Patents by Inventor Kuei-Sen Cheng
Kuei-Sen Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9955588Abstract: The present disclosure relates to a multilayer carrier foil, a core structure formed using the multilayer carrier foil, printed circuit boards, and electronic devices. The multilayer carrier foil comprises: (a) a copper carrier layer having a release side and a laminate side, the laminate side of carrier layer optionally having nodules; (b) a chromium release layer applied to the copper carrier layer; (c) an intermediate copper layer applied to the chromium release layer; (d) an anti-migration layer applied to the intermediate copper layer of (c); and (e) an ultra-thin copper layer applied to the anti-migration layer of (d). The disclosure further relates to methods of making the multi-layer carrier foil, the core structure, and printed circuit boards.Type: GrantFiled: November 28, 2016Date of Patent: April 24, 2018Assignee: CHANG CHUN PETROCHEMICAL CO., LTD.Inventors: Yao-Sheng Lai, Kuei-Sen Cheng, Jui-Chang Chou
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Publication number: 20170203544Abstract: A copper foil having a matte side with nickel plated thereon in an amount of nickel in the range of 100,000-300,000 ?s/dm2. The plated copper foils have particular utility in Positive Temperature Coefficient (PTC) devices. The plated copper foils have a surface hardness of from 50 to 200, a tensile strength greater than 45 kg/mm2 and a shiny side surface roughness (Rz) not exceeding 2.0 ?m. The surface roughness of the matte side of the copper foil is in the range of 6 to 10 ?m. Copper nodules are present on the matte side of the copper foil between the copper foil and the nickel plating. Methods of producing the copper foil and PTC devices incorporating the copper foil are described.Type: ApplicationFiled: January 14, 2016Publication date: July 20, 2017Inventors: Kuei-Sen Cheng, Shih-Cheng Tseng, Tsang-Jin Juo
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Patent number: 9707738Abstract: A copper foil having a matte side with nickel plated thereon in an amount of nickel in the range of 100,000-300,000 ?s/dm2. The plated copper foils have particular utility in Positive Temperature Coefficient (PTC) devices. The plated copper foils have a surface hardness of from 50 to 200, a tensile strength greater than 45 kg/mm2 and a shiny side surface roughness (Rz) not exceeding 2.0 ?m. The surface roughness of the matte side of the copper foil is in the range of 6 to 10 ?m. Copper nodules are present on the matte side of the copper foil between the copper foil and the nickel plating. Methods of producing the copper foil and PTC devices incorporating the copper foil are described.Type: GrantFiled: January 14, 2016Date of Patent: July 18, 2017Assignee: Chang Chun Petrochemical Co., Ltd.Inventors: Kuei-Sen Cheng, Shih-Cheng Tseng, Tsang-Jin Juo
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Patent number: 9711799Abstract: The present disclosure relates to an improved electrodeposited copper foil having uniform thickness and methods for manufacturing the electrodeposited copper foil. The electrodeposited copper foil typically has one to four interfacial lines through the cross-sectional area of the foil and a weight deviation less than 2.0%. The disclosure also relates to a process for making the electrodeposited copper foil that includes the addition of one or more insulative masks to the surface of a dimensionally stable anode. The insulative mask is cut to correspond to areas of variation in electrodeposited copper foil, such that the mask causes interferences with the electrodeposition process to even out the variation.Type: GrantFiled: October 3, 2016Date of Patent: July 18, 2017Assignee: Chang Chun Petrochemical Co., Ltd.Inventors: Yao-Sheng Lai, Kuei-Sen Cheng, Jui-Chang Chou
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Patent number: 9709348Abstract: A method of producing a composite heat dissipating structure by depositing a slurry of graphene particles upon a copper foil, drying the slurry to form a layer of graphene in contact with the copper foil, and consolidating the layer of graphene under pressure to reduce the thickness of the graphene layer and recovering the composite heat dissipating structure. Heat dissipating copper foils and composite heat dissipating structures and electronic devices incorporating the same are also disclosed herein.Type: GrantFiled: October 7, 2016Date of Patent: July 18, 2017Assignee: Chang Chun Petrochemical Co., Ltd.Inventor: Kuei-Sen Cheng
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Patent number: 9673646Abstract: Disclosed are novel copper foils used as components of wireless charging systems. The copper foils can be laminated to produce flexible copper clad laminates, which can then be etched to form printed circuits (coils). The coils can be used as either, or both, of a receiver wireless charging circuit and/or a transmitter wireless charging circuit. Regulation of the chemical and physical properties of the copper foil produces higher efficiencies in the wireless charging system components.Type: GrantFiled: August 19, 2016Date of Patent: June 6, 2017Assignee: Chang Chun Petrochemical Co., Ltd.Inventors: Kuei-Sen Cheng, Yao-Sheng Lai
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Patent number: 9647272Abstract: The present disclosure relates to a surface-treated copper foil which exhibits excellent affinity for an active material layer that is applied to the copper foil in the manufacture of a negative electrode (anode), for use in secondary lithium-ion batteries. The copper foil is plated with chromium and zinc and subsequently subjected to an organic treatment. The surface-treated copper has a surface tension of 34 to 58 dyne/cm and a surface roughness (Rz) of 0.8 to 2.5 ?m, and comprises: (a) copper foil; (b) a zinc-chromium layer plated one or both sides of the copper foil, wherein the zinc content in the zinc-chromium layer is from 10 to 120 ?g/dm2 and the chromium content in the zinc-chromium layer is from 10 to 35 ?g/dm2; and (c) an organic hydrophobic layer applied to the zinc-chromium layer.Type: GrantFiled: January 14, 2016Date of Patent: May 9, 2017Assignee: Chang Chun Petrochemical Co., Ltd.Inventors: Kuei-Sen Cheng, Yao-Sheng Lai, Hsi-Hsing Lo, Huei-Fang Huang
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Publication number: 20170115074Abstract: A method of producing a composite heat dissipating structure by depositing a slurry of graphene particles upon a copper foil, drying the slurry to form a layer of graphene in contact with the copper foil, and consolidating the layer of graphene under pressure to reduce the thickness of the graphene layer and recovering the composite heat dissipating structure. Heat dissipating copper foils and composite heat dissipating structures and electronic devices incorporating the same are also disclosed herein.Type: ApplicationFiled: October 7, 2016Publication date: April 27, 2017Inventor: Kuei-Sen Cheng
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Patent number: 9562298Abstract: An electrodeposited copper foil having a texture coefficient of a plane (200) from 50 to 80%, based on the sum of the texture coefficients of a plane (111), the plane (200), a plane (220) and a plane (200) of the electrodeposited copper foil is provided. The electrodeposited copper foil is particularly suitable for use in the applications in printed circuit boards and lithium ion secondary batteries.Type: GrantFiled: September 15, 2014Date of Patent: February 7, 2017Assignee: Chang Chun Petrochemical Co., Ltd.Inventors: Jui-Chang Chou, Kuei-Sen Cheng, Yao-Sheng Lai, Hsi-Hsing Lo, Yueh-Min Liu
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Patent number: 9397343Abstract: The present disclosure relates to a copper foil which exhibits surprising anti-deformation properties (e.g., it is resistant to swelling, sagging, and wrinkling). Typically, the copper foil has (a) a shiny side with a surface roughness (Rz) in the range of 0.6 to 1.9 ?m; (b) a matte side with a surface roughness (Rz) in the range of 0.6 to 1.9 ?m; and (c) a lightness L* value of the matte side, based on the L*a*b* color system, in the range of 12 to 35. The disclosure further relates to an anode comprising an anode active material on an anode current collector, wherein the anode current collector includes the above-mentioned copper foil. The anodes are used in, for example, lithium ion secondary batteries.Type: GrantFiled: October 15, 2015Date of Patent: July 19, 2016Assignee: Chang Chun Petrochemical Co., Ltd.Inventors: Kuei-Sen Cheng, Yao-Sheng Lai, Yueh-Min Liu, Jui-Chang Chou
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Patent number: 9388371Abstract: An electrolytic copper foil includes a copper foil body; and a IIA-group metal adhered to a surface of the copper foil body, wherein a signal strength of the IIA group metal is greater than 0.1% based on a signal strength of copper element as 100% analyzed by a secondary ion mass spectrometer. The present invention also provides a method for cleaning copper foil and a cleaning fluid composition which is used in the cleaning method.Type: GrantFiled: October 4, 2013Date of Patent: July 12, 2016Assignee: Chang Chun Petrochemical Co., Ltd.Inventors: Kuei-Sen Cheng, Yao-Sheng Lai, Tsang-Jin Juo, Jui-Chang Chou, Hsi-Hsing Lo, Yueh-Min Liu
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Patent number: 9365940Abstract: The present invention provides a method for producing a porous copper foil. The method of the present invention includes the steps of forming an oxide film by providing a chromium-containing compound to a metal surface of a cathode; forming a copper foil on the oxide film by performing electrolysis of copper; and removing the copper foil from the metal surface of the cathode. The method of the present invention is simple and time-saving, and the porous copper foil of the present invention has reduced roughness difference between both sides of the porous copper foil.Type: GrantFiled: January 11, 2011Date of Patent: June 14, 2016Assignee: Chang Chun Petrochemical Co., Ltd.Inventors: Chen-Ping Tsai, Jui-Chang Chou, Kuei-Sen Cheng
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Patent number: 9365942Abstract: An electrolytic copper foil is provided. The electrolytic copper foil has a shiny side and a matte side opposing to the shiny side, wherein the difference in roughness between the shiny side and the matte side is 0.5 ?m or less. The electrolytic copper foil has a tensile strength of 45 kg/mm2 or above, and is particularly suitable for applications in a lithium ion secondary battery.Type: GrantFiled: October 25, 2013Date of Patent: June 14, 2016Assignee: CHANG CHUN PETROCHEMICAL CO., LTD.Inventors: Chen-Ping Tsai, Kuei-Sen Cheng, Chyen-Fu Lin
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Patent number: 9287566Abstract: The present disclosure relates to an improved coated copper foil that exhibits anti-curl and anti-wrinkle properties; and to methods for manufacturing the foil. Typically, the copper foil of the instant disclosure has: (a) a shiny side; (b) a matte side, wherein the matte side has an MD gloss in the range of 330 to 620; (c) a difference in surface roughness (Rz) between the shiny side and the matte side in the range of 0.3 to 0.59 ?m; and (d) a difference in tensile strength in the transverse direction of 1.2 kgf/mm2 or less.Type: GrantFiled: June 11, 2015Date of Patent: March 15, 2016Assignee: CHANG CHUN PETROCHEMICAL CO., LTD.Inventors: Jui-Chang Chou, Kuei-Sen Cheng, Yao-Sheng Lai, Huei-Fang Huang
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Patent number: 9209485Abstract: An electrolytic copper foil, which is particularly suitable for the application of a lithium ion secondary battery, has a shiny side and a matte side with a roughness of less than 2 ?m. Based on the total sum of the texture coefficients of a (111) surface, a (200) surface, a (220) surface and a (311) surface of the electrolytic copper foil, the sum of the texture coefficients of the (220) surface and the (311) surface of the electrolytic copper foil is greater than 60%.Type: GrantFiled: March 18, 2014Date of Patent: December 8, 2015Assignee: CHANG CHUN PETROCHEMICAL CO. LTD.Inventors: Kuei-Sen Cheng, Chyen-Fu Lin, Jui-Chang Chou, Chih-Sheng Lu
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Publication number: 20150267313Abstract: An electrodeposited copper foil having a texture coefficient of a plane (200) from 50 to 80%, based on the sum of the texture coefficients of a plane (111), the plane (200), a plane (220) and a plane (200) of the electrodeposited copper foil is provided. The electrodeposited copper foil is particularly suitable for use in the applications in printed circuit boards and lithium ion secondary batteries.Type: ApplicationFiled: September 15, 2014Publication date: September 24, 2015Applicant: Chang Chun Petrochemical Co., Ltd.Inventors: Jui-Chang Chou, Kuei-Sen Cheng, Yao-Sheng Lai, Hsi-Hsing Lo, Yueh-Min Liu
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Publication number: 20150225678Abstract: An electrolytic copper foil includes a copper foil body; and a IIA-group metal adhered to a surface of the copper foil body, wherein a signal strength of the IIA group metal is greater than 0.1% based on a signal strength of copper element as 100% analyzed by a secondary ion mass spectrometer. The present invention also provides a method for cleaning copper foil and a cleaning fluid composition which is used in the cleaning method.Type: ApplicationFiled: April 24, 2015Publication date: August 13, 2015Applicant: Chang Chun Petrochemical Co., Ltd.Inventors: Kuei-Sen Cheng, Yao-Sheng LAI, Tsang-Jin JUO, Jui-Chang CHOU, Hsi-Hsing LO, Yueh-Min LIU
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Publication number: 20150037606Abstract: An electrolytic copper foil includes a copper foil body; and a IIA-group metal adhered to a surface of the copper foil body, wherein a signal strength of the IIA group metal is greater than 0.1% based on a signal strength of copper element as 100% analyzed by a secondary ion mass spectrometer. The present invention also provides a method for cleaning copper foil and a cleaning fluid composition which is used in the cleaning method.Type: ApplicationFiled: October 4, 2013Publication date: February 5, 2015Applicant: Chang Chun Petrochemical Co., Ltd.Inventors: Kuei-Sen CHENG, Yao-Sheng LAI, Tsang-Jin JUO, Jui-Chang CHOU, Hsi-Hsing LO, Yueh-Min LIU
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Publication number: 20150030873Abstract: An electrolytic copper foil, which is particularly suitable for the application of a lithium ion secondary battery, has a shiny side and a matte side with a roughness of less than 2 ?m. Based on the total sum of the texture coefficients of a (111) surface, a (200) surface, a (220) surface and a (311) surface of the electrolytic copper foil, the sum of the texture coefficients of the (220) surface and the (311) surface of the electrolytic copper foil is greater than 60%.Type: ApplicationFiled: March 18, 2014Publication date: January 29, 2015Applicant: Chang Chun Petrochemical Co., Ltd.Inventors: Kuei-Sen Cheng, Chyen-Fu Lin, Jui-Chang Chou, Chih-Sheng Lu
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Publication number: 20140193660Abstract: An electrolytic copper foil is provided. The electrolytic copper foil has a shiny side and a matte side opposing to the shiny side, wherein the difference in roughness between the shiny side and the matte side is 0.5 ?m or less. The electrolytic copper foil has a tensile strength of 45 kg/mm2 or above, and is particularly suitable for applications in a lithium ion secondary battery.Type: ApplicationFiled: October 25, 2013Publication date: July 10, 2014Applicant: CHANG CHUN PETROCHEMICAL CO., LTD.Inventors: Chen-Ping Tsai, Kuei-Sen Cheng, Chyen-Fu Lin