Patents by Inventor Kuem Dong HEO

Kuem Dong HEO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer processing apparatus and wafer processing method
    Patent number: 12322607
    Abstract: A wafer processing apparatus of the present invention includes a suction nozzle configured to suction sludge from a cup housing, a flow line connected to the suction nozzle such that the sludge and a chemical solution flow therein, a suction tank connected to the flow line such that the sludge and the chemical solution flow thereto, and an ejector installed on a flow line to generate suction pressure in the suction nozzle and the flow line.
    Type: Grant
    Filed: April 20, 2022
    Date of Patent: June 3, 2025
    Assignee: ZEUS CO., LTD.
    Inventors: Seung Dae Baek, Kuem Dong Heo, Kang Won Lee, Woon Kong
  • WAFER CLEANING APPARATUS AND METHOD OF CONTROLLING THE SAME
    Publication number: 20250062154
    Abstract: A wafer cleaning apparatus of the present invention includes a vacuum chuck unit on which a wafer is mounted, a ring cover unit facing a retainer ring portion of the wafer, an expander module installed to move the ring cover unit and configured to press the retainer ring portion toward the vacuum chuck unit such that a gap between dies of the wafer widens, and a chucking module installed in the vacuum chuck unit to restrain the ring cover unit pressed by the expander module to the vacuum chuck unit.
    Type: Application
    Filed: November 6, 2024
    Publication date: February 20, 2025
    Applicant: ZEUS CO., LTD.
    Inventors: Seung Dae BAEK, Kuem Dong HEO, Sung Yup KIM, Jae Hwan SON, Nam Jin KIM, Jun Goo PARK
  • Wafer cleaning apparatus and method of controlling the same
    Patent number: 12154819
    Abstract: A wafer cleaning apparatus of the present invention includes a vacuum chuck unit on which a wafer is mounted, a ring cover unit facing a retainer ring portion of the wafer, an expander module installed to move the ring cover unit and configured to press the retainer ring portion toward the vacuum chuck unit such that a gap between dies of the wafer widens, and a chucking module installed in the vacuum chuck unit to restrain the ring cover unit pressed by the expander module to the vacuum chuck unit.
    Type: Grant
    Filed: April 12, 2022
    Date of Patent: November 26, 2024
    Assignee: ZEUS CO., LTD.
    Inventors: Seung Dae Baek, Kuem Dong Heo, Sung Yup Kim, Jae Hwan Son, Nam Jin Kim, Jun Goo Park
  • WAFER PROCESSING METHOD
    Publication number: 20230048466
    Abstract: A wafer processing method of the present invention includes mounting a wafer part on a chuck table, loading a ring cover unit on the chuck table to restrain the wafer part to the chuck table, spraying, by a spray suction arm module, a processing solution onto the wafer part and suctioning, by the spray suction arm module, foreign materials from the processing solution, unloading the ring cover unit from the chuck table, and spraying, by a spray arm module, a cleaning solution onto the wafer part to clean the wafer part.
    Type: Application
    Filed: July 15, 2022
    Publication date: February 16, 2023
    Applicant: ZEUS CO., LTD.
    Inventors: Seung Dae BAEK, Kuem Dong HEO, Jin Won KIM, Jae Hwan SON, Kang Won LEE
  • WAFER PROCESSING APPARATUS AND WAFER PROCESSING METHOD
    Publication number: 20220344177
    Abstract: A wafer processing apparatus of the present invention includes a suction nozzle configured to suction sludge from a cup housing, a flow line connected to the suction nozzle such that the sludge and a chemical solution flow therein, a suction tank connected to the flow line such that the sludge and the chemical solution flow thereto, and an ejector installed on a flow line to generate suction pressure in the suction nozzle and the flow line.
    Type: Application
    Filed: April 20, 2022
    Publication date: October 27, 2022
    Applicant: ZEUS CO., LTD.
    Inventors: Seung Dae BAEK, Kuem Dong HEO, Kang Won LEE, Woon KONG
  • WAFER CLEANING APPARATUS AND METHOD OF CONTROLLING THE SAME
    Publication number: 20220344194
    Abstract: A wafer cleaning apparatus of the present invention includes a vacuum chuck unit on which a wafer is mounted, a ring cover unit facing a retainer ring portion of the wafer, an expander module installed to move the ring cover unit and configured to press the retainer ring portion toward the vacuum chuck unit such that a gap between dies of the wafer widens, and a chucking module installed in the vacuum chuck unit to restrain the ring cover unit pressed by the expander module to the vacuum chuck unit.
    Type: Application
    Filed: April 12, 2022
    Publication date: October 27, 2022
    Applicant: ZEUS CO., LTD.
    Inventors: Seung Dae BAEK, Kuem Dong HEO, Sung Yup KIM, Jae Hwan SON, Nam Jin KIM, Jun Goo PARK