Abstract: A one-piece formed metal heat dissipation plate includes a substrate and multiple heat dissipation strips arranged in a longitudinal direction. The substrate includes a first surface and a second surface arranged opposite to each other. Each of the heat dissipation strips includes two connection ends connected to the first surface, at least two ridge portions arranged between the two connection ends, and multiple concave-convex tooth portions formed on at least one side of at least one of the ridge portions. A cut slot is defined in the substrate corresponding to the at least two ridge portions of each heat dissipation strip, and the cut slot penetrates the first surface and the second surface.

Abstract: A light-emitting diode having a silicon submount includes a silicon submount and a light-emitting diode (LED) chip. The silicon submount includes a power management integrated circuit formed in an inside of the silicon submount, a P-electrode formed on a bottom side thereof, an N-electrode formed on the bottom side thereof, and a heat dissipation ground portion formed on the bottom side thereof. The power management integrated circuit is electrically coupled to the P-electrode and the N-electrode. The LED chip is eutecticly bonded to a top side of the silicon submount, and the LED chip is electrically coupled to the P-electrode and the N-electrode. A heat-dissipation channel is defined from the LED chip to the heat dissipation ground portion via the inside of the silicon submount. The power management integrated circuit replaces a conventional power supply controller, thereby providing a more optimized LED.

Abstract: A light emitting device includes: a heat dissipating plate having first and second regions, the first region having a mesa with a first top surface, the second region having a second top surface, the first top surface being higher than the second top surface; a circuit board disposed above the heat dissipating plate, and including a first area that has a through hole to permit the mesa to extend therethrough and that directly contacts the second top surface of the second region of the heat dissipating plate, and a second area that does not contact the heat dissipating plate; and a light emitting element disposed on the mesa of the heat dissipating plate and electrically connected to the conductive layer.

Abstract: A light emitting device includes: a heat dissipating plate having first and second regions, the first region having a mesa with a first top surface, the second region having a second top surface, the first top surface being higher than the second top surface; a circuit board disposed above the heat dissipating plate, and including a first area that has a through hole to permit the mesa to extend therethrough and that directly contacts the second top surface of the second region of the heat dissipating plate, and a second area that does not contact the heat dissipating plate; and a light emitting element disposed on the mesa of the heat dissipating plate and electrically connected to the conductive layer.

Abstract: A light emitting assembly includes: a heat sink having a base wall and at least one mesa protruding from the base wall; and at least one light emitting package unit having at least one light emitting package bonded to the mesa so as to transfer heat generated from the light emitting package to the base wall through the mesa. A circuit board includes a substrate that is formed with at least one through-hole, and is provided with a conductive contact unit that is formed on the substrate. The heat sink is attached to the substrate such that the mesa protrudes from the base wall into and through the through-hole in the substrate so as to be bonded to the light emitting package.

Abstract: A lighting apparatus includes a heat-dissipating unit, a circuit board unit, and a lighting unit. The heat-dissipating unit includes a base wall that extends in a longitudinal direction. The base wall has a top side and a bottom side formed with a convex surface portion. The circuit board unit is disposed on the base wall. The lighting unit includes an outer pair of light emitting sets and at least one other light emitting set disposed between the outer pair of the light emitting sets. The light emitting sets are disposed on the convex surface portion and are coupled electrically to the circuit board unit. Each of the light emitting sets has a plurality of light emitting units that are spaced apart from each other. A number of the light emitting units in each light emitting set in the outer pair is larger than a number of the light emitting units in each of the other light emitting sets.

Abstract: A light emitting assembly includes: a heat sink having a base wall and at least one mesa protruding from the base wall; and at least one light emitting package unit having at least one light emitting package bonded to the mesa so as to transfer heat generated from the light emitting package to the base wall through the mesa. A circuit board includes a substrate that is formed with at least one through-hole, and is provided with a conductive contact unit that is formed on the substrate. The heat sink is attached to the substrate such that the mesa protrudes from the base wall into and through the through-hole in the substrate so as to be bonded to the light emitting package.

Abstract: A lighting apparatus includes a heat-dissipating unit, a circuit board unit, and a lighting unit. The heat-dissipating unit includes a base wall that extends in a longitudinal direction. The base wall has a top side and a bottom side formed with a convex surface portion. The circuit board unit is disposed on the base wall. The lighting unit includes an outer pair of light emitting sets and at least one other light emitting set disposed between the outer pair of the light emitting sets. The light emitting sets are disposed on the convex surface portion and are coupled electrically to the circuit board unit. Each of the light emitting sets has a plurality of light emitting units that are spaced apart from each other. A number of the light emitting units in each light emitting set in the outer pair is larger than a number of the light emitting units in each of the other light emitting sets.

Abstract: A light emitting assembly includes: a heat sink including a base wall and two opposite retaining walls extending upright from the base wall and defining respectively two retaining grooves, each of the retaining walls having a top wall portion confining a top side of a respective one of the retaining grooves; a mounting seat having two opposite wings extending respectively into the retaining grooves; and a light emitting device mounted on the mounting seat and having a bottom wall extending through the mounting seat to abut against the base wall of the heat sink. Each of the wings of the mounting seat is formed with an elastic protrusion that abuts resiliently against the top wall portion of a respective one of the retaining walls.

Abstract: A light emitting device includes: a heat dissipating seat of a metallic material; a chip-mounting base of a semiconductor material attached to the heat dissipating seat; an insulator layer formed on the chip-mounting base; a bonding layer of a metal formed on the insulator layer; and a light emitting chip bonded to the bonding layer.

Abstract: An illumination apparatus includes a heat sink having a circuit-mounting side provided with a heat-conductive insulating film thereon. A lighting device includes a printed circuit provided on the circuit-mounting side of the heat sink and in thermal contact with the heat-conductive insulating film, and a lighting unit having a light emitting diode that is in the form of a chip die, that is connected electrically and wiredly to the printed circuit and that is in thermal contact with the heat-conductive insulating film.

Abstract: A light emitting assembly includes: a heat sink including a base wall and two opposite retaining walls extending upright from the base wall and defining respectively two retaining grooves, each of the retaining walls having a top wall portion confining a top side of a respective one of the retaining grooves; a mounting seat having two opposite wings extending respectively into the retaining grooves; and a light emitting device mounted on the mounting seat and having a bottom wall extending through the mounting seat to abut against the base wall of the heat sink. Each of the wings of the mounting seat is formed with an elastic protrusion that abuts resiliently against the top wall portion of a respective one of the retaining walls.