Abstract: Embodiments of this disclosure include a method and system for machine learning based evaluation of user experience on information technology (IT) support service. The method may include obtaining a field data of an IT support service ticket and obtaining a multi-score prediction engine. The method may further include predicting metric scores of a plurality of IT support service metrics for the support service ticket based on the field data by executing the multi-score prediction engine. The method may further include obtaining system-defined weights and user-defined weights for the plurality of service metrics and calculating a support service score for the support service ticket based on the metric scores, the system-defined weights, and the user-defined weights. The method may further include evaluating user experience based on the support service score.

Abstract: An electronic assembly is described, having a substrate and contacts on the substrate which are spaced and arranged in a manner that allows for a more dense arrangement of contacts but still allows for routing of traces between the contacts.

Abstract: A semiconductor die having a through via formed therein is disclosed. A first conductive layer is formed on the front side of the die and a second conductive layer is formed on the backside of the die, and coupled with the through via. A first package substrate is electrically coupled with the first conductive layer, and a second package substrate is electrically coupled with the second conductive layer. In another embodiment, a substrate ball electrically couples the first and second package substrates. In a further embodiment, a flip chip bump is attached to the first package substrate.

Abstract: An electronic assembly is described, having a substrate and contacts on the substrate which are spaced and arranged in a manner that allows for a more dense arrangement of contacts but still allows for routing of traces between the contacts.

Abstract: An electronic assembly is described, having a substrate and contacts on the substrate which are spaced and arranged in a manner that allows for a more dense arrangement of contacts but still allows for routing of traces between the contacts.

Abstract: An electronic assembly is described, having a substrate and contacts on the substrate which are spaced and arranged in a manner that allows for a more dense arrangement of contacts but still allows for routing of traces between the contacts.

Abstract: An electronic assembly is described, having a substrate and contacts on the substrate which are spaced and arranged in a manner that allows for a more dense arrangement of contacts but still allows for routing of traces between the contacts.

Abstract: A semiconductor die having a through via formed therein is disclosed. A first conductive layer is formed on the front side of the die and a second conductive layer is formed on the backside of the die, and coupled with the through via. A first package substrate is electrically coupled with the first conductive layer, and a second package substrate is electrically coupled with the second conductive layer. In another embodiment, a substrate ball electrically couples the first and second package substrates. In a further embodiment, a flip chip bump is attached to the first package substrate.

Abstract: The present invention relates to a device that includes a low-ohmic test. The device includes a metallization copper pad such as metal-six, a metal first film such as Ni that is disposed above the metallization copper pad, and a metal second film such as Au that is disposed above the metal first film. The present invention also relates to a wire-bonding process, and to a method of pulling a first wire bond and making a second wire bond.

Abstract: An apparatus and method for dissipating static electrical charge following a manufacturing operation is disclosed. A semiconductor package is provided with ground pads that are located to assure electrical contact with ejection pins used to translate the package from one position to another. Static electricity builds up on the semiconductor package. The ejection pins provide the pathway for dissipating static electrical charge out of the semiconductor package.

Abstract: The present invention relates to a device that includes a low-ohmic test. The device includes a metallization copper pad such as metal-six, a metal first film such as Ni that is disposed above the metallization copper pad, and a metal second film such as Au that is disposed above the metal first film. The present invention also relates to a wire-bonding process, and to a method of pulling a first wire bond and making a second wire bond.

Abstract: An electronic assembly is described, having a substrate and contacts on the substrate which are spaced and arranged in a manner that allows for a more dense arrangement of contacts but still allows for routing of traces between the contacts.

Abstract: An apparatus and method for dissipating static electrical charge following a manufacturing operation is disclosed. A semiconductor package is provided with ground pads that are located to assure electrical contact with ejection pins used to translate the package from one position to another. Static electricity builds up on the semiconductor package. The ejection pins provide the pathway for dissipating static electrical charge out of the semiconductor package.

Abstract: The present invention relates to a device that includes a low-ohmic test. The device includes a metallization copper pad such as metal-six, a metal first film such as Ni that is disposed above the metallization copper pad, and a metal second film such as Au that is disposed above the metal first film. The present invention also relates to a wire-bonding process, and to a method of pulling a first wire bond and making a second wire bond.

Abstract: An apparatus and method for dissipating static electrical charge following a manufacturing operation is disclosed. A semiconductor package is provided with ground pads that are located to assure electrical contact with ejection pins used to translate the package from one position to another. Static electricity builds up on the semiconductor package. The ejection pins provide the pathway for dissipating static electrical charge out of the semiconductor package.

Abstract: An apparatus and method for dissipating static electrical charge following a manufacturing operation is disclosed. A semiconductor package is provided with ground pads that are located to assure electrical contact with ejection pins used to translate the package from one position to another. Static electricity builds up on the semiconductor package. The ejection pins provide the pathway for dissipating static electrical charge out of the semiconductor package.

Abstract: An integrated circuit package including a substrate, an integrated circuit, and an encapsulant. The substrate has two opposing surfaces and an opening that extends between the two surfaces. The integrated circuit is mounted to the substrate substantially centered over the opening such that a portion of the opening is left uncovered by the integrated circuit. The encapsulant encapsulates the integrated circuit with a portion of the encapsulant extending between the two surfaces of the substrate and attached to the lower surface of the integrated circuit.

Abstract: A pill dispenser that is disposed in a handle of a toothbrush includes an auger mechanism constructed so that one complete turn of a dispensing knob causes the dispenser to eject a single pill from a port. The dispensing knob includes a safety mechanism that requires the knob to be pushed inward to engage the auger mechanism. The housing of the device, the toothbrush handle, is constructed so as to be waterproof so that no water is introduced to the pills in the dispenser. The ejection port is sealed so that there is no water introduction through the port. In addition, there is a labelling means provided so that the user can easily track the daily ingestion of the pills.

Abstract: A bicycle seat power adjustment mechanism includes a two-direction activation switch mounted on the handlebars and a power supply mounted on the bike frame or under the seat. The power supply would typically be a battery pack, and may be used in conjunction with a generator powered by the motion of the bicycle. An electric motor drives a bevel gear combination that causes an interior drive shaft to rotate. The drive shaft is contained within the seat mounting post and a receiving member of the bike frame. The drive shaft is threaded so that, depending upon the direction of rotation, the drive shaft is moved up and down within a seat post receiving member of the bicycle frame. The direction of rotation is controlled by the activation switch. A rotation inhibition mechanism is provided so that the seat does not tend to rotate when the device is activated.