Abstract: An apparatus for increasing uniformity of thin films deposited on a substrate includes multiple deposition sources to accommodate and discharge evaporation material. A member supports the deposition sources in a selected arrangement. A heater can be used to apply heat to the deposition sources. In another embodiment, the apparatus can include a container to accommodate evaporation material. The container may include aperture at or near its center. A cover caps an opening of the container and includes multiple gas outlets. The apparatus further includes a heater disposed along an inner surface of the aperture and along an outer surface of the container.

Abstract: Linear deposition sources are disclosed. In one embodiment, the linear deposition source includes a container accommodating evaporation material and a heater configured to generate heat energy such that vaporized material is discharged uniformly onto a substrate on which a deposition layer is formed. The heater is provided on the container, wherein a portion of the heater positioned at a center portion of the container in the longitudinal direction generates more heat energy than the other portion of the heater. The heater includes a coil configured in a sinusoidal pattern, wherein the curvature pitch or height of the portion of the coil positioned at the center portion of the container in the longitudinal direction is set to be different from that of the other portion of the coil. Further, the resistance of the portion of the coil positioned at the center portion of the container in the longitudinal direction may be set to be greater than that of the other portion of the coil.