Abstract: Disclosed is a substrate treatment apparatus. The apparatus includes a support unit that supports and rotates a substrate and a spray unit equipped with one or more nozzles to spray a dual fluid that is a mixture of a cleaning agent and carbon dioxide onto the substrate.

Abstract: The present invention provides a liquid supplying unit, including: a nozzle; a liquid supply pipe configured to supply a treatment liquid to the nozzle; and an impurity removing unit installed in the liquid supply pipe to remove an impurity in the treatment liquid, in which the impurity removing unit includes: a measuring unit configured to measure a characteristic of the impurity in the treatment liquid and form impurity data; a vibrating unit configured to apply vibration to the treatment liquid; a capturing unit configured to adsorb the impurity in the treatment liquid to which the vibration is applied; and a control unit configured to control the measuring unit and the vibration unit, and when the impurity data exceeds a reference data range, the control unit operates the vibrating unit.

Abstract: Disclosed is a substrate treatment apparatus. The apparatus includes a support unit that supports and rotates a substrate and a spray unit equipped with one or more nozzles to spray a dual fluid that is a mixture of a cleaning agent and carbon dioxide onto the substrate.

Abstract: According to an embodiment of the present invention, there is provided an article transport vehicle capable of speeding up and reducing vibration in a manufacturing plant, a rail assembly, and an article transport system including the same. The article transport vehicle that conveys an article between manufacturing facilities along a rail of an article transport system in a manufacturing plant includes an article holder, a vehicle body, a magnetic levitation actuator, and a linear motor coil.

Abstract: Disclosed is a lift pin assembly, including: a lift pin inserted into a pin hole; a moving plate moving up and down by a driving unit; a bellows module including a lower flange supported by the moving plate and a bellows shaft supporting the lift pins; and a pressurizing member provided between the lower flange and the moving plate to apply constant pressure in a lifting direction of the bellows module.

Abstract: Proposed is a wafer expander for uniformly expanding gaps between dies, and a die supplying module and die bonding equipment including the same. The wafer expander, for supporting a dicing tape to which a plurality of dies are attached and for expanding gaps between the plurality of dies, includes an expander ring detachably coupled to a wafer ring that fixes an edge of the dicing tape, and configured to ascend and descend, and a base ring supporting a bottom side of the dicing tape, and at least a portion thereof is configured to ascend and descend.

Abstract: A substrate support unit includes a substrate support member that supports a substrate, the substrate support member being provided with one or more pin holes vertically penetrating the substrate support member, and a lift pin assembly provided to be lifted along a corresponding pin hole. The lift pin assembly includes lift pins, each lift pin having an upper end contacting the substrate and supporting the substrate, and a pin drive unit that is coupled to the lift pins and lifts the lift pins. The pin drive unit includes piezoelectric motors below the lift pins, respectively.

Abstract: The inventive concept provides a transfer apparatus. The transfer apparatus includes a transfer truck; and a bumper device installed at any one of the front part or the rear part of the transfer truck, and wherein the bumper device includes: a bumper provided spaced apart from the transfer truck; and an impact attenuation unit provided between the bumper and the transfer truck and configured to attenuate an impact force transferred from the bumper to the transfer truck by a friction force.

Abstract: A substrate lifting apparatus and a substrate processing apparatus for reducing deformation due to heat are provided. The substrate lifting apparatus comprises a plurality of pins in contact with a substrate, an upper plate for supporting the plurality of pins and having a plurality of upper connecting portions formed on a lower surface, a lower plate having a plurality of lower connecting portions connected to the plurality of upper connecting portions formed on an upper surface and disposed under the upper plate, and a driving unit for driving the plurality of pins to move up and down, wherein the lower plate supports a plurality of bushes and a plurality of shafts passing through the plurality of bushes on an upper surface thereof.

Abstract: Method and apparatus for etching a thin layer including silicon nitride formed on a substrate are disclosed. Etchant including phosphoric acid and water is supplied on the substrate so that a liquid layer is formed on the substrate. The thin layer is etched by reaction between the thin layer and the etchant. Thickness of the liquid layer is measured to detect variation in the thickness of the liquid layer while etching the thin layer. Variation in the concentration of the phosphoric acid and the water is calculated based on the variation in the thickness of the liquid layer. Water is supplied on the substrate based on the variation in the concentration of the phosphoric acid and the water so that the concentration of the phosphoric acid and the water becomes a predetermined value.

Abstract: Method and apparatus for etching a thin layer including silicon nitride formed on a substrate are disclosed. Etchant including phosphoric acid and water is supplied on the substrate so that a liquid layer is formed on the substrate. The thin layer is etched by reaction between the thin layer and the etchant. Thickness of the liquid layer is measured to detect variation in the thickness of the liquid layer while etching the thin layer. Variation in the concentration of the phosphoric acid and the water is calculated based on the variation in the thickness of the liquid layer. Water is supplied on the substrate based on the variation in the concentration of the phosphoric acid and the water so that the concentration of the phosphoric acid and the water becomes a predetermined value.

Abstract: Disclosed is a substrate treatment apparatus. The apparatus includes a support unit that supports and rotates a substrate and a spray unit equipped with one or more nozzles to spray a dual fluid that is a mixture of a cleaning agent and carbon dioxide onto the substrate.

Abstract: A substrate processing apparatus includes a rotation unit supporting and rotating a substrate, a chemical ejection unit ejecting a chemical fluid toward the rotation unit, a chemical recovery unit disposed close to the rotation unit and collecting a chemical fluid scattered from the rotation unit, a first lifting unit coupled to the chemical recovery unit and moving upward and downward the chemical recovery unit relative to the rotation unit, and a first position correction member allowing the chemical recovery unit to be elastically supported by the first lifting unit and changing a relative position of the chemical recovery unit with respect to the lifting unit.