Patents by Inventor Kui-Yeun Kim

Kui-Yeun Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080217041
    Abstract: The present invention provides a grounding wire structure having a stainless steel covering and a method of manufacturing the grounding wire structure. In the present invention, first and second hollow connection frames (4) and (4?), each of which has a compressing groove (4a), (4a?) and an internal thread (4b), (4b?), are coupled to respective opposite ends of a stainless steel pipe (1), in which a grounding wire (2) is provided, and which is filled with graphite (3). Corrugated grooves are formed in the outer surface of the stainless steel pipe (1). A connection socket (5) is coupled to the internal thread (4b) of the first connection frame (4). A connection rod (6) is coupled to the internal thread (4b?) of the second connection frame (4?). Discharge tip assemblies (A), each of which has discharge tip bodies (7) and (7?) connected to each other through a connection pin (8), are fitted over the corrugated grooves of the stainless steel covering pipe (1).
    Type: Application
    Filed: October 27, 2005
    Publication date: September 11, 2008
    Inventor: Kui-Yeun Kim