Patents by Inventor Kuei-Lung Chou

Kuei-Lung Chou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5669508
    Abstract: A transportable apparatus, or a pod carrier, is disclosed in conjunction with a standardized mechanical interface system (SMIF) whereby the tracking of transported articles is made easier and more reliable. This is accomplished by affixing a card-holder to the pod carrier. The card-holder can hold the process run-cards snugly, or otherwise, at all times in such a way that the cards are visible and amenable to expeditious processing. It is shown that by extending the function of a pod carrier to a tracking device as well, the probability of lost run-cards and the concomitant lost time in the manufacturing line, and/or missteps in the processing of parts are reduced.
    Type: Grant
    Filed: May 28, 1996
    Date of Patent: September 23, 1997
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-Chin Chen, Kuei-Lung Chou
  • Patent number: 5629237
    Abstract: A method is described for forming tapered contact via holes in large scale integrated circuit structures which avoids the formation of a re-entrance profile. The re-entrance profile can form at the entrance to the contact via hole when a dry etch is used as a first etching step by redepositing material removed during the dry etch at the entrance of the contact via hole. This re-entrance profile makes the angle of entrance into the contact via hole greater than 90.degree. and the step coverage of metal filling the hole poor. This invention uses wet etching with a greater lateral etch rate than vertical etch rate as a first etching step in the formation of the contact via hole and avoids the formation of the re-entrance profile. The edges of the resulting contact via hole are smooth and the entrance angle into the contact via hole is substantially less than 90.degree.. The step coverage of metal later filling the contact via hole is substantially improved.
    Type: Grant
    Filed: October 19, 1995
    Date of Patent: May 13, 1997
    Assignee: Taiwan Semiconductor Manufacturing Company Ltd.
    Inventors: Pei-Jan Wang, Kuei-Lung Chou, Jiunn-Jyi Lin, Hsien-Wen Chang