Abstract: A pressure control system for a liquid-cooled electronic component cooling device. A cooling device cools an electronic component through a refrigerant moving along a pipe. A radiator is mounted on one side of the cooling device to exchange heat with the refrigerant, and has a vent hole extending outwardly. A head has discharge holes communicating with a plurality of first hollows formed therein in an outer circumferential surface thereof with a driver hole provided in an upper surface thereof. A body is coupled to a bottom side of the head and has a second hollow communicating with the first hollows in a lengthwise direction. A pressure controller extends outward from a bottom of the body with an inner portion thereof communicating with the second hollow, and includes a coupler having threads on one side of an outer circumferential surface thereof to be screwed into the vent hole.

Abstract: A notebook computer cooler using a thermoelectric element includes a housing, a base plate, as an top surface of the housing, having a thermal pad made of a thermally conductive material and on which a notebook computer is seated; a thermoelectric pad disposed in the housing such that a cooling surface thereof is in contact with an inner surface of the thermal pad; a fan disposed on a side opposite the cooling surface of the thermoelectric pad; and a plurality of vent holes penetrated through the base plate and a lower surface of the housing. According to the notebook computer cooler using a thermoelectric element, it is possible to provide an excellent cooling function of the notebook computer by efficiently absorbing the heat of the notebook computer through the thermal pad of a conductive material by using the heat absorption function of the thermoelectric element.

Abstract: A method of fabricating an electronic component cooling apparatus. In the electronic component cooling apparatus, a cooling tower includes a plurality of heat dissipation plates stacked on each other, and heat pipes extend through portions of the heat dissipation plates in the top-bottom direction. A heat transfer block includes a base having grooves receiving the heat pipes and a cover covering the heat pipes is located on a top surface of an electronic component. The method includes locating the base above the heat pipes and pressing the base to the heat pipes using a press so that the grooves receive the heat pipes, dropping Cu dust produced from the pressing, realigning an assembly of the base and the heat pipes so that the base is located below, and a fourth step of locating the cover above the assembly and pressing the cover to the assembly using the press.

Abstract: A pressure control system for a liquid-cooled electronic component cooling device. A cooling device cools an electronic component through a refrigerant moving along a pipe. A radiator is mounted on one side of the cooling device to exchange heat with the refrigerant, and has a vent hole extending outwardly. A head has discharge holes communicating with a plurality of first hollows formed therein in an outer circumferential surface thereof with a driver hole provided in an upper surface thereof. A body is coupled to a bottom side of the head and has a second hollow communicating with the first hollows in a lengthwise direction. A pressure controller extends outward from a bottom of the body with an inner portion thereof communicating with the second hollow, and includes a coupler having threads on one side of an outer circumferential surface thereof to be screwed into the vent hole.

Abstract: A notebook computer cooler using a thermoelectric element includes a housing, a base plate, as an top surface of the housing, having a thermal pad made of a thermally conductive material and on which a notebook computer is seated; a thermoelectric pad disposed in the housing such that a cooling surface thereof is in contact with an inner surface of the thermal pad; a fan disposed on a side opposite the cooling surface of the thermoelectric pad; and a plurality of vent holes penetrated through the base plate and a lower surface of the housing. According to the notebook computer cooler using a thermoelectric element, it is possible to provide an excellent cooling function of the notebook computer by efficiently absorbing the heat of the notebook computer through the thermal pad of a conductive material by using the heat absorption function of the thermoelectric element.