Patents by Inventor Kuei-Seng Cheng

Kuei-Seng Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electrodeposited copper foil with low repulsive force
    Patent number: 10190225
    Abstract: The present disclosure relates to a copper foil that exhibits surprising low repulsive force characteristics; and to methods for manufacturing such copper foils. Typically, the copper foil has (a) a lightness L* value of the nodule untreated side, based on the L*a*b color system, in the range of 75 to 90 and (b) a normal tensile strength in the range of 40 kgf/mm2 to 55 kgf/mm2. The disclosure further relates to flexible printed circuit boards and electronic devices using the above-mentioned copper foils for forming conductive lines therein.
    Type: Grant
    Filed: April 18, 2017
    Date of Patent: January 29, 2019
    Assignee: CHANG CHUN PETROCHEMICAL CO., LTD.
    Inventors: Yao-Sheng Lai, Kuei-Seng Cheng, Jian-Ming Huang
  • ELECTRODEPOSITED COPPER FOIL WITH LOW REPULSIVE FORCE
    Publication number: 20180298508
    Abstract: The present disclosure relates to a copper foil that exhibits surprising low repulsive force characteristics; and to methods for manufacturing such copper foils. Typically, the copper foil has (a) a lightness L* value of the nodule untreated side, based on the L*a*b color system, in the range of 75 to 90 and (b) a normal tensile strength in the range of 40 kgf/mm2 to 55 kgf/mm2. The disclosure further relates to flexible printed circuit boards and electronic devices using the above-mentioned copper foils for forming conductive lines therein.
    Type: Application
    Filed: April 18, 2017
    Publication date: October 18, 2018
    Applicant: CHANG CHUN PETROCHEMICAL CO., LTD.
    Inventors: Yao-Sheng LAI, Kuei-Seng Cheng, Jian-Ming Huang
  • ELECTRODEPOSITED COPPER FOIL WITH LOW REPULSIVE FORCE
    Publication number: 20180298509
    Abstract: The present disclosure relates to a copper foil that exhibits surprising low repulsive force characteristics; and to methods for manufacturing such copper foils. Typically, the copper foil has (a) a lightness L* value of the nodule untreated side, based on the L*a*b color system, in the range of 75 to 90 and (b) a normal tensile strength in the range of 40 kgf/mm2 to 55 kgf/mm2. The disclosure further relates to flexible printed circuit boards and electronic devices using the above-mentioned copper foils for forming conductive lines therein.
    Type: Application
    Filed: June 19, 2017
    Publication date: October 18, 2018
    Applicant: CHANG CHUN PETROCHEMICAL CO., LTD.
    Inventors: Yao-Sheng LAI, Kuei-Seng CHENG, Jian-Ming HUANG
  • Electrodeposited copper foil with low repulsive force
    Patent number: 10081875
    Abstract: The present disclosure relates to a copper foil that exhibits surprising low repulsive force characteristics; and to methods for manufacturing such copper foils. Typically, the copper foil has (a) a lightness L* value of the nodule untreated side, based on the L*a*b color system, in the range of 75 to 90 and (b) a normal tensile strength in the range of 40 kgf/mm2 to 55 kgf/mm2. The disclosure further relates to flexible printed circuit boards and electronic devices using the above-mentioned copper foils for forming conductive lines therein.
    Type: Grant
    Filed: June 19, 2017
    Date of Patent: September 25, 2018
    Assignee: CHANG CHUN PETROCHEMICAL CO., LTD.
    Inventors: Yao-Sheng Lai, Kuei-Seng Cheng, Jian-Ming Huang