Abstract: Disclosed a measurement system for measuring chip-scale polarizing plates, which projects incident lights respectively having a first polarization direction and a second polarization direction to a plurality of chip-scale polarizing plates on a tested wafer, and uses the intensities of the penetrating lights passing through the chip-scale polarizing plates to calculate the transmittances and extinction ratios of the chip-scale polarizing plates so as to determine whether one or more of the chip-scale polarizing plates are unqualified products, wherein the first polarization direction is perpendicular to the second polarization direction; the first polarization direction is perpendicular or parallel to the polarization direction of the chip-scale polarizing plates. The measurement system and measurement method of the present invention can simultaneously measure a plurality of chip-scale polarizing plates and thus can increase the productivity of chip-scale polarizing plates.

Abstract: A capacitor is disclosed. The capacitor includes a magnetic layer, a first dielectric layer, a second dielectric layer, a first conductive layer and a second conductive layer. The magnetic layer is capable of generating a magnetic field, and is disposed between the first dielectric layer and the second dielectric layer. The first conductive layer is disposed below the first dielectric layer, and second conductive layer is disposed above the second dielectric layer, wherein both the first and the second conductive layer are non-magnetic.

Abstract: A capacitor is disclosed. The capacitor includes a conductive and non-magnetic layer, a magnetic and conductive layer, and a dielectric layer. The dielectric layer is disposed between the conductive and non-magnetic layer and the magnetic and conductive layer. The magnetic and conductive layer is capable of generating a magnetic field, and thus enhances the dielectric constant of the dielectric layer for at least 10 folds.

Abstract: The present invention relates to a thermosetting resin composition, which comprises at least one titanium compound copolymerized composite as filler and can be used as mechanical, electrical and electronic parts, molded and/or packaging resin for semiconductor and so on, etc. By adding such titanium compound copolymerized composite, the resin composition of the present invention improves flame retardance and heat resistance and has an excellent moldability and reliance under circumstances without adding any other flame-resisting material.

Abstract: The present invention relates to a novel process for preparing polyimide, which comprises: reacting a di-anhydride with diamine to form polyamic acid, applying or casting the polyamic acid on a substrate, evaporating the solvent contain therein to control the volatile content in the resulting polyamic acid at not more than 10 wt %, rewinding the polyamic acid-coated substrate at a tensile strength of not more than 20 kgf/cm2, transferring into an oven, heating the coated substrate at a gradient temperature to cyclize the polyamic acid into polyamide, to obtain a flexible laminate having excellent appearance in good yield. According to the present process, a polyimide flexible film having excellent properties can be produced in a low cost and a high yield.

Abstract: The invention herein relates to a kind of safety pin with an attached multi-function thermometer which consists mainly of a temperature display and pulse tone emitting integrated circuit board. The enclosure of the aforesaid integrated circuit board can be fabricated in the shape of various animals or cartoon characters. A safety pin is mounted on the rear side of the enclosure for fastening the device onto the clothing of an infant. Extending from the integrated circuit board is a coiled conductor connected to a threaded seat that is fastened in screw-on fashion to a heat sensor rod contained in a pacifier nipple. As an infant sucks the pacifier nipple, the oral temperature of the infant is measured by the heat sensor rod and the temperature reading is shown via a liquid crystal display on the integrated circuit board. The integrated circuit board also has specially designed temperature setting functions.