Patents by Inventor Kuihyun YOON

Kuihyun YOON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12183555
    Abstract: Provided are a substrate processing apparatus and a method of manufacturing a semiconductor device using the same. The substrate processing apparatus includes a lower electrode assembly, an upper electrode assembly disposed on the lower electrode assembly, and a plasma processing region between the lower electrode assembly and the upper electrode assembly. The lower electrode assembly includes a substrate support supporting a substrate, a coupling ring assembly surrounding the substrate support, an edge ring on the coupling ring assembly, and at least one upper contact pad contacting a lower surface of the edge ring and contacting at least one of the substrate support and the coupling ring assembly, the at least one upper contact pad being conductive. The coupling ring assembly includes a coupling ring and a conductive side contact pad in contact with a side surface of the substrate support and an inner surface of the coupling ring.
    Type: Grant
    Filed: November 7, 2022
    Date of Patent: December 31, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seunghan Baek, Sangki Nam, Dongseok Han, Namkyun Kim, Kwonsang Seo, Kuihyun Yoon
  • Publication number: 20240379334
    Abstract: An example coolant tube block assembly includes a first coolant tube block including at least one of a first coolant flow path tube and a second coolant flow path tube; a hub block configured to expose at least one of the first coolant flow path tube and the second coolant flow path tube on one side, and connected to a lower side of the first coolant tube block; a second coolant tube block including at least one third coolant flow path tube and at least one fourth coolant flow path tube communicating with at least one of the first coolant flow path tube and the second coolant flow path tube, and stacked with the first coolant tube block through the hub block; and a clamp disposed at a lower portion of the second coolant tube block and fastened to a fastening groove formed outside the hub block.
    Type: Application
    Filed: April 30, 2024
    Publication date: November 14, 2024
    Inventors: Woojin Jang, Wonyoung Jee, Kyungsun Kim, Mingil Kim, Sanghun Bang, Dongseok Han, Changkyu Kwag, Jihwan Kim, Junghyun Song, Kuihyun Yoon
  • Publication number: 20240212992
    Abstract: Provided is a plasma processing apparatus including a substrate chuck in a chamber, a restriction ring surrounding an outer perimeter of the substrate chuck, a movable ring on the restriction ring, and an actuator configured to move the movable ring, wherein grooves formed in the restriction ring are opened or closed by movement of the movable ring. In addition, provided is a plasma processing method using the plasma processing apparatus.
    Type: Application
    Filed: August 22, 2023
    Publication date: June 27, 2024
    Inventors: Changheon Lee, Sangki Nam, Kuihyun Yoon, Kiho Lee, Sangho Lee, Sangheun Lee, Jaemin Rhee, Junghyun Cho, Seoyeon Choi
  • Publication number: 20240162017
    Abstract: A substrate supporting device may include a cooling plate including a cooling hole, a thermal-insulation plate on the cooling plate, and a chucking plate placed on the thermal-insulation plate. The chucking plate may include a heater. The thermal-insulation plate may include an adiabatic space, which is recessed from a top surface of the thermal-insulation plate by a depth in a downward direction. The cooling plate may include a connection hole, which vertically extends and is connected to the adiabatic space.
    Type: Application
    Filed: June 1, 2023
    Publication date: May 16, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Heewon MIN, Juho KIM, Dongyun YEO, Kuihyun YOON, Seungbin LIM, Songyun KANG, Youngrok KWON
  • Publication number: 20230317418
    Abstract: A substrate processing apparatus includes a process chamber having an internal space; upper and lower electrode portions facing each other in the internal space; and a gas supply unit configured to supply cooling gas to a bottom surface of a substrate seated on the lower electrode portion. The gas supply unit may include a gas supply source outside the process chamber and configured to provide a cooling gas, and a gas filter connected to the gas supply source and including one or more wall surfaces at least partially defining a gas flow path for the cooling gas. The gas filter may include a first and second regions formed of respective materials having different dielectric constants. The first and second regions may be configured so that the cooling gas flowing along the gas flow path flows upwardly concurrently with colliding with a wall surface of the gas flow path.
    Type: Application
    Filed: December 20, 2022
    Publication date: October 5, 2023
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Jungmin KO, Sangki NAM, Dougyong SUNG, Byeongsang KIM, Yunhwan KIM, Suyoung YOO, Namkyun KIM, Kuihyun YOON
  • Publication number: 20230143327
    Abstract: Disclosed are focus rings, substrate processing apparatuses including the same, and substrate processing methods using the same. The focus ring comprises a first ring formed around an axis that extends in a first direction and a second ring separate from the first ring and formed around the axis. A portion of an inner lateral surface of the second ring is in contact with a portion of an outer lateral surface of the first ring. When viewed from a cross-sectional view from a direction perpendicular to the axis, a first angle between the outer lateral surface and the first direction is different from a second angle between the inner lateral surface and the first direction.
    Type: Application
    Filed: June 27, 2022
    Publication date: May 11, 2023
    Inventors: DONGSEOK HAN, Seunghan BAEK, KYUNG-SUN KIM, Nam Kyun KIM, SANG KI NAM, KUIHYUN YOON, KANGMIN JEON
  • Publication number: 20230143049
    Abstract: Provided are a substrate processing apparatus and a method of manufacturing a semiconductor device using the same. The substrate processing apparatus includes a lower electrode assembly, an upper electrode assembly disposed on the lower electrode assembly, and a plasma processing region between the lower electrode assembly and the upper electrode assembly. The lower electrode assembly includes a substrate support supporting a substrate, a coupling ring assembly surrounding the substrate support, an edge ring on the coupling ring assembly, and at least one upper contact pad contacting a lower surface of the edge ring and contacting at least one of the substrate support and the coupling ring assembly, the at least one upper contact pad being conductive. The coupling ring assembly includes a coupling ring and a conductive side contact pad in contact with a side surface of the substrate support and an inner surface of the coupling ring.
    Type: Application
    Filed: November 7, 2022
    Publication date: May 11, 2023
    Inventors: Seunghan Baek, Sangki Nam, Dongseok Han, Namkyun Kim, Kwonsang Seo, Kuihyun Yoon
  • Publication number: 20230060400
    Abstract: An apparatus for measuring parameters of plasma includes a cutoff probe. The cutoff probe includes: a first antenna having a line shape and configured to emit a microwave to the plasma in response to the signal provided by at least one processor; a second antenna having a line shape and configured to generate an electrical signal in response to receiving the microwave emitted by the first antenna and transferred through the plasma; a first insulating layer; a second insulating layer; a first shield; a second shield; an end protection layer covering an end of each of the first insulating layer, the second insulating layer, the first shield, and the second shield; a first antenna protection layer, of insulating nature, covering the first antenna; and a second antenna protection layer, of insulating nature, covering the second antenna.
    Type: Application
    Filed: May 18, 2022
    Publication date: March 2, 2023
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yoonbum Nam, Namkyun Kim, Seungbo Shim, Donghyeon Na, Naohiko Okunishi, Dongseok Han, Minyoung Hur, Byeongsang Kim, Kuihyun Yoon
  • Patent number: 11515193
    Abstract: An etching apparatus includes a reaction chamber having an internal space; an upper electrode in the reaction chamber; a fixing chuck in the internal space of the reaction chamber and below the upper electrode; an electrostatic chuck above the fixing chuck and on which a wafer is configured to be placed; a focus ring surrounding the electrostatic chuck; and a plurality of sealing members configured to seal cooling gas provided to the focus ring and being in contact with the focus ring. The plurality of sealing members may be formed of a porous material. Each of the plurality of sealing members may include a body portion and an outer surface surrounding the body portion. Only the body portion may include voids and the outer surface may be smooth and free of voids.
    Type: Grant
    Filed: June 15, 2020
    Date of Patent: November 29, 2022
    Inventors: Kuihyun Yoon, Jaehak Lee, Yunhwan Kim, Jongkeun Lee, Kyohyeok Kim, Jewoo Han
  • Publication number: 20220351947
    Abstract: A plasma confinement ring includes a lower ring, an upper ring on the lower ring, and a connection ring extended to connect the lower ring to the upper ring. The lower ring includes a lower center hole vertically penetrating the lower ring at a center of the lower ring and at least one slit penetrating the lower ring in a region outside the lower center hole. The slit is structured to pass a more amount of air or gas at a first portion closer to the center of the lower ring than at a second portion farther from the center of the lower ring.
    Type: Application
    Filed: December 13, 2021
    Publication date: November 3, 2022
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kuihyun YOON, Sang Ki NAM, Kwonsang SEO, Sungho JANG, Jungmin KO, Nam Kyun KIM, Tae-Hyun KIM, Seunghan BAEK, Seungbin AHN, Jungmo YANG, Changheon LEE, Kangmin JEON
  • Publication number: 20210111056
    Abstract: An etching apparatus includes a reaction chamber having an internal space; an upper electrode in the reaction chamber; a fixing chuck in the internal space of the reaction chamber and below the upper electrode; an electrostatic chuck above the fixing chuck and on which a wafer is configured to be placed; a focus ring surrounding the electrostatic chuck; and a plurality of sealing members configured to seal cooling gas provided to the focus ring and being in contact with the focus ring. The plurality of sealing members may be formed of a porous material. Each of the plurality of sealing members may include a body portion and an outer surface surrounding the body portion. Only the body portion may include voids and the outer surface may be smooth and free of voids.
    Type: Application
    Filed: June 15, 2020
    Publication date: April 15, 2021
    Inventors: Kuihyun Yoon, Jaehak Lee, Yunhwan Kim, Jongkeun Lee, Kyohyeok Kim, Jewoo Han
  • Patent number: 10532896
    Abstract: A substrate inspection system includes a floating unit that floats a substrate, an inspection unit disposed above the floating unit, a grip unit disposed below the inspection unit and including a first grip member that holds the substrate on the floating unit, a grip transfer unit that moves the grip unit in a first direction, and an illumination unit that generates light. The inspection unit inspects the substrate that floats on the floating unit, the illumination unit is disposed on a moving path of the grip unit, and the light generated by the illumination unit is irradiated onto the inspection unit. The first grip member includes a first adsorption pad that adsorbs the substrate, and a first support member that supports the first adsorption pad and that includes a first opening into which the illumination unit is inserted.
    Type: Grant
    Filed: May 29, 2018
    Date of Patent: January 14, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kuihyun Yoon, Wonguk Seo, Young Heo
  • Publication number: 20190092580
    Abstract: A substrate inspection system includes a floating unit that floats a substrate, an inspection unit disposed above the floating unit, a grip unit disposed below the inspection unit and including a first grip member that holds the substrate on the floating unit, a grip transfer unit that moves the grip unit in a first direction, and an illumination unit that generates light. The inspection unit inspects the substrate that floats on the floating unit, the illumination unit is disposed on a moving path of the grip unit, and the light generated by the illumination unit is irradiated onto the inspection unit. The first grip member includes a first adsorption pad that adsorbs the substrate, and a first support member that supports the first adsorption pad and that includes a first opening into which the illumination unit is inserted.
    Type: Application
    Filed: May 29, 2018
    Publication date: March 28, 2019
    Inventors: KUIHYUN YOON, Wonguk Seo, Young Heo
  • Patent number: 10006872
    Abstract: Provided is an optical inspection system including a supporting unit, allowing a target object to be loaded thereon, a light source unit configured to emit a laser beam toward the target object, a light condensing unit collecting scattered light that is scattered at the target object when the laser beam is irradiated onto the target object, and a control unit controlling the light source unit and the light condensing unit and analyzing the scattered light to examine whether there are pollutants on the target object. The supporting unit may include a first supporting unit, on which the target object is disposed, and which is formed of a first material, and a second supporting unit, which is disposed under the first supporting unit and is formed of a second material different from the first material.
    Type: Grant
    Filed: December 1, 2015
    Date of Patent: June 26, 2018
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Wonguk Seo, Kyoungchon Kim, Kuihyun Yoon, Kyunlae Kim, Jaeyoung Park, Kyoungho Yang, Young Heo
  • Publication number: 20160290933
    Abstract: Provided is an optical inspection system including a supporting unit, allowing a target object to be loaded thereon, a light source unit configured to emit a laser beam toward the target object, a light condensing unit collecting scattered light that is scattered at the target object when the laser beam is irradiated onto the target object, and a control unit controlling the light source unit and the light condensing unit and analyzing the scattered light to examine whether there are pollutants on the target object. The supporting unit may include a first supporting unit, on which the target object is disposed, and which is formed of a first material, and a second supporting unit, which is disposed under the first supporting unit and is formed of a second material different from the first material.
    Type: Application
    Filed: December 1, 2015
    Publication date: October 6, 2016
    Inventors: Wonguk Seo, Kyoungchon KIM, Kuihyun YOON, Kyunlae KIM, Jaeyoung PARK, Kyoungho YANG, Young HEO