Patents by Inventor Kuma Hsiung

Kuma Hsiung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods for chemical mechanical polishing (CMP) processing with ozone
    Patent number: 10002771
    Abstract: A polymer layer on a substrate may be treated with ozone gas or with deionized water and ozone gas to increase a removal rate of the polymer layer in a chemical mechanical polishing (CMP) process. The ozone gas may be diffused directly into the polymer layer or through a thin layer of deionized water on the surface of the polymer layer and into the polymer layer. The deionized water may also be heated during the process to further enhance the diffusion of the ozone gas into the polymer layer.
    Type: Grant
    Filed: October 10, 2017
    Date of Patent: June 19, 2018
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Prayudi Lianto, Kuma Hsiung, Eric J. Bergman, John L. Klocke, Mohamed Rafi, Muhammad Azim, Guan Huei See, Arvind Sundarrajan