Abstract: A cutting insert is described. It has a cutting insert body with a central mounting section and at least one cutting edge. The cutting edge is wave-shaped and generally descending from an end section of the cutting edge towards a middle section of the cutting edge. Furthermore, a chip guiding recess extends substantially along the at least one cutting edge and is arranged between the cutting edge and the central mounting section. A chip breaker element is arranged in the chip guiding recess. The chip breaker element comprises a first portion having a first width and a second portion having a second width, wherein a transition between the first portion and the second portion is formed as a step.

Abstract: A radio frequency package includes a baseband processor, a transceiver, and a memory. The baseband processor performs processing for wireless communication functions. Moreover, the transceiver transmits and receives wireless signals based on the processing of the wireless communication functions. Additionally, the memory is associated with the baseband processor and stores instructions for performing the processing. The memory and the baseband processor are disposed on top of the transceiver.

Abstract: Package structures, modules containing such packages and methods of manufacture. are described. In an embodiment, a package includes a plurality of terminal pads, a plurality of passive components bonded to top sides of the plurality of terminal pads, a die bonded to top sides of the plurality of passive components and a molding compound encapsulating at least the plurality of passive components and the die.

Abstract: Implementations of the disclosed subject matter provide a process for upgrading refinery residue feedstock. Step a) may include introducing the refinery residue feedstock into a fluidized bed reactor as a solid. In step b), the refinery residue feedstock may be heated to a devolatilizing and thermal cracking temperature in the fluidized bed reactor to produce a product stream comprising gaseous hydrocarbons and solid coke. The gaseous hydrocarbons may be subjected to catalytic hydroprocessing, in step c), in the presence of molecular hydrogen to increase the hydrogen to carbon ratio and lower the average molecular weight of the gaseous hydrocarbons. In step d), the gaseous hydrocarbons may be separated from the solid coke. In step e), the gaseous hydrocarbons from step d) may be subjected to further processing to produce at least one of: C1-C3 hydrocarbons, liquefied petroleum gas, naphtha range hydrocarbons, and middle distillate range hydrocarbons.

Abstract: A cutting insert is described. It has a cutting insert body with a central mounting section and at least one cutting edge. The cutting edge is wave-shaped and generally descending from an end section of the cutting edge towards a middle section of the cutting edge. Furthermore, a chip guiding recess extends substantially along the at least one cutting edge and is arranged between the cutting edge and the central mounting section. A chip breaker element is arranged in the chip guiding recess. The chip breaker element comprises a first portion having a first width and a second portion having a second width, wherein a transition between the first portion and the second portion is formed as a step.

Abstract: The present invention provides a method for determining real-time location of a vehicle using a mobile device without GPS for the user travelling inside the vehicle. According to the embodiment of the present invention, the location of the vehicle is determined using the locations of the cell-towers to which a mobile phone of a user is connected, and projects these cell tower locations onto the selected route of the user journey to obtain a closest point and thereby determining the user location. The invention also provides the real-time location of the vehicle over internet to users outside the vehicle by crowd-sourcing the cell-tower data of the passengers inside the vehicle.

Abstract: The present invention provides a method for determining real-time location of a vehicle using a mobile device without GPS for the user travelling inside the vehicle. According to the embodiment of the present invention, the location of the vehicle is determined using the locations of the cell-towers to which a mobile phone of a user is connected, and projects these cell tower locations onto the selected route of the user journey to obtain a closest point and thereby determining the user location. The invention also provides the real-time location of the vehicle over internet to users outside the vehicle by crowd-sourcing the cell-tower data of the passengers inside the vehicle.

Abstract: A turning tool holder with a turning tool holder shank and a turning tool holder head is described. In an installed position of the turning tool holder, a longitudinal extension direction of the turning tool holder head is a longitudinal extension direction of the turning tool holder shank which continues straight-ahead, at an angle, or over a radius. The turning tool holder head, seen in its longitudinal extension direction, thereby has two side faces, wherein a lateral coolant outlet is provided on one of the side faces, the lateral coolant outlet center axis of which lateral coolant outlet, in plan view, is predominantly oriented along the longitudinal extension direction of the turning tool holder head. In addition, a turning tool with such a turning tool holder is presented.

Abstract: An optical package containing optical sensor/detector pairs co-housed with a non-optical sensor and processes for fabricating the optical package are described herein. Traditional package structures require the use of clear mold compounds to protect the sensitive dies, but such compounds degrade with time and temperature. The optical package described herein uses a special glass top cover that is transparent in the entire electro-magnetic spectral region required by the contained dies.

Abstract: A turning tool holder with a turning tool holder shank and a turning tool holder head is described. In an installed position of the turning tool holder, a longitudinal extension direction of the turning tool holder head is a longitudinal extension direction of the turning tool holder shank which continues straight-ahead, at an angle, or over a radius. The turning tool holder head, seen in its longitudinal extension direction, thereby has two side faces, wherein a lateral coolant outlet is provided on one of the side faces, the lateral coolant outlet center axis of which lateral coolant outlet, in plan view, is predominantly oriented along the longitudinal extension direction of the turning tool holder head. In addition, a turning tool with such a turning tool holder is presented.

Abstract: An optical package containing optical sensor/detector pairs co-housed with a non-optical sensor and processes for fabricating the optical package are described herein. Traditional package structures require the use of clear mold compounds to protect the sensitive dies, but such compounds degrade with time and temperature. The optical package described herein uses a special glass top cover that is transparent in the entire electro-magnetic spectral region required by the contained dies.

Abstract: A cutting insert includes a body having an upper face, a lower face, a plurality of planar flank faces, bidirectional acute cutting corners and bidirectional obtuse cutting corners joining two adjacent flank faces. A land has a varying width. An annular island includes a plurality of bulged extensions, relatively longer and narrower chip breaking points proximate the acute cutting corners, and relatively shorter and wider chip breaking points proximate the obtuse cutting corners. A chip breaking ramp surface flanks each of the relatively longer and narrower chip breaking points and each of the relatively shorter and wider chip breaking points. The chip breaking ramp surfaces form a series of non-collinear lines that are at a non-zero angle with respect to the cutting edge.

Abstract: An optical sensor is described that includes a light emitter and a photodetector assembly directly attached to a transparent substrate. In one or more implementations, the optical sensor comprises at least one light emitter and a photodetector assembly (e.g., photodiodes, phototransistors, etc.). The light emitter(s) and the photodetector assembly are directly mounted (e.g., attached) to a transparent substrate.

Abstract: Embedded die packages are described that employ one or more substrate redistribution layers (RDL) to route electrode nodes and/or for current redistribution. In one or more implementations, an integrated circuit die is embedded in a copper core substrate. A substrate RDL contacts a surface of the embedded die, with at least one via (e.g., thermal via) in contact with the surface RDL to furnish electrical interconnection between the embedded die and an external contact. Additional substrate RDL or WLP RDL can be incorporated into the package to provide varying current distribution between the embedded die and external contacts.

Abstract: A semiconductor package device, electronic device, and fabrication methods are described that include at least one sacrificial contact pad as a portion of the semiconductor package device for preventing and reducing stress on the semiconductor package device and increasing board level reliability. In implementations, the semiconductor package device includes a lead frame substrate including at least one lead frame contact pad and at least one sacrificial contact pad, an integrated circuit device electrically coupled to the lead frame substrate, and an encapsulation layer that encapsulates the lead frame substrate and the integrated circuit device.

Abstract: A wafer level optical device, system, and method are described that include a substrate, an electronic device disposed on the substrate, an illumination source disposed on the electronic device, an enclosure disposed on the substrate, where the enclosure includes at least one optical surface and covers the electronic device and the illumination source, and at least one solder ball disposed on a side of the substrate distal from the electronic device. In implementations, a process for using the wafer level optical device and lens-integrated package system that employ the techniques of the present disclosure includes receiving a substrate, placing an electronic device on the substrate, placing an illumination source on the electronic device, and placing an enclosure on the substrate, where the enclosure covers the electronic device and the illumination source, and the enclosure and a wall structure form a first compartment and a second compartment.

Abstract: A temperature sensing device and method for fabrication of the temperature sensing device are described that include a second temperature sensor disposed on and/or in the lid assembly. In an implementation, the temperature sensing device includes a substrate, a ceramic structure disposed on the substrate, a thermopile disposed on the substrate, a first temperature sensor disposed on the substrate, and a lid assembly disposed on the ceramic structure, where the lid assembly includes a base layer, a first filter layer disposed on a first side of the base layer, a first metal layer disposed on a second side of the base layer, a passivation layer disposed on the first metal layer, where the passivation layer includes at least one of a second metal layer, a via, a metal plate, or an epoxy ring, and a second temperature sensor disposed on and/or in the passivation layer.

Abstract: A cutting insert includes a body having an upper face, a lower face, a plurality of planar flank faces, bidirectional acute cutting corners and bidirectional obtuse cutting corners joining two adjacent flank faces. A land has a varying width. An annular island includes a plurality of bulged extensions, relatively longer and narrower chip breaking points proximate the acute cutting corners, and relatively shorter and wider chip breaking points proximate the obtuse cutting corners. A chip breaking ramp surface flanks each of the relatively longer and narrower chip breaking points and each of the relatively shorter and wider chip breaking points. The chip breaking ramp surfaces form a series of non-collinear lines that are at a non-zero angle with respect to the cutting edge.

Abstract: An optical sensor device, system, and method are described that include a substrate, an electronic device disposed on the substrate, a molding layer, a lens, and a light-emitting diode (LED) package disposed on the substrate and at least partially over the sensor and molding layer. The LED package can include an LED substrate, an LED, a lens disposed on the LED, and electrical interconnections for coupling the LED to the substrate. In implementations, a process for fabricating the optical sensor device includes backgrinding a sensor die to a slim profile; attaching the sensor die onto a substrate; placing a molding layer on the sensor die; forming a lens on the molding layer; and placing an assembled light-emitting diode package on the substrate and at least partially over the sensor die and molding layer, where the assembled light-emitting diode package includes a 3D substrate.

Abstract: An optical sensor is described that includes a light emitter and a photodetector assembly directly attached to a transparent substrate. In one or more implementations, the optical sensor comprises at least one light emitter and a photodetector assembly (e.g., photodiodes, phototransistors, etc.). The light emitter(s) and the photodetector assembly are directly mounted (e.g., attached) to a transparent substrate.