Abstract: An electronic device may have a display. The display may include an array of pixels formed on a display panel. A system-in-package (SiP) may include a substrate, electronic components mounted on the substrate, and mold material that overlaps and conforms to the electronic components. A portion of the substrate that is not overlapped by the mold material may be bonded to the display panel. The electronic components mounted on the substrate of the SiP may include a timing controller integrated circuit and/or a display driver integrated circuit. A plurality of display driver integrated circuit chiplets may be mounted on the substrate of the SiP. The substrate of the SiP may be electrically connected to the display panel by side-wrapped conductive traces. The substrate of the SiP may have portions with different thicknesses.

Abstract: An electronic device may include a light projector module that generates image light and an optical system that redirects the image light towards an eye box. The light projector module may include multiple display modules and an optical combiner that combines the light from the multiple display modules. The light projector may include multiple system-in-packages. Adjacent display modules and/or system-in-packages may be directly bonded such that the components are orthogonal. Using these direct bonds may conserve space within the light projector module and improve alignment within the light projector module.

Abstract: A radio frequency package includes a baseband processor, a transceiver, and a memory. The baseband processor performs processing for wireless communication functions. Moreover, the transceiver transmits and receives wireless signals based on the processing of the wireless communication functions. Additionally, the memory is associated with the baseband processor and stores instructions for performing the processing. The memory and the baseband processor are disposed on top of the transceiver.

Abstract: Package structures, modules containing such packages and methods of manufacture. are described. In an embodiment, a package includes a plurality of terminal pads, a plurality of passive components bonded to top sides of the plurality of terminal pads, a die bonded to top sides of the plurality of passive components and a molding compound encapsulating at least the plurality of passive components and the die.

Abstract: A radio frequency package includes a baseband processor, a transceiver, and a memory. The baseband processor performs processing for wireless communication functions. Moreover, the transceiver transmits and receives wireless signals based on the processing of the wireless communication functions. Additionally, the memory is associated with the baseband processor and stores instructions for performing the processing. The memory and the baseband processor are disposed on top of the transceiver.

Abstract: Electronic packages and methods of formation are described. In an embodiment, an electronic package includes one or more electronic components encapsulated in a step molded molding compound layer, and wiring layer spanning a lower step surface, sidewall, and top surface of the step molded molding compound layer. The wiring layer may further extend into a via opening extending through the lower step surface of the molding compound layer.

Abstract: Package structures, modules containing such packages and methods of manufacture. are described. In an embodiment, a package includes a plurality of terminal pads, a plurality of passive components bonded to top sides of the plurality of terminal pads, a die bonded to top sides of the plurality of passive components and a molding compound encapsulating at least the plurality of passive components and the die.

Abstract: A radio frequency package includes a baseband processor, a transceiver, and a memory. The baseband processor performs processing for wireless communication functions. Moreover, the transceiver transmits and receives wireless signals based on the processing of the wireless communication functions. Additionally, the memory is associated with the baseband processor and stores instructions for performing the processing. The memory and the baseband processor are disposed on top of the transceiver.

Abstract: Package structures, modules containing such packages and methods of manufacture. are described. In an embodiment, a package includes a plurality of terminal pads, a plurality of passive components bonded to top sides of the plurality of terminal pads, a die bonded to top sides of the plurality of passive components and a molding compound encapsulating at least the plurality of passive components and the die.

Abstract: An optical package containing optical sensor/detector pairs co-housed with a non-optical sensor and processes for fabricating the optical package are described herein. Traditional package structures require the use of clear mold compounds to protect the sensitive dies, but such compounds degrade with time and temperature. The optical package described herein uses a special glass top cover that is transparent in the entire electro-magnetic spectral region required by the contained dies.

Abstract: An optical package containing optical sensor/detector pairs co-housed with a non-optical sensor and processes for fabricating the optical package are described herein. Traditional package structures require the use of clear mold compounds to protect the sensitive dies, but such compounds degrade with time and temperature. The optical package described herein uses a special glass top cover that is transparent in the entire electro-magnetic spectral region required by the contained dies.

Abstract: An optical sensor is described that includes a light emitter and a photodetector assembly directly attached to a transparent substrate. In one or more implementations, the optical sensor comprises at least one light emitter and a photodetector assembly (e.g., photodiodes, phototransistors, etc.). The light emitter(s) and the photodetector assembly are directly mounted (e.g., attached) to a transparent substrate.

Abstract: Embedded die packages are described that employ one or more substrate redistribution layers (RDL) to route electrode nodes and/or for current redistribution. In one or more implementations, an integrated circuit die is embedded in a copper core substrate. A substrate RDL contacts a surface of the embedded die, with at least one via (e.g., thermal via) in contact with the surface RDL to furnish electrical interconnection between the embedded die and an external contact. Additional substrate RDL or WLP RDL can be incorporated into the package to provide varying current distribution between the embedded die and external contacts.

Abstract: A semiconductor package device, electronic device, and fabrication methods are described that include at least one sacrificial contact pad as a portion of the semiconductor package device for preventing and reducing stress on the semiconductor package device and increasing board level reliability. In implementations, the semiconductor package device includes a lead frame substrate including at least one lead frame contact pad and at least one sacrificial contact pad, an integrated circuit device electrically coupled to the lead frame substrate, and an encapsulation layer that encapsulates the lead frame substrate and the integrated circuit device.

Abstract: A wafer level optical device, system, and method are described that include a substrate, an electronic device disposed on the substrate, an illumination source disposed on the electronic device, an enclosure disposed on the substrate, where the enclosure includes at least one optical surface and covers the electronic device and the illumination source, and at least one solder ball disposed on a side of the substrate distal from the electronic device. In implementations, a process for using the wafer level optical device and lens-integrated package system that employ the techniques of the present disclosure includes receiving a substrate, placing an electronic device on the substrate, placing an illumination source on the electronic device, and placing an enclosure on the substrate, where the enclosure covers the electronic device and the illumination source, and the enclosure and a wall structure form a first compartment and a second compartment.

Abstract: A temperature sensing device and method for fabrication of the temperature sensing device are described that include a second temperature sensor disposed on and/or in the lid assembly. In an implementation, the temperature sensing device includes a substrate, a ceramic structure disposed on the substrate, a thermopile disposed on the substrate, a first temperature sensor disposed on the substrate, and a lid assembly disposed on the ceramic structure, where the lid assembly includes a base layer, a first filter layer disposed on a first side of the base layer, a first metal layer disposed on a second side of the base layer, a passivation layer disposed on the first metal layer, where the passivation layer includes at least one of a second metal layer, a via, a metal plate, or an epoxy ring, and a second temperature sensor disposed on and/or in the passivation layer.

Abstract: An optical sensor device, system, and method are described that include a substrate, an electronic device disposed on the substrate, a molding layer, a lens, and a light-emitting diode (LED) package disposed on the substrate and at least partially over the sensor and molding layer. The LED package can include an LED substrate, an LED, a lens disposed on the LED, and electrical interconnections for coupling the LED to the substrate. In implementations, a process for fabricating the optical sensor device includes backgrinding a sensor die to a slim profile; attaching the sensor die onto a substrate; placing a molding layer on the sensor die; forming a lens on the molding layer; and placing an assembled light-emitting diode package on the substrate and at least partially over the sensor die and molding layer, where the assembled light-emitting diode package includes a 3D substrate.

Abstract: An optical sensor is described that includes a light emitter and a photodetector assembly directly attached to a transparent substrate. In one or more implementations, the optical sensor comprises at least one light emitter and a photodetector assembly (e.g., photodiodes, phototransistors, etc.). The light emitter(s) and the photodetector assembly are directly mounted (e.g., attached) to a transparent substrate.

Abstract: Embedded die packages are described that employ one or more substrate redistribution layers (RDL) to route electrode nodes and/or for current redistribution. In one or more implementations, an integrated circuit die is embedded in a copper core substrate. A substrate RDL contacts a surface of the embedded die, with at least one via (e.g., thermal via) in contact with the surface RDL to furnish electrical interconnection between the embedded die and an external contact. Additional substrate RDL or WLP RDL can be incorporated into the package to provide varying current distribution between the embedded die and external contacts.

Abstract: A wafer level optical device, system, and method are described that include a substrate, an electronic device disposed on the substrate, an illumination source disposed on the electronic device, an enclosure disposed on the substrate, where the enclosure includes at least one optical surface and covers the electronic device and the illumination source, and at least one solder ball disposed on a side of the substrate distal from the electronic device. In implementations, a process for using the wafer level optical device and lens-integrated package system that employ the techniques of the present disclosure includes receiving a substrate, placing an electronic device on the substrate, placing an illumination source on the electronic device, and placing an enclosure on the substrate, where the enclosure covers the electronic device and the illumination source, and the enclosure and a wall structure form a first compartment and a second compartment.