Patents by Inventor Ku Kyong Kim

Ku Kyong Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Sealed test chamber for module IC handler
    Patent number: 6607071
    Abstract: The present invention relates to an improved chamber for a module IC handler including a pre-heater for heating module ICs to a set temperature. A receiving piece is installed in a heating chamber and is formed with a plurality of receiving grooves for receiving a carrier holding module ICs. An operating piece is disposed the chamber adjacent the receiving piece. An upper surface the operating piece includes a plurality of receiving grooves of the same interval as the receiving grooves of the receiving piece. In operation, the operating piece raises a module IC carrier from a first groove on the receiving piece and translates the module IC carrier by a distance roughly equivalent to the thickness of the module IC carrier. After translating the module IC carrier, the operating piece lowers the module IC carrier into an adjacent second groove on the receiving piece.
    Type: Grant
    Filed: October 14, 1999
    Date of Patent: August 19, 2003
    Assignee: Mirae Corporation
    Inventors: Tae Sung An, Chan Ho Park, Yong Soo Moon, Eun Hyoung Seong, Ku Kyong Kim