Abstract: In an embodiment, a method includes: aligning a first package component with a second package component, the first package component having a first region and a second region, the first region including a first conductive connector, the second region including a second conductive connector; performing a first laser shot on a first portion of a top surface of the first package component, the first laser shot reflowing the first conductive connector of the first region, the first portion of the top surface of the first package component completely overlapping the first region; and after performing the first laser shot, performing a second laser shot on a second portion of the top surface of the first package component, the second laser shot reflowing the second conductive connector of the second region, the second portion of the top surface of the first package component completely overlapping the second region.

Abstract: A fixing frame is used to fix at least one heat sink fan on a case of an electronic device. The fixing frame includes a cradle and at least one fastener. The cradle has two oppositely disposed plates, and the two plates respectively have a combining portion and a latching portion, such that at least one accommodation region is partitioned from the cradle for accommodating the fan, and the latching portion and the combining portion are combined with each other to form a clamping region. The fastener is disposed on the case and clamped in the clamping region, such that the cradle is fixed on the case.