Abstract: A small molecule compound of a NO donor is a compound shown in the following structural formula I or a stereoisomer, a geometric isomer, a tautomer, a racemate, a deuterated isotopic derivative, a hydrate, a solvate, a metabolite, or a pharmaceutically acceptable salt or prodrug thereof; wherein a ring A is a substituted or unsubstituted heteroaromatic ring; X is selected from (CH2); R is a substituent of terminal —O—NO2; R1 is selected from hydrogen, a hydroxyl group, a halogen, an amino group, a cyano group, a substituted or unsubstituted alkyl group, a substituted or unsubstituted alkoxy group, a substituted or unsubstituted alkenyl group, a substituted or unsubstituted alkynyl group, or a substituted or unsubstituted heteroalkyl group; R2 and R3 are each independently selected from hydrogen, a substituted or unsubstituted alkyl group, a substituted or unsubstituted cycloalkyl group, or an amino protecting group.

Abstract: The present disclosure provides mark structures and fabrication methods thereof. An exemplary fabrication process includes providing a substrate having a device region, a first mark region and a second mark region; sequentially forming a device layer, a dielectric layer and a mask layer on a surface of the substrate; forming a first opening in the dielectric layer in the device region, a first mark in the dielectric layer in the first mark region, and a mark opening in dielectric layer in the second mark region, bottoms of the first opening, the first mark and the mark opening being lower than a surface of the dielectric layer, and higher than a surface of the device layer; and forming a second opening in the dielectric layer on the bottom of the first opening and a second mark in the dielectric layer on the bottom of the mark opening.

Abstract: The present disclosure provides mark structures and fabrication methods thereof. An exemplary fabrication process includes providing a substrate having a device region, a first mark region and a second mark region; sequentially forming a device layer, a dielectric layer and a mask layer on a surface of the substrate; forming a first opening in the dielectric layer in the device region a first mark in the dielectric layer in the first mark region, and a mark opening in dielectric layer in the second mark region, bottoms of the first opening, the first mark and the mark opening being lower than a surface of the dielectric layer, and higher than a surface of the device layer; and forming a second opening in the dielectric layer on the bottom of the first opening and a second mark in the dielectric layer on the bottom of the mark opening.

Abstract: An cable connector assembly (100), comprising an insulative housing (1) defining a plurality of cavities (16), a plurality of contacts (2) received in the corresponding cavities, a plurality of wires (4) electrically connected with the contacts (2), and a printed circuit board (3) assembled to a back end of the insulative housing. The printed circuit board defines a first conductive portion (32) electrically connected with the contacts and a second conductive portion (33) electrically connected with the wires, the wires are located in front of the printed circuit board and soldered to the second conductive portion, and the wires are arranged to extend forwards along a mating direction and perpendicular to the printed circuit board.

Abstract: A method for activating an application module is applied to an application program installed in an electronic device, wherein the application program includes at least more than one application module. When activating one of the application modules, the electronic device must firstly receive an activation code corresponding to the application module from a server of a program provider via the Internet, and the activation code is encrypted by the server of the program provider based on an activation information (such as a user name) and a module code corresponding to the application module, both of which are transmitted from the electronic device.