Abstract: An integrated circuit package may be formed having at least one heat dissipation structure within the integrated circuit package itself. In one embodiment, the integrated circuit package may include a substrate; at least one integrated circuit device, wherein the at least one integrated circuit device is electrically attached to the substrate; a mold material on the substrate and adjacent to the at least one integrated circuit device; and at least one heat dissipation structure contacting the at least one integrated circuit, wherein the at least one heat dissipation structure is embedded either within the mold material or between the mold material and the substrate.

Abstract: The removal of heat from silicon photonic integrated circuit devices is a significant issue in integrated circuit packages. As presented herein, the removal of heat may be facilitated with an optically compatible thermal interface structure on the silicon photonic integrated circuit device. These thermal interface structures may include stack-up designs, comprising an optical isolation structure and a thermal interface material, which reduces light coupling effects, while effectively conducting heat from the silicon photonic integrated circuit device to a heat dissipation device, thereby allowing effective management of the temperature of the silicon photonic integrated circuit device.

Abstract: Embodiments disclosed herein include an electronics package. In an embodiment, the electronics package comprises a package substrate and a die on the package substrate. In an embodiment, a mold layer is positioned over the package substrate. In an embodiment, the electronics package further comprises through-mold interconnects through the mold layer, and a trench that extends at least partially into the mold layer.

Abstract: An integrated circuit package may be formed having at least one heat dissipation structure within the integrated circuit package itself. In one embodiment, the integrated circuit package may include a substrate; at least one integrated circuit device, wherein the at least one integrated circuit device is electrically attached to the substrate; a mold material on the substrate and adjacent to the at least one integrated circuit device; and at least one heat dissipation structure contacting the at least one integrated circuit, wherein the at least one heat dissipation structure is embedded either within the mold material or between the mold material and the substrate.

Abstract: Embodiments disclosed herein include an electronics package. In an embodiment, the electronics package comprises a package substrate and a die on the package substrate. In an embodiment, a mold layer is positioned over the package substrate. In an embodiment, the electronics package further comprises through-mold interconnects through the mold layer, and a trench that extends at least partially into the mold layer.

Abstract: A pick and place machine includes a frame to adjustably mount, in three dimensions, a plurality of vacuum nozzles over a component to be picked according to a first embodiment a multi-head PnP mechanism may be simple and flexible to train for a wide variety of component and package shapes and sizes. Multiple PnP nozzles are staggered independently in three axes. According to a second embodiment, a PnP mechanism uses an array of self-learning nozzles that adapt by adjusting the z height of individual nozzles to the shape of the object to be picked.