Patents by Inventor Kumar Balasubramanian
Kumar Balasubramanian has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11961088Abstract: An embodiment of the present invention is directed to a Temporal CVV2 of CVV, which may be represented as a temporary three digit number generated using unique credentials associated with a card product. According to an embodiment of the present invention, the Temporal CVV2 may be generated for each transaction request or other defined set of transactions based on one or more factors, including time period/limit, usage, fraud/risk considerations. With this solution, a customer may request a new Temporal CVV2 each time a purchase is initiated. This may include online purchases, e-commerce transactions, manual link and provision requests, customer authentication for servicing channels, etc. An embodiment of the present invention seeks to mitigate risk and provide a safer and secure solution for customers while providing flexibility to make various purchases before a new card arrives.Type: GrantFiled: April 21, 2020Date of Patent: April 16, 2024Assignee: JPMORGAN CHASE BANK, N.A.Inventors: Sridhar Aravamudhan, Anishkumar C. Patel, Rajeev Kumar Balasubramanian, Brian P. Dunphe, David Christopher Carey, Jonathan Rosner, Shruti K. Patel, Deepak Joshi
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Patent number: 11924795Abstract: Systems, methods, and devices for wireless communication that support mechanisms for identifying hyper frame number (HFN) desynchronization conditions and/or for triggering HFN resynchronization in a wireless communication system. In aspects, an HFN desynchronization condition is identified based on Ethernet frame validation. For example, aspects of the present disclosure provide mechanisms for validating and Ethernet frame. An HFN desynchronization condition is identified or detected when an Ethernet frame is determined to be corrupt based on the Ethernet frame validation in accordance with aspects herein. In some aspects, such as in Ethernet header compression (EHC) protocol implementations, an HFN desynchronization condition may be identified based on a determination that a deciphered context identification (CID) is not a valid CID (e.g., is not a CID in a set of valid CIDs).Type: GrantFiled: November 30, 2021Date of Patent: March 5, 2024Assignee: QUALCOMM IncorporatedInventors: Sitaramanjaneyulu Kanamarlapudi, Arun Prasanth Balasubramanian, Feilu Liu, Suli Zhao, Vaibhav Kumar, Dan Gilboa Waizman
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Publication number: 20240070926Abstract: Embodiments are generally directed to compression in machine learning and deep learning processing. An embodiment of an apparatus for compression of untyped data includes a graphical processing unit (GPU) including a data compression pipeline, the data compression pipeline including a data port coupled with one or more shader cores, wherein the data port is to allow transfer of untyped data without format conversion, and a 3D compression/decompression unit to provide for compression of untyped data to be stored to a memory subsystem and decompression of untyped data from the memory subsystem.Type: ApplicationFiled: September 13, 2023Publication date: February 29, 2024Applicant: Intel CorporationInventors: Joydeep Ray, Ben Ashbaugh, Prasoonkumar Surti, Pradeep Ramani, Rama Harihara, Jerin C. Justin, Jing Huang, Xiaoming Cui, Timothy B. Costa, Ting Gong, Elmoustapha Ould-ahmed-vall, Kumar Balasubramanian, Anil Thomas, Oguz H. Elibol, Jayaram Bobba, Guozhong Zhuang, Bhavani Subramanian, Gokce Keskin, Chandrasekaran Sakthivel, Rajesh Poornachandran
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Publication number: 20240048621Abstract: A system and method for representing events that occur in a real world deployment is described. A real-world workload including multiple events is identified. Multiple characteristics of the real-world workload are converted into multiple endpoint simulator workloads. Multiple gateway hardware characteristics are converted into a modeling elements for simulated Internet of things (IoT) networks. Further, a simulation is performed for each of the endpoint simulator workloads on each of the simulated IoT networks. Also, statistics are collected about the performance of the simulated IoT networks for the endpoint simulator workloads.Type: ApplicationFiled: October 16, 2023Publication date: February 8, 2024Applicant: Intel CorporationInventors: Jerin C. Justin, Kumar Balasubramanian
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Patent number: 11862419Abstract: A vacuum interrupter has a toroidal portion at one or both ends that achieves higher dielectric levels and hence higher interruption levels.Type: GrantFiled: November 15, 2021Date of Patent: January 2, 2024Assignee: EATON INTELLIGENT POWER LIMITEDInventors: Ganesh Kumar Balasubramanian, Eric Dennis Smith, Louis G. Campbell, Wangpei Li, Xin Zhou
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Patent number: 11815992Abstract: A computing device and method for profiling and diagnostics in an Internet of Things (IoT) system, including matching an observed solution characteristic of the IoT system to an anomaly in an anomaly database.Type: GrantFiled: October 5, 2021Date of Patent: November 14, 2023Assignee: Intel CorporationInventors: Jerin C. Justin, Kumar Balasubramanian, Naveen Manicka
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Patent number: 11798198Abstract: Embodiments are generally directed to compression in machine learning and deep learning processing. An embodiment of an apparatus for compression of untyped data includes a graphical processing unit (GPU) including a data compression pipeline, the data compression pipeline including a data port coupled with one or more shader cores, wherein the data port is to allow transfer of untyped data without format conversion, and a 3D compression/decompression unit to provide for compression of untyped data to be stored to a memory subsystem and decompression of untyped data from the memory subsystem.Type: GrantFiled: January 10, 2023Date of Patent: October 24, 2023Assignee: INTEL CORPORATIONInventors: Joydeep Ray, Ben Ashbaugh, Prasoonkumar Surti, Pradeep Ramani, Rama Harihara, Jerin C. Justin, Jing Huang, Xiaoming Cui, Timothy B. Costa, Ting Gong, Elmoustapha Ould-ahmed-vall, Kumar Balasubramanian, Anil Thomas, Oguz H. Elibol, Jayaram Bobba, Guozhong Zhuang, Bhavani Subramanian, Gokce Keskin, Chandrasekaran Sakthivel, Rajesh Poornachandran
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Patent number: 11742169Abstract: An ultra-fast moving conductor for use with a circuit breaker is provided. The moving conductor includes a hollow outer stem and a removable core. Multiple removable cores are produced for use with the moving conductor for different purposes. The outer stem is produced from annealed copper that must be brazed before the circuit breaker is placed into operation, and a first removable core produced from copper is inserted into the outer stem to provide structural reinforcement to the outer stem during brazing. After brazing is complete, the copper core is removed from the outer stem, and a significantly lighter work hardened aluminum core is inserted into the outer stem. The lightweight aluminum core enables the moving conductor to open the circuit breaker much faster than the copper core would, and the copper core prevents contamination of the brazing furnace that would result from using the aluminum core during brazing.Type: GrantFiled: December 15, 2021Date of Patent: August 29, 2023Assignee: EATON INTELLIGENT POWER LIMITEDInventors: Andrew L. Gottschalk, Robert Michael Slepian, Ganesh Kumar Balasubramanian, Andrew Deutsch
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Publication number: 20230236926Abstract: A computing device and method for profiling and diagnostics in an Internet of Things (IoT) system, including matching an observed solution characteristic of the IoT system to an anomaly in an anomaly database.Type: ApplicationFiled: March 27, 2023Publication date: July 27, 2023Applicant: Intel CorporationInventors: Jerin C. Justin, Kumar Balasubramanian, Naveen Manicka
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Publication number: 20230230289Abstract: Embodiments are generally directed to compression in machine learning and deep learning processing. An embodiment of an apparatus for compression of untyped data includes a graphical processing unit (GPU) including a data compression pipeline, the data compression pipeline including a data port coupled with one or more shader cores, wherein the data port is to allow transfer of untyped data without format conversion, and a 3D compression/decompression unit to provide for compression of untyped data to be stored to a memory subsystem and decompression of untyped data from the memory subsystem.Type: ApplicationFiled: January 10, 2023Publication date: July 20, 2023Applicant: Intel CorporationInventors: Joydeep Ray, Ben Ashbaugh, Prasoonkumar Surti, Pradeep Ramani, Rama Harihara, Jerin C. Justin, Jing Huang, Xiaoming Cui, Timothy B. Costa, Ting Gong, Elmoustapha Ould-ahmed-vall, Kumar Balasubramanian, Anil Thomas, Oguz H. Elibol, Jayaram Bobba, Guozhong Zhuang, Bhavani Subramanian, Gokce Keskin, Chandrasekaran Sakthivel, Rajesh Poornachandran
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Publication number: 20230187157Abstract: An ultra-fast moving conductor for use with a circuit breaker is provided. The moving conductor includes a hollow outer stem and a removable core. Multiple removable cores are produced for use with the moving conductor for different purposes. The outer stem is produced from annealed copper that must be brazed before the circuit breaker is placed into operation, and a first removable core produced from copper is inserted into the outer stem to provide structural reinforcement to the outer stem during brazing. After brazing is complete, the copper core is removed from the outer stem, and a significantly lighter work hardened aluminum core is inserted into the outer stem. The lightweight aluminum core enables the moving conductor to open the circuit breaker much faster than the copper core would, and the copper core prevents contamination of the brazing furnace that would result from using the aluminum core during brazing.Type: ApplicationFiled: December 15, 2021Publication date: June 15, 2023Applicant: EATON INTELLIGENT POWER LIMITEDInventors: Andrew L. Gottschalk, Robert Michael Slepian, Ganesh Kumar Balasubramanian, Andrew Deutsch
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Patent number: 11673298Abstract: A mold for encapsulating an electrical component. The mold includes an encapsulation chamber and an air inlet. The encapsulation chamber is defined by a housing, an open top, and a solid bottom. The housing includes a solid outer wall, a permeable inner wall, and an air chamber between the solid outer wall and the inner wall. The air inlet is configured to introduce a gas into the air chamber. The encapsulation chamber is sized and shaped to receive the electrical component while leaving a gap for the introduction of encapsulant around the electrical component. The encapsulant may be silicone rubber. To remove an encapsulated electrical component, pressurized air may be introduced through the air inlet into the air chamber, passing through the permeable inner wall, separating the outer surface of the encapsulant from the housing, and allowing the combination casting to be removed from the mold.Type: GrantFiled: March 25, 2022Date of Patent: June 13, 2023Assignee: EATON INTELLIGENT POWER LIMITEDInventors: Louis G. Campbell, Ganesh Kumar Balasubramanian
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Publication number: 20230154706Abstract: A vacuum interrupter has a toroidal portion at one or both ends that achieves higher dielectric levels and hence higher interruption levels.Type: ApplicationFiled: November 15, 2021Publication date: May 18, 2023Applicant: EATON INTELLIGENT POWER LIMITEDInventors: Ganesh Kumar Balasubramanian, Eric Dennis Smith, Louis G. Campbell, Wangpei Li, Xin Zhou
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Publication number: 20230110334Abstract: A system and method for representing events that occur in a real world deployment is described. A real-world workload including multiple events is identified. Multiple characteristics of the real-world workload are converted into multiple endpoint simulator workloads. Multiple gateway hardware characteristics are converted into a modeling elements for simulated Internet of things (IoT) networks. Further, a simulation is performed for each of the endpoint simulator workloads on each of the simulated IoT networks. Also, statistics are collected about the performance of the simulated IoT networks for the endpoint simulator workloads.Type: ApplicationFiled: August 15, 2022Publication date: April 13, 2023Inventors: Jerin C. Justin, Kumar Balasubramanian
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Patent number: 11557064Abstract: Embodiments are generally directed to compression in machine learning and deep learning processing. An embodiment of an apparatus for compression of untyped data includes a graphical processing unit (GPU) including a data compression pipeline, the data compression pipeline including a data port coupled with one or more shader cores, wherein the data port is to allow transfer of untyped data without format conversion, and a 3D compression/decompression unit to provide for compression of untyped data to be stored to a memory subsystem and decompression of untyped data from the memory subsystem.Type: GrantFiled: January 23, 2020Date of Patent: January 17, 2023Inventors: Joydeep Ray, Ben Ashbaugh, Prasoonkumar Surti, Pradeep Ramani, Rama Harihara, Jerin C. Justin, Jing Huang, Xiaoming Cui, Timothy B. Costa, Ting Gong, Elmoustapha Ould-ahmed-vall, Kumar Balasubramanian, Anil Thomas, Oguz H. Elibol, Jayaram Bobba, Guozhong Zhuang, Bhavani Subramanian, Gokce Keskin, Chandrasekaran Sakthivel, Rajesh Poornachandran
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Patent number: 11463526Abstract: A system and method for representing events that occur in a real world deployment is described. A real-world workload including multiple events is identified. Multiple characteristics of the real-world workload are converted into multiple endpoint simulator workloads. Multiple gateway hardware characteristics are converted into a modeling elements for simulated Internet of things (IoT) networks. Further, a simulation is performed for each of the endpoint simulator workloads on each of the simulated IoT networks. Also, statistics are collected about the performance of the simulated IoT networks for the endpoint simulator workloads.Type: GrantFiled: June 30, 2017Date of Patent: October 4, 2022Assignee: Intel CorporationInventors: Jerin C. Justin, Kumar Balasubramanian
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Publication number: 20220300265Abstract: A method for integrating applications into a software suite is provided. The method includes: receiving a first code set that corresponds to a first application; obtaining an approval of the first code set; compiling the first code set in order to generate a module that is executable within the software suite; determining at least one target environment within the software suite for deployment of the first application; and deploying the executable module to each of the at least one target environment. An automated testing process and an automated validation process are applicable to deployed modules.Type: ApplicationFiled: March 17, 2021Publication date: September 22, 2022Applicant: JPMorgan Chase Bank, N.A.Inventors: Sreeja P PUROHIT, Rajeev Kumar BALASUBRAMANIAN, Sanjay SOLANKI
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Patent number: 11418434Abstract: Methods, computer readable mediums, and systems for securing network traffic data. The method of securing network traffic data may include obtaining a network traffic data unit, that includes: a payload; forwarding information, that includes: a first forwarding portion; and a second forwarding portion that indicates a network tunnel; encryption type information; and encryption location information; analyzing a first segment of the first forwarding portion to obtain a first forwarding location; modifying the network traffic data unit, based on the encryption type information and the encryption location information, to obtain a modified network traffic data unit; and transmitting the modified network traffic data unit to the first forwarding location.Type: GrantFiled: October 1, 2019Date of Patent: August 16, 2022Assignee: Arista Networks, Inc.Inventors: Dipankar Bhatt Acharya, Hugh W. Holbrook, François Labonté, Sambath Kumar Balasubramanian
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Publication number: 20220212374Abstract: A mold for encapsulating an electrical component. The mold includes an encapsulation chamber and an air inlet. The encapsulation chamber is defined by a housing, an open top, and a solid bottom. The housing includes a solid outer wall, a permeable inner wall, and an air chamber between the solid outer wall and the inner wall. The air inlet is configured to introduce a gas into the air chamber. The encapsulation chamber is sized and shaped to receive the electrical component while leaving a gap for the introduction of encapsulant around the electrical component. The encapsulant may be silicone rubber. To remove an encapsulated electrical component, pressurized air may be introduced through the air inlet into the air chamber, passing through the permeable inner wall, separating the outer surface of the encapsulant from the housing, and allowing the combination casting to be removed from the mold.Type: ApplicationFiled: March 25, 2022Publication date: July 7, 2022Applicant: Eaton Intelligent Power LimitedInventors: Louis G. Campbell, Ganesh Kumar Balasubramanian
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Publication number: 20220197734Abstract: A computing device and method for profiling and diagnostics in an Internet of Things (IoT) system, including matching an observed solution characteristic of the IoT system to an anomaly in an anomaly database.Type: ApplicationFiled: October 5, 2021Publication date: June 23, 2022Inventors: Jerin C. Justin, Kumar Balasubramanian, Naveen Manicka