Abstract: A chemical solution coating apparatus, having a carrier board and a plurality of spray apparatuses. The carrier board is to carry the wafer to be coated, and the spray apparatuses are located at a periphery of the carrier board to evenly spray chemical solution on the wafer. Since the chemical solution is coated on the wafer in a spray manner, so that the unnecessary lapse and process cost are avoided. The number and spraying angle spray apparatuses can be adjusted to reach an optimum status.

Abstract: A spray nozzle resetting device comprises a spray nozzle for spraying resist onto a midpoint of a wafer, a rotary robotic arm that has a resist-delivering duct connected to the spray nozzle, a covering nut, a resetting ring, and a fixing ring. The covering nut has an opening of diameter D. The resetting ring has a rotary part of a diameter less than or equal to D, which fits in the opening of the covering nut, and at least two protrusions. The fixing ring, having two recesses that correspond to the two protrusions and interact with them, is used to connect the covering nut and the rotary robotic arm.

Abstract: A supply apparatus comprises a storage tank, a chemical flow pipe to route a chemical solution into a semiconductor processing room, a pressurizing apparatus to supply gas to the storage tank to make the chemical solution flow into the processing room, and an electro-Pneumatic regulator valve to adjust the pressure of the input gas. The flow control device comprises a flow sensor, a set-up apparatus, and a processor for generating a control signal to the pressurizing apparatus depending on a difference between a target value and a measurement value to adjust the flow of the chemical solution in the chemical flow pipe. The flow sensor comprises a hollow cylinder, a choking magnetic core movably positioned inside the hollow cylinder, and a first and second conductive coil wrapped around the outer wall of the hollow cylinder which uses alternating current to generate a magnetic flux and sense a change in the magnetic flux to measure the flow of chemical solution.

Abstract: A dispensing system used in a spin coater is provided to transport a solvent to a wafer. The dispensing, system includes a switch valve, a sucking-back valve, a solenoid valve, a speed control unit of the sucking-back valve, and a speed control unit of the switch valve. The switch valve controls a solvent dispensing status. The sucking-back valve receives the solvent from the switch valve and exports the solvent to a wafer. The solenoid valve controls the switch valve and the sucking-back valve. The speed control unit of the switch valve is coupled between the switch valve and the solenoid valve and is used for a control of action speed on the switch valve. The speed control unit of the sucking-back valve is coupled between the switch valve and the sucking-back valve, and is used for a control of action speed of the sucking-back valve by a sufficient delay time of action.

Abstract: A cup rinse with a valvular ring according to the invention is disclosed. The valvular ring has a plurality of valves in the center thereof. When an inlet tube is inserted through the valvular ring, the valves are forced to open thereby to allow a chemical liquid to flow into the cup resin via the inlet tube. Inversely when the inlet tube is completely pulled out of the valvular ring, the valves are tightly closed without a chemical liquid leakage. Accordingly, the cup rinse of the invention can prevent peripheral precision instruments, such as a motor, from damage by a leaky chemical liquid. Thus, the cup rinse of the invention cannot cause any unnecessary cost consumption.

Abstract: A rinsing system used in a photoresist coater to remove a brim portion of the formed photoresist layer on a substrate. The rinsing system has capability to avoid a reversed pressure effect. The rinsing system includes several distribution ducts, which are coupled to a solvent container. Each duct includes an one-way valve, an automatically-releasing-gas filter, and a pump with sequential couplings from the solvent container. The pump is used to transport solvent to the substrate to rinse the photoresist layer. The pump also induces the reversed pressure effect, which can be avoided by the automatically-releasing-gas filter, the one-way valve, and the solvent container. The one-way valve includes a spring to hold a ball-like stopper of the valve so that the reversed pressure effect is consumed by the spring force. The automatically-releasing-gas filter contains a gas and includes a releasing-gas valve to release the gas.