Abstract: A manufacturing method of a semiconductor device includes at least the following steps. A sacrificial substrate is provided. An epitaxial layer is formed on the sacrificial substrate. An etch stop layer is formed on the epitaxial layer. Carbon atoms are implanted into the etch stop layer. A capping layer and a device layer are formed on the etch stop layer. A handle substrate is bonded to the device layer. The sacrificial substrate, the epitaxial layer, and the etch stop layer having the carbon atoms are removed from the handle substrate.

Abstract: The invention is related to methods and apparatus that advantageously provide compatibility between two or more different computer systems, such as computers used in a manufacturing environment, e.g., a foundry for semiconductor fabrication. For example, a first computer system with a first operating system, such as OS/2® from IBM Corporation, and a second computer system with a second operating system, such as Windows® NT® from Microsoft Corporation. In one embodiment, a transfer module permits an application that executes in the IBM® OS/2® operating system access to files maintained in a component object model (COM+) format from Microsoft Corporation. A routing module transfers data to and from a module with functions created in the component object model (COM+) format. One embodiment of the routing module routes data according to one of four selectable processing paths termed TAPCOM, COMTAP, TAPCOMTAP, and COMTAPCOM.

Abstract: The present invention provides a throughput monitoring and analysis system and method, comprising: a factor-fetching means and a terminal means. Wherein the factor-fetching means fetches a plurality of raw time data of the production factors corresponding to selected operation events during execution of operation events of the complex machine. The terminal means stores the time data and related information of the production factors and displaying the monitoring results according to set required condition and the data and information.

Abstract: The invention is related to methods and apparatus that advantageously provide compatibility between two or more different computer systems, such as computers used in a manufacturing environment, e.g., a foundry for semiconductor fabrication. For example, a first computer system with a first operating system, such as OS/2® from IBM Corporation, and a second computer system with a second operating system, such as Windows® NT® from Microsoft Corporation. In one embodiment, a transfer module permits an application that executes in the IBM® OS/2® operating system access to files maintained in a component object model (COM+) format from Microsoft Corporation. A routing module transfers data to and from a module with functions created in the component object model (COM+) format. One embodiment of the routing module routes data according to one of four selectable processing paths termed TAPCOM, COMTAP, TAPCOMTAP, and COMTAPCOM.

Abstract: The present invention provides a throughput monitoring and analysis system and method, comprising: a factor-fetching means and a terminal means. Wherein the factor-fetching means fetches a plurality of raw time data of the production factors corresponding to selected operation events during execution of operation events of the complex machine. The terminal means stores the time data and related information of the production factors and displaying the monitoring results according to set required condition and the data and information.