Abstract: A heat sink having a flexible heat sink base is disclosed in order to flex the heat sink into contact with concave heat sources. Flexibility is achieved by providing a series of concentric grooves on the heat sink base on a surface opposite the surface contacting the heat source. A central cylinder is provided at the center of the concentric grooves. A biasing device, such as a spring, exerts a force on the central cylinder to flex the heat sink base.

Abstract: A heat sink having a flexible heat sink base is disclosed in order to flex the heat sink into contact with concave heat sources. Flexibility is achieved by providing a series of concentric grooves on the heat sink base on a surface opposite the surface contacting the heat source. A central cylinder is provided at the center of the concentric grooves. A biasing device, such as a spring, exerts a force on the central cylinder to flex the heat sink base.

Abstract: A coolant gas, multi-filter filtering unit, for use with servers and other electrical equipment that can be utilized as a retrofit device for existing servers or provided as OEM equipment with the server is described. A series of static centrifugal force filtering units are position upstream of a replaceable surface filter. The surface filter can be a HEPA filter, or alternatively include an absorbent layer or separate third filter of charcoal to remove VOCs.

Abstract: A heat transfer system between a heat source and a heat sink, wherein the heat transfer contact surfaces comprise a metal which forms numerous voids when placed adjacent one another. A thermal pad comprising a polymer filled with ceramic particles is placed between these heat transfer surfaces to intimately contact each of the metal surfaces without void formation, thereby increasing thermal conductivity. The heat source and heat sink are joined by relative sliding motion. This sliding motion might damage the thermal pad. Thus, a hot swap structure is provided for controlling the movement of the thermal pad into contact with the heat source as the sliding motion is completed.

Abstract: A heat transfer system between a heat source and a heat sink, wherein the heat transfer contact surfaces comprise a metal which forms numerous voids when placed adjacent one another. A thermal pad comprising a polymer filled with ceramic particles is placed between these heat transfer surfaces to intimately contact each of the metal surfaces without void formation, thereby increasing thermal conductivity. The heat source and heat sink are joined by relative sliding motion. This sliding motion might damage the thermal pad. Thus, a hot swap structure is provided for controlling the movement of the thermal pad into contact with the heat source as the sliding motion is completed.

Abstract: A fan assembly is disclosed to prevent reverse air flow when the fan stops working. The assembly has a fan module including an intake end, a motor casing and a motor propelling a fan. A louver module has a plurality of slats having an open position to allow air flow and a closed position to block air flow. The louver module is coupled to the motor casing to provide a seal between the louver module and the motor casing.

Abstract: A heat dissipating apparatus for cooling a transceiver is provided. The apparatus includes a cooling jacket configured to receive the transceiver. The transceiver is secured within the cooling jacket via a connecting structure. The apparatus also includes cooling devices secured to an exterior surface of the cooling jacket, the plurality of cooling devices comprising a highly thermal conductivity material. The apparatus also includes a heat dissipation device connected to a distal end of each of the plurality of cooling devices.

Abstract: A transceiver cage and heat sink assembly for an optical switch is disclosed. A transceiver cage has an open front end to receive an optical transceiver and an opposite rear end. A front heat sink is mounted over the transceiver cage that includes a thermal interface material to contact a contact surface of an optical transceiver. A printed circuit board has a connector electronic circuit to receive a connector on the optical transceiver. A rear heat sink has a beveled surface facing the rear end of the transceiver cage. A cam structure in the front heat sink forces the transceiver into contact with the front heat sink. A metal foil layer is coated on the thermal interface material.

Abstract: A coolant gas, multi-filter filtering unit, for use with servers and other electrical equipment that can be utilized as a retrofit device for existing servers or provided as OEM equipment with the server is described. A series of static centrifugal force filtering units are position upstream of a replaceable surface filter. The surface filter can be a HEPA filter, or alternatively include an absorbent layer or separate third filter of charcoal to remove VOCs.

Abstract: A cooling system for providing streamlined airflow is provided. The system includes a fan with a plurality of fan blades configured to rotate in a fan direction. The system also includes a shroud component abutting the fan upstream. The shroud component includes a plurality of blade farings, a spinner faring, and optionally a strut interconnecting each of the plurality of blade farings.

Abstract: A transceiver cage and heat sink assembly for an optical switch is disclosed. A transceiver cage has an open front end to receive an optical transceiver and an opposite rear end. A front heat sink is mounted over the transceiver cage that includes a thermal interface material to contact a contact surface of an optical transceiver. A printed circuit board has a connector electronic circuit to receive a connector on the optical transceiver. A rear heat sink has a beveled surface facing the rear end of the transceiver cage. A cam structure in the front heat sink forces the transceiver into contact with the front heat sink. A metal foil layer is coated on the thermal interface material.

Abstract: A heat dissipating apparatus for cooling a transceiver is provided. The apparatus includes a cooling jacket configured to receive the transceiver. The transceiver is secured within the cooling jacket via a connecting structure. The apparatus also includes cooling devices secured to an exterior surface of the cooling jacket, the plurality of cooling devices comprising a highly thermal conductivity material. The apparatus also includes a heat dissipation device connected to a distal end of each of the plurality of cooling devices.

Abstract: This invention is a novel silicon carbide and silicon (SiC/Si) heterostructure N-shaped negative-differential-resistance semiconductor switch having low power dissipation and large on/off current ratio. The structure of the semiconductor switch includes Al electrode/p-type single crystal silicon carbide layer/graded-composition layer/n-type single crystal silicon substrate/Al electrode (Al/p-SiC/GCL/n-Si/Al), wherein the graded-composition layer is a buffer layer between the p-SiC and n-Si layers.

Abstract: The present invention relates to the structure and fabrication process of a high-gain monocrystal Silicon Carbide phototransistor applicable at high temperature. In view of the optical gain and applicable temperature of the conventional n-p-n type Silicon Carbide phototransistor are too low for practical usage, the present invention utilizes a newly developed n-i-p-i-n structure to strengthen the intrinsic properties of the element, in order to enhance optical gain of the phototransistor for being able to operate at high temperature steadily.

Abstract: A method of manufacturing single-crystal silicon carbide/single-crystal silicon heterojunctions with negative differential resistance, by which one or more single-crystal silicon carbide/single-crystal silicon layer(s) with different types of dopants is/are formed on a silicon substrate, thereby forming new-type multiple negative differential resistance based on (a) single-crystal silicon carbide/single-crystal silicon heterojunction(s). The heterojunction(s) structure from top to bottom can be (1) Al/P--SiC/GCL/N--Si/Al; (2) Al/P--Si/GCL/P--SiC/GCL/N--Si/Al; and (3) Al/P--SiC/GCL/N--Si/GCL/P--SiC/GCL/N--Si/Al, wherein the GCL (Graded Reactant-gas Composition Ratio Layer) is a buffer layer formed between single-crystal silicon carbide layer and single-crystal silicon layer by gradually changing the composition of reaction gases. The structure and process of devices with negative differential resistance according to the invention are simpler than those of the prior art using Group III-V semiconductors.

Abstract: An integrated photoreceiver is provided. The photoreceiver includes a substrate, a metal-insulator-semiconductor switch (MISS) formed on a first portion of the substrate, and a photoreceiving structure formed on a second portion of the substrate for receiving a light signal and generating a current signal to trigger the MISS in response to said light signal.