Abstract: This application provides an embedded package structure, a power supply apparatus, and an electronic device. First electronic components with smaller sizes are stacked, and then arranged in a substrate frame in a two-dimensional manner with a larger-size inductor component to form an embedded package structure. Then, a chip is disposed on the embedded package structure, so that the chip serving as a main heat source is placed on a surface of the power supply apparatus.

Abstract: A system-in-package structure includes a carrier plate, a chip, a passive component, a first plastic package body and a second plastic package body. The chip is disposed on a first surface of the carrier plate. The passive component is disposed on a second surface of the carrier plate. The first surface of the carrier plate is disposed opposite to the second surface of the carrier plate. The first plastic package body for packaging the chip is formed on the first surface of the carrier plate. A surface of the chip that is away from the carrier plate is exposed to the first plastic package body. The second plastic package body for packaging the passive component is formed on the second surface of the carrier plate.

Abstract: Embodiments of this application disclose an embedded substrate and a method for manufacturing an embedded substrate. The embedded substrate includes a substrate and a chip embedded in the substrate. A height value of the metal boss is greater than 100 micrometers is disposed at each pin on the chip. A drill hole is opened in a region corresponding to the metal boss on the substrate, and a conductive material is filled in the drill hole. A first surface of the substrate is disposed with a conductive layer satisfying a connection requirement of each pin. Pins having the connection requirement are connected by using the metal boss, the conductive material, and the conductive layer. In the embodiments, a particular distance is maintained between the drill hole and the chip by using the metal boss.

Abstract: The present invention relates to the field of electronic technologies, and discloses a base board and a mobile terminal. The base board includes an electrical pattern and multiple components, the base board further includes a resin layer and a thin resin layer, the component is embedded in the resin layer, and an end face of a foot is flush to a surface of the resin layer; and the thin resin layer is attached to one exposed side of a foot of a component in the resin layer, a through hole corresponding to each foot is disposed in the thin resin layer, the circuit pattern is attached to one side that is of the thin resin layer and that is opposite to the resin layer, and the circuit pattern is connected to a pad that is electrically connected to a foot and that stretches into each through hole.