Patents by Inventor Kuldip Johal

Kuldip Johal has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for reducing the optical reflectivity of a copper and copper alloy circuitry and touch screen device
    Patent number: 10448515
    Abstract: The present invention relates to a method for reducing the optical reflectivity of a copper and copper alloy circuitry wherein a thin palladium or palladium alloy layer is deposited by immersion-type plating onto said copper or copper alloy. Thereby, a dull greyish or greyish black or black layer is obtained and the optical reflectivity of said copper or copper alloy circuitry is reduced. The method according to the present invention is particularly suitable in the manufacture of image display devices, touch screen devices and related electronic components.
    Type: Grant
    Filed: August 7, 2015
    Date of Patent: October 15, 2019
    Assignee: Atotech Deutschland GmbH
    Inventors: Kuldip Johal, Christian Lowinski, Michael Merschky, Kilian Klaeden, Jörg Schulze, Sebastian Reiber
  • METHOD FOR REDUCING THE OPTICAL REFLECTIVITY OF A COPPER AND COPPER ALLOY CIRCUITRY AND TOUCH SCREEN DEVICE
    Publication number: 20170245372
    Abstract: The present invention relates to a method for reducing the optical reflectivity of a copper and copper alloy circuitry wherein a thin palladium or palladium alloy layer is deposited by immersion-type plating onto said copper or copper alloy. Thereby, a dull greyish or greyish black or black layer is obtained and the optical reflectivity of said copper or copper alloy circuitry is reduced. The method according to the present invention is particularly suitable in the manufacture of image display devices, touch screen devices and related electronic components.
    Type: Application
    Filed: August 7, 2015
    Publication date: August 24, 2017
    Inventors: Kuldip JOHAL, Christian LOWINSKI, Michael MERSCHKY, Kilian KLAEDEN, Jörg SCHULZE, Sebastian REIBER
  • Method for micro-roughening treatment of copper and mixed-metal circuitry
    Publication number: 20050067378
    Abstract: Process to improve adhesion of dielectric materials to a metal layer, including providing an unpatterned metal layer having a first major surface; micro-roughening the first major surface to form a micro-roughened surface; and etching the metal layer to form a circuit pattern in the metal layer, in which the micro-roughening is carried out prior to the etching.
    Type: Application
    Filed: September 30, 2003
    Publication date: March 31, 2005
    Inventors: Harry Fuerhaupter, David Baron, Kuldip Johal, Patrick Brooks