Abstract: Disclosed herein is a printed circuit board. The printed circuit board includes a base substrate including a first region on which a semiconductor chip is mounted and a second region positioned outside the first region, first insulating patterns covering the base substrate and including trenches formed on the second region, and second insulating patterns protruding from the first insulating patterns on the second region. The trench and the second insulating pattern may be used as a structure defining an underfill forming material in a preset shape during the process of forming an underfill.

Abstract: Disclosed herein is a printed circuit board. The printed circuit board includes a base substrate including a first region on which a semiconductor chip is mounted and a second region positioned outside the first region, first insulating patterns covering the base substrate and including trenches formed on the second region, and second insulating patterns protruding from the first insulating patterns on the second region. The trench and the second insulating pattern may be used as a structure defining an underfill forming material in a preset shape during the process of forming an underfill.

Abstract: A printed circuit board is disclosed. The printed circuit board, which may include an insulation layer, a first metal pad formed on the insulation layer, a second metal pad electrically coupled with the first metal pad and having an ionization tendency lower than that of the first metal pad, and a sacrificial electrode electrically coupled with the second metal pad to prevent corrosion in the first metal pad, can be utilized to prevent excessive etching that may otherwise occur due to galvanic corrosion between metal pads of different ionization tendencies.