Patents by Inventor Kukil Lee

Kukil Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Dual chiller system
    Patent number: 12710205
    Abstract: A dual chiller system includes a high-temperature tank configured to supply a first coolant of a first temperature to the outside, a low-temperature tank configured to supply a second coolant of a second temperature lower than the first temperature to the outside, a first automatic inlet valve and a second automatic inlet valve respectively connected to the high-temperature tank and the low-temperature, a first substrate processing device configured to receive the first coolant or the second coolant from the first automatic inlet valve and a second substrate processing device configured to receive the first coolant or the second coolant from the second automatic inlet valve, a cooling unit and a system controller.
    Type: Grant
    Filed: March 25, 2024
    Date of Patent: August 18, 2026
    Assignees: SAMSUNG ELECTRONICS CO., LTD., Yest Co., Ltd.
    Inventors: Gibong Lee, Hackwon Hwang, Kukil Lee, Daesung Kim, Jaewon Yoo, Jinyeob Jang, Teacksoo Jung
  • DUAL CHILLER SYSTEM
    Publication number: 20240377113
    Abstract: A dual chiller system includes a high-temperature tank configured to supply a first coolant of a first temperature to the outside, a low-temperature tank configured to supply a second coolant of a second temperature lower than the first temperature to the outside, a first automatic inlet valve and a second automatic inlet valve respectively connected to the high-temperature tank and the low-temperature, a first substrate processing device configured to receive the first coolant or the second coolant from the first automatic inlet valve and a second substrate processing device configured to receive the first coolant or the second coolant from the second automatic inlet valve, a cooling unit and a system controller.
    Type: Application
    Filed: March 25, 2024
    Publication date: November 14, 2024
    Applicants: SAMSUNG ELECTRONICS CO., LTD., Yest Co., Ltd.
    Inventors: Gibong LEE, Hackwon Hwang, Kukil Lee, Daesung Kim, Jaewon Yoo, Jinyeob Jang, Teacksoo Jung