Patents by Inventor Kuei-Chang Tung

Kuei-Chang Tung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer cleaning device and method thereof
    Patent number: 9539621
    Abstract: A wafer cleaning device comprising a wafer stage for holding a wafer having a surface to be washed, a first nozzle positioned above the wafer, a second nozzle positioned above the wafer. A first height is between the first nozzle and the surface and a second height is between the second nozzle and the surface, wherein the first height is shorter than the second height.
    Type: Grant
    Filed: December 17, 2013
    Date of Patent: January 10, 2017
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Hsin-Ting Tsai, Cheng-Hung Yu, Chin-Kuang Liu, Ming-Hsin Lee, Wei-Hong Chuang, Kuei-Chang Tung, Yan-Yi Lu, Chin-Chin Wang
  • Wafer cleaning device
    Patent number: 8707974
    Abstract: A wafer cleaning device comprising a wafer stage for holding a wafer having a surface to be washed, a first nozzle positioned above the wafer, a second nozzle positioned above the wafer. A first height is between the first nozzle and the surface and a second height is between the second nozzle and the surface, wherein the first height is shorter than the second height.
    Type: Grant
    Filed: December 11, 2009
    Date of Patent: April 29, 2014
    Assignee: United Microelectronics Corp.
    Inventors: Hsin-Ting Tsai, Cheng-Hung Yu, Chin-Kuang Liu, Ming-Hsin Lee, Wei-Hong Chuang, Kuei-Chang Tung, Yan-Yi Lu, Chin-Chin Wang
  • WAFER CLEANING DEVICE AND METHOD THEREOF
    Publication number: 20140096800
    Abstract: A wafer cleaning device comprising a wafer stage for holding a wafer having a surface to be washed, a first nozzle positioned above the wafer, a second nozzle positioned above the wafer. A first height is between the first nozzle and the surface and a second height is between the second nozzle and the surface, wherein the first height is shorter than the second height.
    Type: Application
    Filed: December 17, 2013
    Publication date: April 10, 2014
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Hsin-Ting Tsai, Cheng-Hung Yu, Chin-Kuang Liu, Ming-Hsin Lee, Wei-Hong Chuang, Kuei-Chang Tung, Yan-Yi Lu, Chin-Chin Wang
  • WAFER CLEANING DEVCIE AND METHOD THEREOF
    Publication number: 20110139188
    Abstract: A wafer cleaning device comprising a wafer stage for holding a wafer having a surface to be washed, a first nozzle positioned above the wafer, a second nozzle positioned above the wafer. A first height is between the first nozzle and the surface and a second height is between the second nozzle and the surface, wherein the first height is shorter than the second height.
    Type: Application
    Filed: December 11, 2009
    Publication date: June 16, 2011
    Inventors: Hsin-Ting Tsai, Cheng-Hung Yu, Chin-Kuang Liu, Ming-Hsin Lee, Wei-Hong Chuang, Kuei-Chang Tung, Yan-Yi Lu, Chin-Chin Wang