statuses, the second layer is located with directories of the first layer, and the types in each group of the second layer indicate different components in a status corresponding to each group; and balancing a number of the check-point images in each type of each group in the first structured data to generate second structured data, wherein the second structured data is used to train an AI model for image recognition.

Abstract: An image-recognition method is provided. The method includes the following steps: receiving structured data, wherein the structured data includes training-set data and testing-set data, and the structured data includes a plurality of groups, and each group includes one or more types, and each type includes a plurality of check-point images; training an artificial-intelligence (AI) model using the training-set data; inputting the testing-set data into the AI model to obtain a model evaluation of the AI model; and determining one or more first types with a lower overall recognition rate or a lower confidence level in the structured data, and deletes or corrects the check-point images in the one or more first types to update the structured data.

Abstract: A portable memory card including a molded plastic casing formed over a memory device and other circuits mounted on a substrate such that the molding material extends over side edges of the substrate to provide accurate width and thickness dimensions. Contact pads are formed on a lower surface of the PCBA substrate, which is exposed through a bottom of the casing. The PCBA is fabricated on a substrate carrier, then positioned inside of a mold assembly. During the molding process, a rod extends from an upper portion of the mold assembly and pushes the substrate against the lower surface. A vacuum is then applied to hold the substrate against the lower surface of the mold, and the rod is subsequently withdrawn from the mold cavity during injection of the molten molding material. A single cavity mold assembly provides molding material extends over front and back edges of the memory card.

Abstract: Systems and methods for communicating using various protocols through the Secured Digital (SD) physical interface are disclosed. The invention covers, among others, single-mode and multi-mode hosts, single-mode and multi-mode devices, as well as techniques for initializing these hosts and devices in order to facilitate the aforementioned communication.

Abstract: Systems and methods for communicating using various protocols through the Secured Digital (SD) physical interface are disclosed. The invention covers, among others, single-mode and multi-mode hosts, single-mode and multi-mode devices, as well as techniques for initializing these hosts and devices in order to facilitate the aforementioned communication.

Abstract: Systems and methods for communicating using various protocols through the Secured Digital (SD) physical interface are disclosed. The invention covers, among others, single-mode and multi-mode hosts, single-mode and multi-mode devices, as well as techniques for initializing these hosts and devices in order to facilitate the aforementioned communication.

Abstract: A card-type electronic apparatus such as an SD card, a CF card, a Memory Stick card, or a USB flash drive is formed from an upper and lower cover that are bonded together at an interior seam formed using ultrasonic joining. Lower sidewalls on the lower cover create an installation pocket for the upper cover. The installation pocket not only simplifies alignment between the upper and lower covers, but also contains any bonder material overflow that might otherwise affect the external dimensions of the apparatus housing. The lower sidewalls can completely surround the upper cover, for drop in installation. Alternatively, the lower sidewalls can partially surround the upper cover, so that the upper cover can be slid into place during assembly.

Abstract: The present invention relates to a method and system for providing a flash memory assembly. The flash memory assembly includes a connector and a printed circuit board (PCB) coupled to the connector. The center of the PCB is positioned substantially at the center of the connector. An electronic component is coupled to one side of the PCB. In another aspect of the present invention, a second electronic component is coupled to a second side of the PCB. In another aspect of the present invention, the electronic components and the PCB are protected by covers joined using interference fitting or ultrasonic joining. In another aspect of the present invention, a cap protects the connector. The cap can be removably coupled to the connector.

Abstract: A light-weight flash hard drive includes a printed circuit board assembly (PCBA) mounted in a housing formed by a plastic frame and a pair of metal panels that are mounted on the plastic frame over the PCBA. The PCBA includes a PC board and a plug connector that is mounted on a front edge of the PCB. The plastic frame includes first and second parallel side rails and a back end rail extending between back ends of the first and second side rails. The frame defines an open front end and a longitudinal platform for receiving and supporting the PCBA such that the plug connector is exposed through the open front end. The metal panels are either snap-coupled to the plastic frame or to each other. Alternatively, or in addition, an adhesive or insulating film is provided between the metal panels and the IC devices mounted on the PCBA.

Abstract: A temperature regulator provides thermoelectric temperature control in a X-ray detector. The temperature regulator maintains the temperature within the X-ray detector by controlling current through a thermoelectric device. The temperature regulator can both heat and cool the X-ray detector.

Abstract: A light-weight flash hard drive includes a printed circuit board assembly (PCBA) mounted in a housing formed by a plastic frame and a pair of metal panels that are mounted on the plastic frame over the PCBA. The PCBA includes a PC board and a plug connector that is mounted on a front edge of the PCB. The plastic frame includes first and second parallel side rails and a back end rail extending between back ends of the first and second side rails. The frame defines an open front end and a longitudinal platform for receiving and supporting the PCBA such that the plug connector is exposed through the open front end. The metal panels are either snap-coupled to the plastic frame or to each other. Alternatively, or in addition, an adhesive or insulating film is provided between the metal panels and the IC devices mounted on the PCBA.

Abstract: A portable memory device includes a molded housing and a printed circuit board assembly (PCBA) encased with the molded housing such that a plug connector extends from one end. A lower housing portion is produced by injection molding using a first apparatus, and then the lower housing portion is transferred to a second molding apparatus. The PCBA is mounted onto the lower housing such that the plug connector is received in a protected region. The second molding apparatus is then closed, and an upper housing portion is injected molded over the PBCA and exposed peripheral edges of the lower housing portion such that the upper housing portion becomes fused to the lower housing portion. Multiple lower housing portions connected together by plastic tethers to form a plastic strip, which facilitates efficient transfer to the second molding apparatus as a unit. The tethers are subsequently removed (e.g., singulated) to form individual memory devices.

Abstract: A removable Flash integrated memory module card has a plastic shell and an integral Flash memory module. On the backside of the card, there are exposed contact pads. When the card is inserted into a card-hosting device, the card can communicate with the device through the exposed pads. The manufacturing method includes manufacturing of the memory module and utilizing plastic molding techniques for making the card outer body. The method involves preparing the substrate, mounting the components, testing the module, preparing the molding device, and molding the card body.

Abstract: Plastic casings are simultaneously molded onto several PCBAs attached to a carrier in a closely-spaced arrangement. All edges of each PCBA have integral connecting segments that extend through grooves formed in the associated mold assembly, and are pinched when the molds assembly is closed to precisely and reliably position the PCBA inside of an associated cavity during the molding process. In one embodiment, the PCB substrate is positioned in a bent arrangement to accommodate the use of inexpensive memory devices. Write-protect switches are provided.

Abstract: A memory module assembly includes two-plate heat sink attached to one or more of the integrated circuits (e.g., memory devices) of a memory module PCBA by adhesive. The adhesive is either heat-activated or heat-cured. The adhesive is applied to either the memory devices or the heat-sink plates, and then compressed between the heat-sink plates and memory module using a fixture. The fixture is then passed through an oven to activate/cure the adhesive.