Patents by Inventor Kuk Hyun JI

Kuk Hyun JI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11167884
    Abstract: The present disclosure relates to a frame packaging box for packaging frames. The frame packaging box includes a box comprising an accommodating space for accommodating frames, a plurality of supporters stacked up and down in the accommodating space to support portions of the frames, and a guide rail disposed on an inner surface of the box to guide the up-down movement of the plurality of supporters.
    Type: Grant
    Filed: January 17, 2019
    Date of Patent: November 9, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Gyeong Joong Kim, Seung Sik Tak, Yong Seung Shin, Seo Joon Lee, Yong Soon Lee, Kuk Hyun Ji
  • Publication number: 20200339306
    Abstract: The present disclosure relates to a frame packaging box for packaging frames. The frame packaging box includes a box comprising an accommodating space for accommodating frames, a plurality of supporters stacked up and down in the accommodating space to support portions of the frames, and a guide rail disposed on an inner surface of the box to guide the up-down movement of the plurality of supporters.
    Type: Application
    Filed: January 17, 2019
    Publication date: October 29, 2020
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Gyeong Joong KIM, Seung Sik TAK, Yong Seung SHIN, Seo Joon LEE, Yong Soon LEE, Kuk Hyun JI