Patents by Inventor Kuei-Chun Chen

Kuei-Chun Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240170326
    Abstract: A manufacturing method of a semiconductor device includes at least the following steps. A sacrificial substrate is provided. An etch stop layer is formed on the sacrificial substrate. A portion of the etch stop layer is oxidized to form an oxide layer between the sacrificial substrate and the remaining etch stop layer. A capping layer is formed on the remaining etch stop layer. A device layer is formed on the capping layer. A first etching process is performed to remove the sacrificial substrate. A second etching process is performed to remove the oxide layer. A third etching process is performed to remove the remaining etch stop layer. A power rail is formed on the capping layer opposite to the device layer.
    Type: Application
    Filed: January 25, 2024
    Publication date: May 23, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chi-Ming Chen, Kuei-Ming Chen, Po-Chun Liu, Chung-Yi Yu, Chia-Shiung Tsai
  • Patent number: 11923237
    Abstract: A manufacturing method of a semiconductor device includes at least the following steps. A sacrificial substrate is provided. An epitaxial layer is formed on the sacrificial substrate. An etch stop layer is formed on the epitaxial layer. Carbon atoms are implanted into the etch stop layer. A capping layer and a device layer are formed on the etch stop layer. A handle substrate is bonded to the device layer. The sacrificial substrate, the epitaxial layer, and the etch stop layer having the carbon atoms are removed from the handle substrate.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: March 5, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chi-Ming Chen, Kuei-Ming Chen, Po-Chun Liu, Chung-Yi Yu, Chia-Shiung Tsai
  • Patent number: 6221058
    Abstract: An improved structure of infusion catheter needle, comprised of a infusion soft needle, a steel needle protection, a steel needle and a steel needle chute; within, the chute is a long narrow casing provided with a catch above and an opening below, a catch is provided each on the external side close to where above the opening; a barrel to connect air exchange and blood back-flow mechanism is provided at a steel needle base in the chute; a square eyelet is each provided at both sides to the base to penetrate into the catch part of the chute for the base to move within the chute and engage the catch; a rubber plug provided at the tip of a one end in cone shape of the needle protection is inserted into the needle tube to secure the steel needle therein while the other end of the needle protection is provided with a joint to be inserted into the catch part, and a square eyelet corresponding to that from the base is each provided on both sides of the joint; so that after use, the steel needle is secured by the catc
    Type: Grant
    Filed: February 1, 2000
    Date of Patent: April 24, 2001
    Inventors: Wang-Hsiang Kao, Kuei-Chun Chen
  • Patent number: 6171284
    Abstract: An improved structure syringe needle cover comprised of a sleeve, a coil spring, and a mount, wherein the sleeve is installed over the syringe needle and has minute hole disposed through it and, furthermore, a press release section is situated along the two exterior sides of the protective head thereby formed, with a hollow expandable and contractible space having a number of break lines along the two sides extending through its center section. Formed in the lower section is a passage that is aligned with the minute hole of the upper section and has an annular groove disposed around the exterior and, furthermore, there is a conjoinment section at the two sides of the annular groove.
    Type: Grant
    Filed: March 15, 2000
    Date of Patent: January 9, 2001
    Inventors: Wang-Hsiang Kao, Kuei-Chun Chen