Abstract: A semiconductor package is tested while being inserted into a test socket installed at a test board. The test socket includes a base accommodating a semiconductor package and a contact sheet where a plurality of contact terminals are formed. The contact sheet is fixed to the base through an insert slot formed at one side of the base. The base includes an adaptor installed at a socket body fixed to a test board and fixing a contact sheet. The insert slot is formed between the top of the socket body and the bottom of the adaptor. The contact sheet has a plurality of fix holes. A plurality of stoppers are formed at a bottom surface of the adaptor and inserted into the fix holes, respectively. The adaptor exhibits the shape of a quadrangular ring. An inclined surface is formed at an inner wall of the adaptor to guide a position of the semiconductor package.

Abstract: A test kit for a semiconductor package and a method of testing a semiconductor package using the same are provided. The test kit may include a pick-and-place tool for loading/unloading a semiconductor package, a head assembly for guiding a semiconductor package released from the pick-and-place tool, and a socket for receiving the semiconductor package from the pick-and-place tool. The method may include performing pre-alignment by inserting one or more slide posts of an alignment tool into a socket, releasing a semiconductor package through a package guider, and attaching the semiconductor package onto a socket.