Patents by Inventor Kue-Jin HAN

Kue-Jin HAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing power amplifier package embedded with input-output circuit
    Patent number: 11264251
    Abstract: A method of manufacturing a power amplifier package embedded with an input-output circuit including a dielectric circuit board, a heat sink and lead frames, the method comprising: the step of preparing the dielectric circuit board including the steps of forming a power amplifier hole in which a power amplifier chip is to be disposed on a dielectric substrate, printing an input matching network metal pattern on a left side of the power amplifier hole, and printing an output matching network metal pattern on a right side of the power amplifier hole, and sintering the input matching network metal pattern and the output matching network metal pattern printed on the dielectric substrate; the step of preparing the lead frames by etching alloy 42 and plating nickel; and the step of attaching the heat sink on a bottom surface of the dielectric circuit board.
    Type: Grant
    Filed: November 29, 2018
    Date of Patent: March 1, 2022
    Inventors: Sang-Hun Lee, Kue-Jin Han
  • METHOD OF MANUFACTURING POWER AMPLIFIER PACKAGE EMBEDDED WITH INPUT-OUTPUT CIRCUIT
    Publication number: 20210013050
    Abstract: A method of manufacturing a power amplifier package embedded with an input-output circuit including a dielectric circuit board, a heat sink and lead frames, the method comprising: the step of preparing the dielectric circuit board including the steps of forming a power amplifier hole in which a power amplifier chip is to be disposed on a dielectric substrate, printing an input matching network metal pattern on a left side of the power amplifier hole, and printing an output matching network metal pattern on a right side of the power amplifier hole, and sintering the input matching network metal pattern and the output matching network metal pattern printed on the dielectric substrate; the step of preparing the lead frames by etching alloy 42 and plating nickel; and the step of attaching the heat sink on a bottom surface of the dielectric circuit board.
    Type: Application
    Filed: November 29, 2018
    Publication date: January 14, 2021
    Inventors: Sang-Hun LEE, Kue-Jin HAN