Patents by Inventor Kui-Hui Yu

Kui-Hui Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Light-emitting diode
    Patent number: 7982238
    Abstract: A light-emitting diode (LED) is provided, wherein the LED comprises an epitaxial structure, a bonding layer and a composite substrate. The composite substrate comprises a patterned substrate having a pattern and a conductive material layer disposed around the patterned substrate. The bonding layer is formed on the composite substrate. The epitaxial structure is formed on the bonding layer.
    Type: Grant
    Filed: August 28, 2008
    Date of Patent: July 19, 2011
    Assignee: Epistar Corporation
    Inventors: Chang-Hsing Chu, Kui-Hui Yu, Shi-Ming Chen
  • LIGHT-EMITTING DIODE
    Publication number: 20080308834
    Abstract: A light-emitting diode (LED) is provided, wherein the LED comprises an epitaxial structure, a bonding layer and a composite substrate. The composite substrate comprises a patterned substrate having a pattern and a conductive material layer disposed around the patterned substrate. The bonding layer is formed on the composite substrate. The epitaxial structure is formed on the bonding layer.
    Type: Application
    Filed: August 28, 2008
    Publication date: December 18, 2008
    Applicant: EPISTAR CORPORATION
    Inventors: Chang-Hsing Chu, Kui-Hui Yu, Shi-Ming Chen
  • Light-emitting diode and manufacturing method thereof
    Patent number: 7432117
    Abstract: A light-emitting diode and the manufacturing method thereof are provided, wherein the light-emitting diode comprises an epitaxial structure, a bonding layer and a composite substrate. The bonding layer located over one side of the epitaxial structure is used for adhering the composite substrate to the epitaxial structure. The composite substrate comprises a patterned silicon layer penetrated through by a plurality of openssilicon, and a metal layer covering the patterned silicon layer, wherein a portion of the metal layer is filled into the opens and contacts the bonding layer.
    Type: Grant
    Filed: September 22, 2005
    Date of Patent: October 7, 2008
    Assignee: Epistar Corporation
    Inventors: Chang-Hsing Chu, Kui-Hui Yu, Shi-Ming Chen
  • Light-emitting diode and manufacturing method thereof
    Publication number: 20060255356
    Abstract: A light-emitting diode and the manufacturing method thereof are provided, wherein the light-emitting diode comprises an epitaxial structure, a bonding layer and a composite substrate. The bonding layer located over one side of the epitaxial structure is used for adhering the composite substrate to the epitaxial structure. The composite substrate comprises a patterned silicon layer penetrated through by a plurality of openssilicon, and a metal layer covering the patterned silicon layer, wherein a portion of the metal layer is filled into the opens and contacts the bonding layer.
    Type: Application
    Filed: September 22, 2005
    Publication date: November 16, 2006
    Applicant: EPITECH TECHNOLOGY CORPORATION
    Inventors: Chang-Hsing Chu, Kui-Hui Yu, Shi-Ming Chen