Patents by Inventor Kui Won Kang

Kui Won Kang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printed circuit board and semiconductor package with the same
    Patent number: 8253034
    Abstract: Disclosed herein is a printed circuit board. The printed circuit board includes a base substrate including a first region on which a semiconductor chip is mounted and a second region positioned outside the first region, first insulating patterns covering the base substrate and including trenches formed on the second region, and second insulating patterns protruding from the first insulating patterns on the second region. The trench and the second insulating pattern may be used as a structure defining an underfill forming material in a preset shape during the process of forming an underfill.
    Type: Grant
    Filed: November 10, 2010
    Date of Patent: August 28, 2012
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Byoung Chan Kim, Young Hwan Shin, Chin Kwan Kim, Dong Won Kim, Kui Won Kang
  • Printed circuit board and semiconductor package with the same
    Publication number: 20110286191
    Abstract: Disclosed herein is a printed circuit board. The printed circuit board includes a base substrate including a first region on which a semiconductor chip is mounted and a second region positioned outside the first region, first insulating patterns covering the base substrate and including trenches formed on the second region, and second insulating patterns protruding from the first insulating patterns on the second region. The trench and the second insulating pattern may be used as a structure defining an underfill forming material in a preset shape during the process of forming an underfill.
    Type: Application
    Filed: November 10, 2010
    Publication date: November 24, 2011
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Byoung Chan Kim, Young Hwan Shin, Chin Kwan Kim, Dong Won Kim, Kui Won Kang